GB2598343B - Circular heatsink - Google Patents

Circular heatsink Download PDF

Info

Publication number
GB2598343B
GB2598343B GB2013435.9A GB202013435A GB2598343B GB 2598343 B GB2598343 B GB 2598343B GB 202013435 A GB202013435 A GB 202013435A GB 2598343 B GB2598343 B GB 2598343B
Authority
GB
United Kingdom
Prior art keywords
circular heatsink
heatsink
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2013435.9A
Other versions
GB202013435D0 (en
GB2598343A (en
Inventor
Gaidur Mihai
Hrituc Adelina
Stanicel Andrei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Continental Automotive Romania SRL
Original Assignee
Continental Automotive GmbH
Continental Automotive Romania SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH, Continental Automotive Romania SRL filed Critical Continental Automotive GmbH
Priority to GB2013435.9A priority Critical patent/GB2598343B/en
Publication of GB202013435D0 publication Critical patent/GB202013435D0/en
Publication of GB2598343A publication Critical patent/GB2598343A/en
Application granted granted Critical
Publication of GB2598343B publication Critical patent/GB2598343B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
GB2013435.9A 2020-08-27 2020-08-27 Circular heatsink Active GB2598343B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2013435.9A GB2598343B (en) 2020-08-27 2020-08-27 Circular heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2013435.9A GB2598343B (en) 2020-08-27 2020-08-27 Circular heatsink

Publications (3)

Publication Number Publication Date
GB202013435D0 GB202013435D0 (en) 2020-10-14
GB2598343A GB2598343A (en) 2022-03-02
GB2598343B true GB2598343B (en) 2022-11-30

Family

ID=72749713

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2013435.9A Active GB2598343B (en) 2020-08-27 2020-08-27 Circular heatsink

Country Status (1)

Country Link
GB (1) GB2598343B (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB921251A (en) * 1960-03-07 1963-03-20 Pacific Semiconductors Inc Semiconductor mounting
US3229756A (en) * 1964-01-21 1966-01-18 Laszlo Z Keresztury Semiconductor heat sink and/or cooler
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
US4802532A (en) * 1986-01-24 1989-02-07 British Telecommunications Public Limited Company Heat sink
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
US6293331B1 (en) * 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US20060215370A1 (en) * 2005-03-22 2006-09-28 Yi-Cheng Kuo Fixed pillar with heat loss
US20090316365A1 (en) * 2008-06-24 2009-12-24 Lgc Wireless, Inc. Heat sink system having thermally conductive rods
US20130170145A1 (en) * 2012-01-02 2013-07-04 Tem Products Inc. Thermal connector

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB921251A (en) * 1960-03-07 1963-03-20 Pacific Semiconductors Inc Semiconductor mounting
US3229756A (en) * 1964-01-21 1966-01-18 Laszlo Z Keresztury Semiconductor heat sink and/or cooler
US4688077A (en) * 1982-03-29 1987-08-18 Fujitsu Limited Semiconductor device having radiator
US4802532A (en) * 1986-01-24 1989-02-07 British Telecommunications Public Limited Company Heat sink
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
US6293331B1 (en) * 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US20060215370A1 (en) * 2005-03-22 2006-09-28 Yi-Cheng Kuo Fixed pillar with heat loss
US20090316365A1 (en) * 2008-06-24 2009-12-24 Lgc Wireless, Inc. Heat sink system having thermally conductive rods
US20130170145A1 (en) * 2012-01-02 2013-07-04 Tem Products Inc. Thermal connector

Also Published As

Publication number Publication date
GB202013435D0 (en) 2020-10-14
GB2598343A (en) 2022-03-02

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