JP6246731B2 - 組成物及びそれから形成される導体 - Google Patents
組成物及びそれから形成される導体 Download PDFInfo
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- JP6246731B2 JP6246731B2 JP2014547426A JP2014547426A JP6246731B2 JP 6246731 B2 JP6246731 B2 JP 6246731B2 JP 2014547426 A JP2014547426 A JP 2014547426A JP 2014547426 A JP2014547426 A JP 2014547426A JP 6246731 B2 JP6246731 B2 JP 6246731B2
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Images
Classifications
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- H—ELECTRICITY
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
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- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3608—Titania or titanates
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Description
本出願は、2011年12月13日に出願の米国特許仮出願第61/569,959号の利益を主張するものであり、参照することによりその全体が本明細書に組み込まれる。
本発明は、概して、組成物、より具体的には、組成物及び該組成物から形成される導体に関する。
Claims (12)
- 組成物であって、
金属粉末と、
前記金属粉末の融解温度よりも低い融解温度を有するはんだ粉末と、
エポキシ樹脂を含むポリマーと、
前記金属粉末を溶かし、前記ポリマーを架橋するための前記ポリマーとは異なるカルボキシル化ポリマーと、
前記金属粉末を溶かすためのジカルボン酸と、
前記金属粉末を溶かすためのモノカルボン酸と、
接着促進剤または消泡剤を含み、
前記ジカルボン酸、前記モノカルボン酸、及び前記カルボキシル化ポリマーが有する酸性基の総和とエポキシ基の比が少なくとも3:1である組成物。 - 前記金属粉末が銅を含む、請求項1に記載の組成物。
- 前記はんだ粉末が、300℃を超えない融解温度を有する、請求項1又は2に記載の組成物。
- 前記はんだ粉末が、少なくとも1つの錫(Sn)合金と、0.5重量パーセント(重量%)を超えない
i)水銀、カドミウム、及び/若しくはクロム、並びに/又は
ii)鉛、を含む、請求項1〜3のいずれか一項に記載の組成物。 - i)前記ポリマーが、エポキシ樹脂を含み、及び/又は
ii)前記カルボキシル化ポリマーがアクリルポリマーを含む、請求項1〜4のいずれか一項に記載の組成物。 - i)前記カルボキシル化ポリマーがスチレン−アクリルコポリマーを含む、及び/又は
ii)前記はんだ粉末が、錫−ビスマス(SnBi)合金、錫−銀(SnAg)合金、若しくはこれらの組み合わせのうちの少なくとも1つを含む、及び/又は
iii)前記ジカルボン酸がドデカン二酸(DDDA)である、及び/又は
iv)前記モノカルボン酸がネオデカン酸である、請求項1〜5のいずれか一項に記載の組成物。 - i)溶媒、接着促進剤、若しくはこれらの組み合わせを含む添加剤、
ii)シラン、チタン酸塩、若しくはこれらの組み合わせを含む接着促進剤、又は
iii)i)及びii)の両方、を更に含む、請求項1〜6のいずれか一項に記載の組成物。 - i)前記金属及びはんだ粉末が総じて、前記組成物の全重量に基づいて50〜95重量%の量で存在する、
ii)前記金属粉末が、前記組成物の全重量に基づいて35〜85重量%の量で存在する、及び/又は
iii)前記はんだ粉末が、前記組成物の全重量に基づいて25〜75重量%の任意の量で存在する、請求項1〜7のいずれか一項に記載の組成物。 - i)前記ポリマー及び前記カルボキシル化ポリマーが総じて、前記組成物の全重量に基づいて2.5〜10重量%の量で存在する、
ii)前記ポリマーが、前記組成物の全重量に基づいて0.5〜5重量%の量で存在する、及び/又は
iii)前記カルボキシル化ポリマーが、前記組成物の全重量に基づいて1〜7.5重量%の量で存在する、請求項1〜8のいずれか一項に記載の組成物。 - i)前記ジカルボン酸が、前記組成物の全重量に基づいて0.05〜1重量%の量で存在する、
ii)前記モノカルボン酸が、前記組成物の全重量に基づいて0.25〜1.25重量%の量で存在する、又は
iii)i)及びii)の両方である、請求項1〜9のいずれか一項に記載の組成物。 - 前記ポリマー及び前記カルボキシル化ポリマーが、1:1〜1:3(ポリマー:カルボキシル化ポリマー)の重量比にある、請求項1〜10のいずれか一項に記載の組成物。
- 物品であって、
i)基板と、
ii)電流輸送のために前記i)基板上に配設され、かつこれと電気的に接触する導体と、を備え、前記ii)導体が
金属粉末と、
前記金属粉末の融解温度よりも低い融解温度を有するはんだ粉末と、
エポキシ樹脂を含むポリマーと、
前記金属粉末を溶かし、前記ポリマーを架橋するための前記ポリマーとは異なるカルボキシル化ポリマーと、
前記金属粉末を溶かすためのジカルボン酸と、
前記金属粉末を溶かすためのモノカルボン酸と、
接着促進剤または消泡剤を含み、
前記ジカルボン酸、前記モノカルボン酸、及び前記カルボキシル化ポリマーが有する酸性基の総和とエポキシ基の比が少なくとも3:1である導体から形成される、物品。
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US201161569959P | 2011-12-13 | 2011-12-13 | |
US61/569,959 | 2011-12-13 | ||
PCT/US2012/069503 WO2013090570A1 (en) | 2011-12-13 | 2012-12-13 | Composition and conductor formed therefrom |
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Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130096823A (ko) | 2012-02-23 | 2013-09-02 | 엘지전자 주식회사 | 태양 전지 모듈 |
US10000670B2 (en) | 2012-07-30 | 2018-06-19 | Henkel IP & Holding GmbH | Silver sintering compositions with fluxing or reducing agents for metal adhesion |
KR102132587B1 (ko) | 2012-12-20 | 2020-07-10 | 다우 실리콘즈 코포레이션 | 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스 |
WO2014143627A1 (en) | 2013-03-14 | 2014-09-18 | Dow Corning Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
WO2014150302A1 (en) | 2013-03-14 | 2014-09-25 | Dow Corning Corporation | Conductive silicone materials and uses |
TW201511296A (zh) | 2013-06-20 | 2015-03-16 | Plant PV | 用於矽太陽能電池之核-殼型鎳粒子金屬化層 |
EP3041627A4 (en) * | 2013-09-05 | 2017-05-03 | Henkel IP & Holding GmbH | Metal sintering film compositions |
JP2015130406A (ja) * | 2014-01-07 | 2015-07-16 | 三菱電機株式会社 | 光起電力装置およびその製造方法、光起電力モジュール |
JP6176195B2 (ja) * | 2014-06-30 | 2017-08-09 | 信越化学工業株式会社 | 太陽電池 |
GB2536010A (en) * | 2015-03-03 | 2016-09-07 | Dst Innovation Ltd | Printable functional materials for plastic electronics applications |
JP2016189439A (ja) * | 2015-03-30 | 2016-11-04 | 京セラ株式会社 | 太陽電池素子およびその製造方法 |
CN107709418B (zh) | 2015-05-08 | 2021-04-27 | 汉高知识产权控股有限责任公司 | 可烧结的膜和膏及其使用方法 |
WO2017033666A1 (ja) * | 2015-08-24 | 2017-03-02 | 富士フイルム株式会社 | 導電性フィルムの製造方法、導電性フィルム、および、タッチパネル |
WO2017035103A1 (en) | 2015-08-25 | 2017-03-02 | Plant Pv, Inc | Core-shell, oxidation-resistant particles for low temperature conductive applications |
WO2017035102A1 (en) | 2015-08-26 | 2017-03-02 | Plant Pv, Inc | Silver-bismuth non-contact metallization pastes for silicon solar cells |
US20180325736A1 (en) * | 2015-10-23 | 2018-11-15 | Abominable Labs, Llc | Electrical interconnection system for heating eye-shield |
US10111780B2 (en) | 2015-10-23 | 2018-10-30 | Abominable Labs, Llc | Goggle lens and face gasket engagement system |
US10000645B2 (en) | 2015-11-24 | 2018-06-19 | PLANT PV, Inc. | Methods of forming solar cells with fired multilayer film stacks |
CN106505110A (zh) * | 2016-10-14 | 2017-03-15 | 南昌大学 | Sn‑Bi基钎料用于制作晶硅异质结太阳电池电极 |
CN106563894B (zh) * | 2016-10-20 | 2018-10-30 | 长沙理工大学 | 一种可剥离的焊料掩膜层组合物 |
CN110430951B (zh) * | 2017-03-15 | 2021-11-16 | 昭和电工材料株式会社 | 接合用金属糊料、接合体及其制造方法以及半导体装置及其制造方法 |
KR102499022B1 (ko) * | 2017-03-15 | 2023-02-13 | 쇼와덴코머티리얼즈가부시끼가이샤 | 접합용 금속 페이스트, 접합체 및 그 제조 방법, 그리고 반도체 장치 및 그 제조 방법 |
JP6994644B2 (ja) * | 2017-12-01 | 2022-01-14 | パナソニックIpマネジメント株式会社 | 接合体と接合方法および接合材料 |
JP6540833B1 (ja) * | 2018-01-17 | 2019-07-10 | 千住金属工業株式会社 | フラックス及びソルダペースト |
CN112166653A (zh) * | 2018-03-15 | 2021-01-01 | 以色列商普林特电路板有限公司 | 双组分可印刷导电组合物 |
KR102576589B1 (ko) * | 2018-09-05 | 2023-09-08 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양 전지 및 이를 포함하는 태양 전지 패널 |
TWI690947B (zh) * | 2018-11-30 | 2020-04-11 | 台灣愛司帝科技股份有限公司 | 導電物質的布局方法、布局結構及包含其之led顯示器 |
TW202334367A (zh) * | 2022-02-21 | 2023-09-01 | 日商拓自達電線股份有限公司 | 導電性糊及多層基板 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674326A (en) * | 1994-09-21 | 1997-10-07 | Motorola, Inc. | Solder paste |
US7022266B1 (en) * | 1996-08-16 | 2006-04-04 | Dow Corning Corporation | Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
EP0933010B1 (en) * | 1996-08-16 | 2002-01-23 | Hugh P. Craig | Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
GB9808587D0 (en) * | 1998-04-22 | 1998-06-24 | Craig Hugh P | Adhesive and encapsulating material with fluxing properties |
WO1999054372A1 (en) | 1998-04-22 | 1999-10-28 | Multicore Solders Limited | Adhesive and encapsulating material with fluxing properties |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
US7745013B2 (en) * | 2005-12-30 | 2010-06-29 | Intel Corporation | Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same |
CN101041898A (zh) * | 2006-02-23 | 2007-09-26 | 气体产品与化学公司 | 电子附着辅助的导电体的形成 |
JP5152727B2 (ja) * | 2007-12-21 | 2013-02-27 | ハリマ化成株式会社 | アルミニウムろう付け用ペースト組成物 |
CN101244493B (zh) * | 2008-03-21 | 2010-08-11 | 天津市瑞星高新技术发展公司 | 一种包含助焊剂的铝合金无铅焊丝及其助焊剂的制备方法 |
JP5373464B2 (ja) * | 2008-04-23 | 2013-12-18 | パナソニック株式会社 | 導電性ペーストおよびこれを用いた実装構造体 |
KR101517087B1 (ko) * | 2008-11-21 | 2015-05-04 | 헨켈 아이피 앤드 홀딩 게엠베하 | 열 분해성 중합체 코팅된 금속 분말 |
JP2011023577A (ja) * | 2009-07-16 | 2011-02-03 | Hitachi Chem Co Ltd | 導電性接着剤組成物、これを用いた接続体、太陽電池セルの製造方法及び太陽電池モジュール |
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- 2012-12-13 US US14/364,801 patent/US20140370311A1/en not_active Abandoned
- 2012-12-13 EP EP12808632.9A patent/EP2791946B1/en active Active
- 2012-12-13 CN CN201280069631.8A patent/CN104115236B/zh active Active
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Publication number | Publication date |
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CN104115236A (zh) | 2014-10-22 |
TWI601157B (zh) | 2017-10-01 |
TW201331957A (zh) | 2013-08-01 |
JP2015511888A (ja) | 2015-04-23 |
EP2791946B1 (en) | 2016-09-14 |
EP2791946A1 (en) | 2014-10-22 |
WO2013090570A1 (en) | 2013-06-20 |
US20140370311A1 (en) | 2014-12-18 |
CN104115236B (zh) | 2017-12-19 |
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