GR3002753T3 - Heat sink for an electronic component - Google Patents
Heat sink for an electronic componentInfo
- Publication number
- GR3002753T3 GR3002753T3 GR91401362T GR910401362T GR3002753T3 GR 3002753 T3 GR3002753 T3 GR 3002753T3 GR 91401362 T GR91401362 T GR 91401362T GR 910401362 T GR910401362 T GR 910401362T GR 3002753 T3 GR3002753 T3 GR 3002753T3
- Authority
- GR
- Greece
- Prior art keywords
- heat sink
- pillar
- pillars
- attached
- electronic component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB868601746A GB8601746D0 (en) | 1986-01-24 | 1986-01-24 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
GR3002753T3 true GR3002753T3 (en) | 1993-01-25 |
Family
ID=10591890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GR91401362T GR3002753T3 (en) | 1986-01-24 | 1991-09-19 | Heat sink for an electronic component |
Country Status (8)
Country | Link |
---|---|
US (1) | US4802532A (el) |
EP (1) | EP0232098B1 (el) |
AT (1) | ATE66096T1 (el) |
CA (1) | CA1266332A (el) |
DE (1) | DE3771883D1 (el) |
ES (1) | ES2025643T3 (el) |
GB (1) | GB8601746D0 (el) |
GR (1) | GR3002753T3 (el) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3808619A1 (de) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Anordnung zum loesbaren befestigen von module auf einem modultraeger |
US5177502A (en) * | 1988-03-15 | 1993-01-05 | Siemens Aktiengesellschaft | Arrangement for detachably fastening modules to a module carrier |
FR2639764B1 (fr) * | 1988-11-25 | 1994-06-10 | Nec Corp | Structure pour refroidir des composants generateurs de chaleur |
US5355280A (en) * | 1989-09-27 | 1994-10-11 | Robert Bosch Gmbh | Connection arrangement with PC board |
DE3932213A1 (de) * | 1989-09-27 | 1991-04-04 | Bosch Gmbh Robert | Verbundanordnung mit leiterplatte |
US5214844A (en) * | 1990-12-17 | 1993-06-01 | Nchip, Inc. | Method of assembling integrated circuits to a silicon board |
US5159534A (en) * | 1991-01-22 | 1992-10-27 | Johnson Service Company | Electronic/electromechanical packaging arrangement for facility management system |
JPH0521670A (ja) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | ヒートシンク、ヒートシンクの製造方法および製造装置 |
US5172755A (en) * | 1992-04-01 | 1992-12-22 | Digital Equipment Corporation | Arcuate profiled heatsink apparatus and method |
DE4218419C2 (de) * | 1992-06-04 | 2001-10-11 | Philips Corp Intellectual Pty | Leiterplatte mit einem plattenförmigen Metallkern |
US5265321A (en) * | 1992-09-22 | 1993-11-30 | Microelectronics And Computer Technology Corporation | Integrated circuit structure with heat exchanger elements secured thereto and method of making |
US5353192A (en) * | 1993-02-08 | 1994-10-04 | At&T Bell Laboratories | Circuit card assembly |
US5444602A (en) * | 1994-02-25 | 1995-08-22 | Intel Corporation | An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame |
KR19980701642A (ko) * | 1995-01-25 | 1998-06-25 | 씨. 더블유. 준킨 | 인쇄회로기판 및 흡열 장치 |
US5646826A (en) * | 1995-01-26 | 1997-07-08 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
SG59997A1 (en) * | 1995-06-07 | 1999-02-22 | Ibm | Apparatus and process for improved die adhesion to organic chip carries |
US6232866B1 (en) | 1995-09-20 | 2001-05-15 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Composite material switches |
US5915463A (en) * | 1996-03-23 | 1999-06-29 | Motorola, Inc. | Heat dissipation apparatus and method |
DE19625755A1 (de) * | 1996-06-27 | 1998-01-02 | Bosch Gmbh Robert | Verbindungselement |
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6065529A (en) * | 1997-01-10 | 2000-05-23 | Trw Inc. | Embedded heat pipe structure |
US6257327B1 (en) * | 1997-08-15 | 2001-07-10 | Intel Corporation | Heat sink including pedestal |
DE19746988A1 (de) * | 1997-10-24 | 1999-05-06 | Leybold Ag | Zerstäuberkathode |
US5917703A (en) * | 1998-04-17 | 1999-06-29 | Advanced Interconnections Corporation | Integrated circuit intercoupling component with heat sink |
US6304451B1 (en) * | 1999-12-01 | 2001-10-16 | Tyco Electronics Logistics Ag | Reverse mount heat sink assembly |
DE10114572A1 (de) * | 2001-03-24 | 2002-11-07 | Marquardt Gmbh | Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter |
GB0121375D0 (en) * | 2001-09-04 | 2001-10-24 | Ashe Morris Ltd | Temperature control systems |
DE10214311A1 (de) * | 2002-03-28 | 2003-10-09 | Marconi Comm Gmbh | Kühlanordnung für ein elektronisches Bauelement |
US20040246682A1 (en) * | 2003-06-09 | 2004-12-09 | Sumitomo Metal (Smi) Eectronics Devices Inc. | Apparatus and package for high frequency usages and their manufacturing method |
TWI260197B (en) * | 2005-03-22 | 2006-08-11 | Via Tech Inc | Heat radiation fixed column |
TWI292089B (en) * | 2006-04-24 | 2008-01-01 | Quanta Comp Inc | Dissipation module |
US8081475B1 (en) * | 2009-05-29 | 2011-12-20 | Brunswick Corporation | Heat sinking assembly and method for power electronics in a trolling motor controller head |
US8023267B2 (en) * | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
US8059409B2 (en) * | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
DE102011081687A1 (de) * | 2011-08-26 | 2013-02-28 | Robert Bosch Gmbh | Halbleiterbauelement mit einem Kühlkörper |
US8929077B2 (en) | 2012-01-02 | 2015-01-06 | Tem Products Inc. | Thermal connector |
US9995638B2 (en) * | 2015-04-30 | 2018-06-12 | National Instruments Corporation | Cold-junction-compensated input terminal of a thermocouple instrument |
TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
KR20170056391A (ko) * | 2015-11-13 | 2017-05-23 | 삼성전기주식회사 | 프론트 엔드 모듈 |
GB2598343B (en) * | 2020-08-27 | 2022-11-30 | Continental Automotive Romania Srl | Circular heatsink |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1403579A (fr) * | 1963-08-08 | 1965-06-18 | N G K Insulators | Perfectionnement aux semi-conducteurs |
DE1283404B (de) * | 1967-02-16 | 1968-11-21 | Philips Patentverwertung Gmbh | Kuehlkoerperanordnung zur Kontaktkuehlung fuer elektrische Entladungsroehren |
US3435891A (en) * | 1967-03-23 | 1969-04-01 | Int Rectifier Corp | Air flow baffle for rectifier heat exchanger |
US4046442A (en) * | 1975-05-07 | 1977-09-06 | Burroughs Corporation | Pluggable semiconductor device package |
US4293175A (en) * | 1978-06-08 | 1981-10-06 | Cutchaw John M | Connector for integrated circuit packages |
EP0054069A1 (en) * | 1980-06-19 | 1982-06-23 | Digital Equipment Corporation | Heat pin integrated circuit packaging |
EP0130279B1 (en) * | 1983-03-25 | 1989-03-08 | Mitsubishi Denki Kabushiki Kaisha | Heat radiator assembly for cooling electronic parts |
US4607685A (en) * | 1984-07-06 | 1986-08-26 | Burroughs Corporation | Heat sink for integrated circuit package |
US4628990A (en) * | 1984-08-17 | 1986-12-16 | Nec Corporation | Cooling equipment for an integrated circuit chip |
-
1986
- 1986-01-24 GB GB868601746A patent/GB8601746D0/en active Pending
-
1987
- 1987-01-23 US US07/027,321 patent/US4802532A/en not_active Expired - Fee Related
- 1987-01-23 DE DE8787300615T patent/DE3771883D1/de not_active Expired - Fee Related
- 1987-01-23 EP EP87300615A patent/EP0232098B1/en not_active Expired
- 1987-01-23 ES ES198787300615T patent/ES2025643T3/es not_active Expired - Lifetime
- 1987-01-23 CA CA000528096A patent/CA1266332A/en not_active Expired - Fee Related
- 1987-01-23 AT AT87300615T patent/ATE66096T1/de active
-
1991
- 1991-09-19 GR GR91401362T patent/GR3002753T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
DE3771883D1 (de) | 1991-09-12 |
US4802532A (en) | 1989-02-07 |
GB8601746D0 (en) | 1986-02-26 |
ES2025643T3 (es) | 1992-04-01 |
CA1266332A (en) | 1990-02-27 |
ATE66096T1 (de) | 1991-08-15 |
EP0232098A1 (en) | 1987-08-12 |
EP0232098B1 (en) | 1991-08-07 |
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