GB924864A - Improvements in electrodeposition of nickel - Google Patents

Improvements in electrodeposition of nickel

Info

Publication number
GB924864A
GB924864A GB4520/62A GB452062A GB924864A GB 924864 A GB924864 A GB 924864A GB 4520/62 A GB4520/62 A GB 4520/62A GB 452062 A GB452062 A GB 452062A GB 924864 A GB924864 A GB 924864A
Authority
GB
United Kingdom
Prior art keywords
compounds
feb
nickel plating
substituted
acetylenic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4520/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanson Van Winkle Munning Co
Original Assignee
Hanson Van Winkle Munning Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanson Van Winkle Munning Co filed Critical Hanson Van Winkle Munning Co
Publication of GB924864A publication Critical patent/GB924864A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

924,864. Nickel plating solutions. HANSONVAN WINKLE-MUNNING CO. Feb. 6, 1962 [Feb. 7, 1961], No. 4520/62. Class 41. Nickel plating baths include as a brightening agent, a substituted styrene of general formula in which M is H, Na, NH 4 , Mg, or Ni. Preferably p-vinyl benzene sulphonic acid is used in admixture with other agents which include (1) aliphatio or aromatic sulphonic or sulphinic acids, sulphonamides, or sulphonimides; (2) acetylenic compounds, especially α-substituted compounds; (3) bisulphite addition products of acetylenic compounds; (4) heterocyclic compounds and substitution products, e.g. pyridine N-oxide, 2,2<SP>1</SP>-dipyridyl, nitropyridinium pyrazole chloride, polyamino-azo-benzenes, alkylated quinolinium halides; (5) chloral hydrate, coumarin compounds, aminopolyaryl methanes. Many examples given.
GB4520/62A 1961-02-07 1962-02-06 Improvements in electrodeposition of nickel Expired GB924864A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87551A US3152975A (en) 1961-02-07 1961-02-07 Electrodeposition of nickel

Publications (1)

Publication Number Publication Date
GB924864A true GB924864A (en) 1963-05-01

Family

ID=22205842

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4520/62A Expired GB924864A (en) 1961-02-07 1962-02-06 Improvements in electrodeposition of nickel

Country Status (2)

Country Link
US (1) US3152975A (en)
GB (1) GB924864A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3264200A (en) * 1964-01-16 1966-08-02 Udylite Corp Electrodeposition of nickel
US3401097A (en) * 1964-12-08 1968-09-10 Metalux Corp Electrodeposition of nickel
US3399123A (en) * 1965-06-22 1968-08-27 M & T Chemicals Inc Electrolytes and method for electroplating nickel
US3655532A (en) * 1970-05-06 1972-04-11 Metalux Corp The Method for electroplating nickel
US8388824B2 (en) * 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR955898A (en) * 1945-07-07 1950-01-20
US2466677A (en) * 1945-08-27 1949-04-12 Udylite Corp Electrodeposition of nickel from an acid bath
US2455555A (en) * 1946-05-01 1948-12-07 Udylite Corp Electrodeposition of nickel from an acid bath
NL185994B (en) * 1953-03-24 Wabco Westinghouse CLUTCH HEAD FOR A COMPRESSED AIR LINE.
FR1141135A (en) * 1956-01-18 1957-08-26 Improvements in obtaining metallic deposits by electrolysis
US3366557A (en) * 1958-07-22 1968-01-30 Hanson Van Winkle Munning Co Electrodeposition of nickel

Also Published As

Publication number Publication date
US3152975A (en) 1964-10-13

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