GB9808587D0 - Adhesive and encapsulating material with fluxing properties - Google Patents

Adhesive and encapsulating material with fluxing properties

Info

Publication number
GB9808587D0
GB9808587D0 GBGB9808587.1A GB9808587A GB9808587D0 GB 9808587 D0 GB9808587 D0 GB 9808587D0 GB 9808587 A GB9808587 A GB 9808587A GB 9808587 D0 GB9808587 D0 GB 9808587D0
Authority
GB
United Kingdom
Prior art keywords
adhesive
encapsulating material
fluxing properties
fluxing
properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9808587.1A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GBGB9808587.1A priority Critical patent/GB9808587D0/en
Publication of GB9808587D0 publication Critical patent/GB9808587D0/en
Priority to GBGB9821162.6A priority patent/GB9821162D0/en
Priority to PCT/GB1999/001236 priority patent/WO1999054372A1/en
Priority to JP2000544710A priority patent/JP4879394B2/ja
Priority to AU36179/99A priority patent/AU3617999A/en
Priority to US09/673,992 priority patent/US6971163B1/en
Priority to GB0028470A priority patent/GB2353528A/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GBGB9808587.1A 1998-04-22 1998-04-22 Adhesive and encapsulating material with fluxing properties Ceased GB9808587D0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GBGB9808587.1A GB9808587D0 (en) 1998-04-22 1998-04-22 Adhesive and encapsulating material with fluxing properties
GBGB9821162.6A GB9821162D0 (en) 1998-04-22 1998-09-29 Adhesive and encapsulated material with fluxing properties
PCT/GB1999/001236 WO1999054372A1 (en) 1998-04-22 1999-04-22 Adhesive and encapsulating material with fluxing properties
JP2000544710A JP4879394B2 (ja) 1998-04-22 1999-04-22 フラックス特性を有する接着性封止材料
AU36179/99A AU3617999A (en) 1998-04-22 1999-04-22 Adhesive and encapsulating material with fluxing properties
US09/673,992 US6971163B1 (en) 1998-04-22 1999-04-22 Adhesive and encapsulating material with fluxing properties
GB0028470A GB2353528A (en) 1998-04-22 1999-04-22 Adhesive and encapsulating material with fluxing properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9808587.1A GB9808587D0 (en) 1998-04-22 1998-04-22 Adhesive and encapsulating material with fluxing properties

Publications (1)

Publication Number Publication Date
GB9808587D0 true GB9808587D0 (en) 1998-06-24

Family

ID=10830794

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9808587.1A Ceased GB9808587D0 (en) 1998-04-22 1998-04-22 Adhesive and encapsulating material with fluxing properties
GBGB9821162.6A Ceased GB9821162D0 (en) 1998-04-22 1998-09-29 Adhesive and encapsulated material with fluxing properties

Family Applications After (1)

Application Number Title Priority Date Filing Date
GBGB9821162.6A Ceased GB9821162D0 (en) 1998-04-22 1998-09-29 Adhesive and encapsulated material with fluxing properties

Country Status (2)

Country Link
JP (1) JP4879394B2 (ja)
GB (2) GB9808587D0 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753329B2 (ja) * 2001-02-14 2011-08-24 日東電工株式会社 熱硬化性樹脂組成物および半導体装置
US6624216B2 (en) * 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant
CN104115236B (zh) * 2011-12-13 2017-12-19 道康宁公司 组合物及由其形成的导体
JP5952849B2 (ja) * 2014-03-25 2016-07-13 岡村製油株式会社 フラックス及びソルダペースト
WO2017191801A1 (ja) * 2016-05-06 2017-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187421A (ja) * 1988-08-19 1990-07-23 Haisoole Japan Kk 紫外線感光又は透過素子用の紫外線透過性保護又は支持材料
JPH03208221A (ja) * 1990-01-10 1991-09-11 Toyo Tire & Rubber Co Ltd フイルムコートされた電子部品封止用成形体
JPH0331318A (ja) * 1989-06-28 1991-02-12 Toyo Tire & Rubber Co Ltd エポキシ樹脂組成物
JPH0733429B2 (ja) * 1990-04-04 1995-04-12 東レ株式会社 エポキシ樹脂組成物
JPH0747682B2 (ja) * 1990-05-10 1995-05-24 信越化学工業株式会社 エポキシ樹脂組成物及びその硬化物
JPH06128352A (ja) * 1991-03-13 1994-05-10 Daicel Huels Ltd エポキシ樹脂組成物
JP3186843B2 (ja) * 1992-06-18 2001-07-11 日本曹達株式会社 硬化性樹脂組成物
JP3116577B2 (ja) * 1992-07-17 2000-12-11 東レ株式会社 半導体封止用エポキシ組成物
JP3423073B2 (ja) * 1993-06-29 2003-07-07 三井化学株式会社 フィルム製液晶セル封止用樹脂組成物
JPH07188587A (ja) * 1993-12-27 1995-07-25 Mitsui Toatsu Chem Inc 耐衝撃性粉体塗料組成物
JPH08231894A (ja) * 1994-12-28 1996-09-10 Mitsui Toatsu Chem Inc 粉体塗料組成物
WO1998008362A1 (en) * 1996-08-16 1998-02-26 Craig Hugh P Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
KR19980020726A (ko) * 1996-09-11 1998-06-25 김광호 칩 스케일의 볼 그리드 어레이 패키지 및 그의 제조 방법
AU4342597A (en) * 1996-10-08 1998-05-05 Cytec Technology Corp. Crosslinker compositions and low gloss epoxy coatings therefrom

Also Published As

Publication number Publication date
GB9821162D0 (en) 1998-11-25
JP2002512278A (ja) 2002-04-23
JP4879394B2 (ja) 2012-02-22

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)