GB988115A - Method of fabricating semiconductor devices - Google Patents

Method of fabricating semiconductor devices

Info

Publication number
GB988115A
GB988115A GB25299/63A GB2529963A GB988115A GB 988115 A GB988115 A GB 988115A GB 25299/63 A GB25299/63 A GB 25299/63A GB 2529963 A GB2529963 A GB 2529963A GB 988115 A GB988115 A GB 988115A
Authority
GB
United Kingdom
Prior art keywords
wafer
photoresist
layer
portions
silicon oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25299/63A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB988115A publication Critical patent/GB988115A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/058—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by depositing on sacrificial masks, e.g. using lift-off
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
GB25299/63A 1962-07-31 1963-06-25 Method of fabricating semiconductor devices Expired GB988115A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21369562A 1962-07-31 1962-07-31

Publications (1)

Publication Number Publication Date
GB988115A true GB988115A (en) 1965-04-07

Family

ID=22796141

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25299/63A Expired GB988115A (en) 1962-07-31 1963-06-25 Method of fabricating semiconductor devices

Country Status (4)

Country Link
BE (1) BE635672A (https=)
DE (1) DE1246127B (https=)
GB (1) GB988115A (https=)
NL (1) NL295980A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0050415A1 (en) * 1980-09-15 1982-04-28 Photon Power Inc. Process for forming a pattern of transparent conductive material
EP0072933A1 (en) * 1981-08-24 1983-03-02 International Business Machines Corporation Method for photolithographic pattern generation in a photoresist layer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386864A (en) * 1963-12-09 1968-06-04 Ibm Semiconductor-metal-semiconductor structure
DE2929739C2 (de) * 1979-07-23 1984-10-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum Entfernen eines Teiles einer Metallschicht von einer Halbleiterscheibe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL107347C (https=) * 1956-02-28
FR77789E (fr) * 1957-08-12 1962-04-20 Int Standard Electric Corp Perfectionnements aux dispositifs semi-conducteurs à jonction et méthode de fabrication de ceux-ci
BE570279A (https=) * 1957-08-12 1900-01-01
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0050415A1 (en) * 1980-09-15 1982-04-28 Photon Power Inc. Process for forming a pattern of transparent conductive material
EP0072933A1 (en) * 1981-08-24 1983-03-02 International Business Machines Corporation Method for photolithographic pattern generation in a photoresist layer

Also Published As

Publication number Publication date
BE635672A (https=)
NL295980A (https=)
DE1246127B (de) 1967-08-03

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