ES8700870A1 - Un papel de para-aramida de gran densidad - Google Patents

Un papel de para-aramida de gran densidad

Info

Publication number
ES8700870A1
ES8700870A1 ES548031A ES548031A ES8700870A1 ES 8700870 A1 ES8700870 A1 ES 8700870A1 ES 548031 A ES548031 A ES 548031A ES 548031 A ES548031 A ES 548031A ES 8700870 A1 ES8700870 A1 ES 8700870A1
Authority
ES
Spain
Prior art keywords
para
aramid
high density
aramid papers
floc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES548031A
Other languages
English (en)
Other versions
ES548031A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27098638&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES8700870(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of ES548031A0 publication Critical patent/ES548031A0/es
Publication of ES8700870A1 publication Critical patent/ES8700870A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H5/00—Special paper or cardboard not otherwise provided for
    • D21H5/12—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials
    • D21H5/14—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only
    • D21H5/141—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only of fibrous cellulose derivatives
    • D21H5/143—Special paper or cardboard not otherwise provided for characterised by the use of special fibrous materials of cellulose fibres only of fibrous cellulose derivatives grafted or encapsulated cellulose
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/253—Cellulosic [e.g., wood, paper, cork, rayon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paper (AREA)

Abstract

METODO DE PREPARACION DE PAPEL DENSO DE PARA-ARAMIDA. COMPRENDE LA PREPARACION DE UNA SUSPENSION ACUOSA DE 0,01 A 3% DE FIBRAS DE PARA-ARAMIDA, ELEGIDAS ENTRE PASTA DE PARA-ARAMIDA, FIBRA CORTADA DE PARA-ARAMIDA, O SUS MEZCLAS; AÑADIR 5 A 15% DE UN LIGANTE POLIMERICO DISPERSABLE, TAL COMO FIBRIDAS DE ARAMIDA; FABRICAR LA HOJA DE PAPEL SIGUIENDO METODOS CONVENCIONALES, SECARLA Y CALANDRARLA EN UNA O VARIAS ETAPAS ENTRE CILINDROS RIGIDOS A UNA TEMPERATURA COMPRENDIDA ENTRE 125º C Y 400JC Y A UNA PRESION ENTRE 89,4 Y 895 KG/CM EN LA LINEA DE CONTACTO DE LOS CILINDROS. ESTE PAPEL TIENE APLICACIONES PARA LA PREPARACION DE SUSTRATOS EMPLEADOS EN LA FABRICACION DE CIRCUITOS ELECTRIC
ES548031A 1984-10-19 1985-10-18 Un papel de para-aramida de gran densidad Expired ES8700870A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66293884A 1984-10-19 1984-10-19
US06/775,577 US4729921A (en) 1984-10-19 1985-09-17 High density para-aramid papers

Publications (2)

Publication Number Publication Date
ES548031A0 ES548031A0 (es) 1986-11-16
ES8700870A1 true ES8700870A1 (es) 1986-11-16

Family

ID=27098638

Family Applications (1)

Application Number Title Priority Date Filing Date
ES548031A Expired ES8700870A1 (es) 1984-10-19 1985-10-18 Un papel de para-aramida de gran densidad

Country Status (15)

Country Link
US (1) US4729921A (es)
EP (1) EP0178943B1 (es)
JP (1) JPS61160500A (es)
KR (1) KR930003396B1 (es)
AU (1) AU584645B2 (es)
BR (1) BR8505185A (es)
CA (1) CA1261109A (es)
DE (1) DE3566917D1 (es)
DK (1) DK478385A (es)
ES (1) ES8700870A1 (es)
GR (1) GR852531B (es)
HK (1) HK35489A (es)
IE (1) IE57021B1 (es)
PT (1) PT81339B (es)
SG (1) SG10789G (es)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4895752A (en) * 1987-12-18 1990-01-23 E. I. Du Pont De Nemours And Company Low dielectric constant laminate of fluoropolymer and polyaramid
CA1298770C (en) * 1987-12-18 1992-04-14 Craig S. Mcewen Low dielectric constant laminate of fluoropolymer and polyaramid
JP2572426B2 (ja) * 1988-08-09 1997-01-16 帝人株式会社 芳香族ポリアミド繊維紙の製造方法
US4917714A (en) * 1988-12-08 1990-04-17 James River Corporation Filter element comprising glass fibers
US5084136A (en) † 1990-02-28 1992-01-28 E. I. Du Pont De Nemours And Company Dispersible aramid pulp
US5137768A (en) * 1990-07-16 1992-08-11 E. I. Du Pont De Nemours And Company High shear modulus aramid honeycomb
FR2685363B1 (fr) * 1991-12-24 1994-02-04 Rhone Poulenc Fibres Papiers synthetiques a base de fibres, pulpe et liant thermostables et leur procede d'obtention.
US5314742A (en) * 1993-03-31 1994-05-24 E. I. Du Pont De Nemours And Company Resin impregnated laminate for wiring board applications
JPH08502104A (ja) † 1993-05-29 1996-03-05 ジェイ．エム．フォイト ジー．エム．ビー．エイチ 薄い紙のための製紙機械のプレス
WO1996029146A1 (en) 1995-03-22 1996-09-26 Minnesota Mining And Manufacturing Company Solid phase extraction membrane
EP0739707B1 (en) * 1995-04-28 2000-06-14 Showa Aircraft Industry Co., Ltd. Honeycomb core
US6030683A (en) * 1996-04-23 2000-02-29 E. I. Du Pont De Nemours And Company Aramid ballistic structure
EP0807703B1 (en) * 1996-05-15 2002-10-02 Matsushita Electric Industrial Co., Ltd A process for making a nonwoven fabric cloth substrate for printed wiring boards, and a process for making a prepreg using the same
KR100398482B1 (ko) * 1997-06-10 2003-09-19 데이진 가부시키가이샤 내열성 섬유지
US5998309A (en) * 1997-07-17 1999-12-07 E. I. Du Pont De Nemours And Company Molded aramid sheets
US5910231A (en) * 1997-07-22 1999-06-08 E. I. Du Pont De Nemours And Company Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom
JPH11131385A (ja) 1997-11-05 1999-05-18 Oji Paper Co Ltd 積層板用基材及びその製造法ならびにプリプレグ及び積層板
JP3676111B2 (ja) 1998-06-03 2005-07-27 帝人テクノプロダクツ株式会社 芳香族ポリアミド繊維及びそれを用いた紙
US6159895A (en) * 1998-07-07 2000-12-12 E. I. Du Pont De Nemours And Company Aramid polymer catalyst supports
JP3869559B2 (ja) * 1998-09-28 2007-01-17 新神戸電機株式会社 電気絶縁用不織布ならびにプリプレグ及び積層板
EP0994215B1 (en) 1998-10-15 2003-06-04 Teijin Limited Wholly aromatic polyamide fiber synthetic paper sheet
JP3631385B2 (ja) * 1998-11-18 2005-03-23 王子製紙株式会社 積層板用基材およびその製造方法
CN1078645C (zh) * 1999-01-22 2002-01-30 四川省对外经济贸易总公司 特种合成纤维纸及其生产方法
JP2000239995A (ja) * 1999-02-19 2000-09-05 Matsushita Electric Ind Co Ltd 絶縁基材とプリプレグおよびそれを用いた回路基板
US6258203B1 (en) 1999-09-21 2001-07-10 Ahlstrom Glassfibre Oy Base webs for printed circuit board production using the foam process and acrylic fibers
JP3321141B2 (ja) * 2000-04-03 2002-09-03 昭和飛行機工業株式会社 アラミドハニカムおよびその製造方法
CN1454273A (zh) 2000-08-04 2003-11-05 帝人株式会社 耐热纤维纸
WO2002025010A1 (fr) * 2000-09-20 2002-03-28 Shin-Kobe Electric Machinery Co., Ltd. Non-tisse pour isolation electrique, preimpregnes et stratifies
US20020142689A1 (en) * 2001-01-23 2002-10-03 Levit Mikhail R. Non-woven sheet of aramid floc
US20040140072A1 (en) * 2002-09-10 2004-07-22 Fibermark, Inc. High temperature paper containing aramid component
AU2003304706A1 (en) 2003-12-31 2005-08-03 E.I. Du Pont De Nemours And Company High temperature microwave susceptor structure
US7470990B2 (en) 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20050230072A1 (en) * 2004-04-16 2005-10-20 Levit Mikhail R Aramid paper blend
US7455750B2 (en) * 2004-06-25 2008-11-25 E.I. Du Pont De Nemours And Company Meta- and para-aramid pulp and processes of making same
US20050287344A1 (en) * 2004-06-25 2005-12-29 Conley Jill A Acrylic and para-aramid pulp and processes of making same
US8084863B2 (en) * 2005-03-23 2011-12-27 Endicott Interconnect Technologies, Inc. Circuitized substrate with continuous thermoplastic support film dielectric layers
US7646098B2 (en) * 2005-03-23 2010-01-12 Endicott Interconnect Technologies, Inc. Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
WO2007076333A2 (en) * 2005-12-21 2007-07-05 E. I. Du Pont De Nemours And Company Paper comprising pipd pulp and a process for making same
US7740741B2 (en) * 2005-12-21 2010-06-22 E.I. Du Pont De Nemours And Company Para-aramid pulp including meta-aramid fibrids and processes of making same
EP1963567B1 (en) * 2005-12-21 2010-10-27 E.I. Du Pont De Nemours And Company Pipd paper and components made therefrom
WO2007076334A2 (en) * 2005-12-21 2007-07-05 E. I. Du Pont De Nemours And Company Paper comprising pipd floc and process for making the same
JP2007177113A (ja) * 2005-12-28 2007-07-12 Teijin Techno Products Ltd 有機高分子重合体微粒子およびその製造方法
US7687722B2 (en) * 2006-10-03 2010-03-30 Endicott Interconnect Technologies, Inc. Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US7771811B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US7815993B2 (en) * 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
JP4261590B2 (ja) * 2007-01-31 2009-04-30 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリエステル積層体、その製造方法及び製造装置
JP4866332B2 (ja) * 2007-03-13 2012-02-01 帝人テクノプロダクツ株式会社 水膨潤性フィブリル化繊維及びそれを用いたシート状物
US8268434B2 (en) * 2007-11-30 2012-09-18 E I Du Pont De Nemours And Company Honeycomb having a high compression strength and articles made from same
US20090214818A1 (en) * 2008-02-26 2009-08-27 E. I. Du Pont De Nemours And Company Core having a high shear strength and articles made from same
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
CN101343845B (zh) * 2008-07-22 2010-09-08 成都龙邦新材料有限公司 一种芳纶纤维蜂窝芯原纸及其制备方法
JP4402734B1 (ja) * 2008-07-30 2010-01-20 株式会社日立エンジニアリング・アンド・サービス 無接着剤アラミド−ポリフェニレンサルファイド積層体の製造方法、回転電機の絶縁部材及び絶縁構造
KR20110089346A (ko) * 2008-11-14 2011-08-05 이 아이 듀폰 디 네모아 앤드 캄파니 개선된 압축 성능을 가진 시트 구조체를 제조하는 방법
US8607926B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8292027B2 (en) 2009-04-21 2012-10-23 E I Du Pont De Nemours And Company Composite laminate for a thermal and acoustic insulation blanket
US8607928B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8607927B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US20110281063A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Honeycomb core based on carbon fiber paper and articles made from same
US20110281080A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Folded Core Based on Carbon Fiber Paper and Articles Made from Same
JP5886320B2 (ja) * 2011-01-04 2016-03-16 テイジン・アラミド・ビー．ブイ． 電気絶縁紙
JP5886319B2 (ja) 2011-01-04 2016-03-16 テイジン・アラミド・ビー．ブイ． マイクロフィラメントを含む紙
CN102154914B (zh) * 2011-02-24 2013-03-20 钟洲 制备芳纶纸的方法及由该方法获得的芳纶纸
US20120216975A1 (en) * 2011-02-25 2012-08-30 Porous Power Technologies, Llc Glass Mat with Synthetic Wood Pulp
WO2013158696A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
WO2013158700A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
BR112014025943A2 (pt) 2012-04-18 2017-10-24 Du Pont folha em camadas
KR102161429B1 (ko) * 2012-11-23 2020-10-07 데이진 아라미드 비.브이. 전기절연지
WO2014088742A1 (en) 2012-12-03 2014-06-12 E. I. Du Pont De Nemours And Company Composite sheet and cargo container comprising same
JP6217894B2 (ja) * 2013-02-08 2017-10-25 デュポン帝人アドバンスドペーパー株式会社 着色アラミド紙及びその製造方法
US10457013B2 (en) 2014-05-27 2019-10-29 Dupont Safety & Construction, Inc. Composite sheet and cargo container comprising same
US9976258B2 (en) 2014-10-03 2018-05-22 E I Du Pont De Nemours And Company Honeycomb core having a high compression strength
US10245804B2 (en) 2015-10-16 2019-04-02 Hexcel Corporation Fire retarded aramid fiber-based honeycomb
CN106245411B (zh) * 2016-08-30 2018-02-02 烟台民士达特种纸业股份有限公司 一种间位芳纶纤维纸基材料的生产方法
KR102477320B1 (ko) 2016-11-30 2022-12-15 데이진 아라미드 비.브이. 전자 적용 용도에 적합한 아라미드 페이퍼
CN107326723B (zh) * 2017-06-22 2019-07-09 陕西科技大学 一种聚芳酰胺纤维纸及其制备方法
CN112204186B (zh) * 2018-05-28 2023-05-05 帝人芳纶有限公司 具有改善性能的芳族聚酰胺纸
CN111472191A (zh) * 2020-04-14 2020-07-31 山东聚芳新材料股份有限公司 一种对位芳纶板及其制备方法
US20220290375A1 (en) 2021-03-09 2022-09-15 Dupont Safety & Construction, Inc. Multilayered fire-resistant sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756908A (en) * 1971-02-26 1973-09-04 Du Pont Synthetic paper structures of aromatic polyamides
US3869429A (en) * 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
US3767756A (en) * 1972-06-30 1973-10-23 Du Pont Dry jet wet spinning process
US4035694A (en) * 1974-01-07 1977-07-12 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting
JPS56169846A (en) * 1980-05-26 1981-12-26 Teijin Ltd Paper like article and method
FR2507123A1 (fr) * 1981-06-04 1982-12-10 Arjomari Prioux Semi-produit composite en feuille constitue d'un composant thermoplastique et d'un renfort en polyaramide, son procede de preparation, et les produits finis correspondants obtenus a chaud
FR2546704B1 (fr) * 1983-05-27 1986-04-18 Rhone Poulenc Sa Substrats metallisables pour circuits imprimes et leur procede de preparation
US4472241A (en) * 1983-06-15 1984-09-18 E. I. Du Pont De Nemours And Company Co-refining of aramid fibrids and floc

Also Published As

Publication number Publication date
EP0178943B1 (en) 1988-12-21
EP0178943A1 (en) 1986-04-23
JPH0565640B2 (es) 1993-09-20
HK35489A (en) 1989-05-05
KR860003387A (ko) 1986-05-23
AU584645B2 (en) 1989-06-01
CA1261109A (en) 1989-09-26
US4729921A (en) 1988-03-08
DE3566917D1 (de) 1989-01-26
DK478385A (da) 1986-04-20
IE852577L (en) 1986-04-19
ES548031A0 (es) 1986-11-16
JPS61160500A (ja) 1986-07-21
SG10789G (en) 1989-07-07
PT81339B (pt) 1988-02-17
PT81339A (en) 1985-11-01
DK478385D0 (da) 1985-10-18
AU4879885A (en) 1986-04-24
BR8505185A (pt) 1986-07-29
KR930003396B1 (ko) 1993-04-26
GR852531B (es) 1986-02-19
IE57021B1 (en) 1992-03-11

Similar Documents

Publication Publication Date Title
ES8700870A1 (es) Un papel de para-aramida de gran densidad
EP0088191A3 (en) Polyester fibrefill blend
ES471449A1 (es) Procedimiento de fabricacion de un material a base de fibrasminerales,excepto amianto
AU546999B2 (en) Adding binder to paper making stock
GB8311682D0 (en) Producing uniform fibrous web
ES266695U (es) Compresa higienica.
GB8616485D0 (en) Combining fibre web
GB8516703D0 (en) Making fibrous web
GB2151668B (en) Carding to produce even fibrous web formation
GB8410126D0 (en) Making fibrous webs
DE3462808D1 (en) Paper sizing composition
GB2151667B (en) Producing fibrous web
IL88987A (en) Sizing compositions for carbon fibers
EP0459951A3 (en) Char forming nonhalogenated flame retardant epoxy composition
AU536648B2 (en) Paper + board machine felts
IL70844A0 (en) Formaldehyde binder,its manufacture and its use for preparing boards from lignocellulosic material
EP0216497A3 (en) Use of fibrous mat-faced gypsum board in shaft wall assemblies and improved fire-resistant board
NZ183271A (en) Sized paper and paper board;sizing composition
AU574795B2 (en) Polymeric binders for fibrous sheets
GB8729895D0 (en) Press for pressing materials such as fibrous materials into board
GB2069560B (en) Producing cellulosic pulp by thermomechanical pulping
GB8413922D0 (en) Paper with watermark effect
GB2037837B (en) Composite fibrous boards
AU562765B2 (en) Composite paper board
JPS5292268A (en) Preparation of inorganic fiber boards

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970519