GR852531B - - Google Patents

Info

Publication number
GR852531B
GR852531B GR852531A GR850102531A GR852531B GR 852531 B GR852531 B GR 852531B GR 852531 A GR852531 A GR 852531A GR 850102531 A GR850102531 A GR 850102531A GR 852531 B GR852531 B GR 852531B
Authority
GR
Greece
Application number
GR852531A
Other languages
Greek (el)
Inventor
Edward William Tokarsky
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27098638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GR852531(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Du Pont filed Critical Du Pont
Publication of GR852531B publication Critical patent/GR852531B/el

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H5/00—Special paper or cardboard not otherwise provided for
    • D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
    • D21H5/14—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only
    • D21H5/141—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only of fibrous cellulose derivatives
    • D21H5/143—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only of fibrous cellulose derivatives grafted or encapsulated cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/253—Cellulosic [e.g., wood, paper, cork, rayon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paper (AREA)
GR852531A 1984-10-19 1985-10-18 GR852531B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66293884A 1984-10-19 1984-10-19
US06/775,577 US4729921A (en) 1984-10-19 1985-09-17 High density para-aramid papers

Publications (1)

Publication Number Publication Date
GR852531B true GR852531B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-02-19

Family

ID=27098638

Family Applications (1)

Application Number Title Priority Date Filing Date
GR852531A GR852531B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1984-10-19 1985-10-18

Country Status (15)

Country Link
US (1) US4729921A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0178943B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS61160500A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR930003396B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU584645B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BR (1) BR8505185A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1261109A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3566917D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK (1) DK478385A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES8700870A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GR (1) GR852531B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
HK (1) HK35489A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IE (1) IE57021B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
PT (1) PT81339B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SG (1) SG10789G (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1298770C (en) * 1987-12-18 1992-04-14 Craig S. Mcewen Low dielectric constant laminate of fluoropolymer and polyaramid
US4895752A (en) * 1987-12-18 1990-01-23 E. I. Du Pont De Nemours And Company Low dielectric constant laminate of fluoropolymer and polyaramid
JP2572426B2 (ja) * 1988-08-09 1997-01-16 帝人株式会社 芳香族ポリアミド繊維紙の製造方法
US4917714A (en) * 1988-12-08 1990-04-17 James River Corporation Filter element comprising glass fibers
US5084136A (en) † 1990-02-28 1992-01-28 E. I. Du Pont De Nemours And Company Dispersible aramid pulp
US5137768A (en) * 1990-07-16 1992-08-11 E. I. Du Pont De Nemours And Company High shear modulus aramid honeycomb
FR2685363B1 (fr) * 1991-12-24 1994-02-04 Rhone Poulenc Fibres Papiers synthetiques a base de fibres, pulpe et liant thermostables et leur procede d'obtention.
US5314742A (en) * 1993-03-31 1994-05-24 E. I. Du Pont De Nemours And Company Resin impregnated laminate for wiring board applications
FI950376A7 (fi) † 1993-05-29 1995-01-27 Voith Gmbh J M Puristin ohuita papereita varten olevaan paperikoneeseen
WO1996029146A1 (en) 1995-03-22 1996-09-26 Minnesota Mining And Manufacturing Company Solid phase extraction membrane
US5789059A (en) * 1995-04-28 1998-08-04 Showa Aircraft Industry Co., Ltd. Honeycomb core
US6030683A (en) * 1996-04-23 2000-02-29 E. I. Du Pont De Nemours And Company Aramid ballistic structure
DE69715960T2 (de) * 1996-05-15 2003-01-30 Matsushita Electric Industrial Co., Ltd. Herstellungsverfahren eines Vliesstoffsubstrats für Leiterplattensubstrat und Herstellungsverfahren eines vorimpregnierten Materials
CN1098392C (zh) * 1997-06-10 2003-01-08 帝人株式会社 耐热纤维片材
US5998309A (en) * 1997-07-17 1999-12-07 E. I. Du Pont De Nemours And Company Molded aramid sheets
US5910231A (en) * 1997-07-22 1999-06-08 E. I. Du Pont De Nemours And Company Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom
JPH11131385A (ja) * 1997-11-05 1999-05-18 Oji Paper Co Ltd 積層板用基材及びその製造法ならびにプリプレグ及び積層板
JP3676111B2 (ja) 1998-06-03 2005-07-27 帝人テクノプロダクツ株式会社 芳香族ポリアミド繊維及びそれを用いた紙
US6159895A (en) * 1998-07-07 2000-12-12 E. I. Du Pont De Nemours And Company Aramid polymer catalyst supports
JP3869559B2 (ja) 1998-09-28 2007-01-17 新神戸電機株式会社 電気絶縁用不織布ならびにプリプレグ及び積層板
DE69908530T2 (de) 1998-10-15 2004-05-06 Teijin Ltd. Synthetisches Papier aus vollaromatischen Polyamidfasern
JP3631385B2 (ja) * 1998-11-18 2005-03-23 王子製紙株式会社 積層板用基材およびその製造方法
CN1078645C (zh) * 1999-01-22 2002-01-30 四川省对外经济贸易总公司 特种合成纤维纸及其生产方法
JP2000239995A (ja) * 1999-02-19 2000-09-05 Matsushita Electric Ind Co Ltd 絶縁基材とプリプレグおよびそれを用いた回路基板
US6258203B1 (en) 1999-09-21 2001-07-10 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and acrylic fibers
JP3321141B2 (ja) * 2000-04-03 2002-09-03 昭和飛行機工業株式会社 アラミドハニカムおよびその製造方法
WO2002012619A1 (en) 2000-08-04 2002-02-14 Teijin Limited Heat-resistant fibrous paper
WO2002025010A1 (fr) * 2000-09-20 2002-03-28 Shin-Kobe Electric Machinery Co., Ltd. Non-tisse pour isolation electrique, preimpregnes et stratifies
US20020142689A1 (en) * 2001-01-23 2002-10-03 Levit Mikhail R. Non-woven sheet of aramid floc
US20040140072A1 (en) * 2002-09-10 2004-07-22 Fibermark, Inc. High temperature paper containing aramid component
AU2003304706A1 (en) 2003-12-31 2005-08-03 E.I. Du Pont De Nemours And Company High temperature microwave susceptor structure
US7470990B2 (en) 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20050230072A1 (en) * 2004-04-16 2005-10-20 Levit Mikhail R Aramid paper blend
US7455750B2 (en) * 2004-06-25 2008-11-25 E.I. Du Pont De Nemours And Company Meta- and para-aramid pulp and processes of making same
US20050287344A1 (en) * 2004-06-25 2005-12-29 Conley Jill A Acrylic and para-aramid pulp and processes of making same
US8084863B2 (en) * 2005-03-23 2011-12-27 Endicott Interconnect Technologies, Inc. Circuitized substrate with continuous thermoplastic support film dielectric layers
US7646098B2 (en) * 2005-03-23 2010-01-12 Endicott Interconnect Technologies, Inc. Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
US7740741B2 (en) * 2005-12-21 2010-06-22 E.I. Du Pont De Nemours And Company Para-aramid pulp including meta-aramid fibrids and processes of making same
US20090126887A1 (en) * 2005-12-21 2009-05-21 E.I. Du Pont De Nemours And Company Pipd Paper and Components Made Therefrom
CN101331271B (zh) * 2005-12-21 2011-08-03 纳幕尔杜邦公司 包含pipd絮凝物的纸及其制造方法
EP1963570A2 (en) * 2005-12-21 2008-09-03 E.I. Du Pont De Nemours And Company Paper comprising pipd pulp and a process for making same
JP2007177113A (ja) * 2005-12-28 2007-07-12 Teijin Techno Products Ltd 有機高分子重合体微粒子およびその製造方法
US7687722B2 (en) * 2006-10-03 2010-03-30 Endicott Interconnect Technologies, Inc. Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US7771811B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
US7815993B2 (en) * 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
JP4261590B2 (ja) * 2007-01-31 2009-04-30 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置
JP4866332B2 (ja) * 2007-03-13 2012-02-01 帝人テクノプロダクツ株式会社 水膨潤性フィブリル化繊維及びそれを用いたシート状物
US8268434B2 (en) * 2007-11-30 2012-09-18 E I Du Pont De Nemours And Company Honeycomb having a high compression strength and articles made from same
US20090214818A1 (en) * 2008-02-26 2009-08-27 E. I. Du Pont De Nemours And Company Core having a high shear strength and articles made from same
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101343845B (zh) * 2008-07-22 2010-09-08 成都龙邦新材料有限公司 一种芳纶纤维蜂窝芯原纸及其制备方法
JP4402734B1 (ja) * 2008-07-30 2010-01-20 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造
US20100122769A1 (en) * 2008-11-14 2010-05-20 E. I. Du Pont De Nemours And Company Processes for Making Sheet Structures having Improved Compression Performance
US8607927B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8607928B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8292027B2 (en) 2009-04-21 2012-10-23 E I Du Pont De Nemours And Company Composite laminate for a thermal and acoustic insulation blanket
US8607926B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US20110281063A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Honeycomb core based on carbon fiber paper and articles made from same
US20110281080A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Folded Core Based on Carbon Fiber Paper and Articles Made from Same
JP5886320B2 (ja) * 2011-01-04 2016-03-16 テイジン・アラミド・ビー．ブイ． 電気絶縁紙
KR101902163B1 (ko) 2011-01-04 2018-10-01 데이진 아라미드 비.브이. 마이크로필라멘트들을 포함하는 종이
CN102154914B (zh) * 2011-02-24 2013-03-20 钟洲 制备芳纶纸的方法及由该方法获得的芳纶纸
US20120216975A1 (en) * 2011-02-25 2012-08-30 Porous Power Technologies, Llc Glass Mat with Synthetic Wood Pulp
CA2868060A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
WO2013158696A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
EP2838723B1 (en) 2012-04-18 2020-09-16 E. I. du Pont de Nemours and Company Multilayered sheet
ES2676035T3 (es) * 2012-11-23 2018-07-16 Teijin Aramid B.V. Papel aislante eléctrico
CN104981343A (zh) 2012-12-03 2015-10-14 纳幕尔杜邦公司 复合材料片材及包含其的货物集装箱
JP6217894B2 (ja) * 2013-02-08 2017-10-25 デュポン帝人アドバンスドペーパー株式会社 着色アラミド紙及びその製造方法
US10457013B2 (en) 2014-05-27 2019-10-29 Dupont Safety & Construction, Inc. Composite sheet and cargo container comprising same
US9976258B2 (en) 2014-10-03 2018-05-22 E I Du Pont De Nemours And Company Honeycomb core having a high compression strength
US10245804B2 (en) 2015-10-16 2019-04-02 Hexcel Corporation Fire retarded aramid fiber-based honeycomb
CN106245411B (zh) * 2016-08-30 2018-02-02 烟台民士达特种纸业股份有限公司 一种间位芳纶纤维纸基材料的生产方法
JP7050780B2 (ja) 2016-11-30 2022-04-08 テイジン・アラミド・ビー．ブイ． 電子的用途での使用に適したアラミド紙
CN107326723B (zh) * 2017-06-22 2019-07-09 陕西科技大学 一种聚芳酰胺纤维纸及其制备方法
CN112204186B (zh) * 2018-05-28 2023-05-05 帝人芳纶有限公司 具有改善性能的芳族聚酰胺纸
CN111472191A (zh) * 2020-04-14 2020-07-31 山东聚芳新材料股份有限公司 一种对位芳纶板及其制备方法
US20220290375A1 (en) 2021-03-09 2022-09-15 Dupont Safety & Construction, Inc. Multilayered fire-resistant sheet

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US3767756A (en) * 1972-06-30 1973-10-23 Du Pont Dry jet wet spinning process
US4035694A (en) * 1974-01-07 1977-07-12 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting
JPS56169846A (en) * 1980-05-26 1981-12-26 Teijin Ltd Paper like article and method
FR2507123A1 (fr) * 1981-06-04 1982-12-10 Arjomari Prioux Semi-produit composite en feuille constitue d'un composant thermoplastique et d'un renfort en polyaramide, son procede de preparation, et les produits finis correspondants obtenus a chaud
FR2546704B1 (fr) * 1983-05-27 1986-04-18 Rhone Poulenc Sa Substrats metallisables pour circuits imprimes et leur procede de preparation
US4472241A (en) * 1983-06-15 1984-09-18 E. I. Du Pont De Nemours And Company Co-refining of aramid fibrids and floc

Also Published As

Publication number Publication date
AU584645B2 (en) 1989-06-01
IE57021B1 (en) 1992-03-11
JPH0565640B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-20
US4729921A (en) 1988-03-08
PT81339B (pt) 1988-02-17
EP0178943A1 (en) 1986-04-23
BR8505185A (pt) 1986-07-29
AU4879885A (en) 1986-04-24
JPS61160500A (ja) 1986-07-21
PT81339A (en) 1985-11-01
KR930003396B1 (ko) 1993-04-26
DK478385D0 (da) 1985-10-18
SG10789G (en) 1989-07-07
KR860003387A (ko) 1986-05-23
EP0178943B1 (en) 1988-12-21
HK35489A (en) 1989-05-05
CA1261109A (en) 1989-09-26
ES8700870A1 (es) 1986-11-16
DE3566917D1 (de) 1989-01-26
DK478385A (da) 1986-04-20
IE852577L (en) 1986-04-19
ES548031A0 (es) 1986-11-16

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