GB920922A - Nickel plating solutions - Google Patents
Nickel plating solutionsInfo
- Publication number
- GB920922A GB920922A GB4015859A GB4015859A GB920922A GB 920922 A GB920922 A GB 920922A GB 4015859 A GB4015859 A GB 4015859A GB 4015859 A GB4015859 A GB 4015859A GB 920922 A GB920922 A GB 920922A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- acid
- nov
- derivatives
- solutions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
920,922. Nickel-plating solutions. W. CANNING & CO. Ltd. Nov. 23, 1960 [Nov. 26, 1959], No. 40158/59. Class 41. A nickel-plating solution, containing 20-100 g./litre of nickel, expressed as the metal, in the form of NiSO 4 and/or NiCl 2 , includes organic brightening chemicals and one or more organic acids, or their Na+, K+ or NH 4 + salts, having a sulphur atom α, # or γ to the carboxyl group, thiolactic acid CH 3 CH(SU).COOH o-mercapto benzoic acid e.g.:- dithiodilactic acid butylene bis thioglycollic acid 2: 2 - di - (carboxymethyl thio) diethyl ether These compounds may be present in a concentration of 0.0002-0.4 g./l. according to the compound chosen. The organic brightening chemicals used may include sulphonic acids, sulphonimides, sulphonamides, acetylenic aclohols, coumarin or its derivatives, or 2-aminothiazole or its derivatives. The deposit formed from these solutions is stated to be a good basis for a chromium-plated layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4015859A GB920922A (en) | 1959-11-26 | 1959-11-26 | Nickel plating solutions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4015859A GB920922A (en) | 1959-11-26 | 1959-11-26 | Nickel plating solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
GB920922A true GB920922A (en) | 1963-03-13 |
Family
ID=10413472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4015859A Expired GB920922A (en) | 1959-11-26 | 1959-11-26 | Nickel plating solutions |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB920922A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2324762A1 (en) * | 1975-09-22 | 1977-04-15 | M & T Chemicals Inc | METHOD AND COMPOSITION FOR THE PREPARATION OF AN ELECTROLYTIC DEPOSIT BASED ON NICKEL, COBALT AND ALLOYS OF THESE METALS BETWEEN THEM AND WITH THE IRON |
US4036709A (en) * | 1975-09-22 | 1977-07-19 | M & T Chemicals Inc. | Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron |
KR101462562B1 (en) * | 2012-10-04 | 2014-11-19 | 주식회사 케이피엠테크 | Electroless nikel plating solution and electronic component using same |
EP3467148A1 (en) * | 2017-10-06 | 2019-04-10 | Rohm and Haas Electronic Materials LLC | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
-
1959
- 1959-11-26 GB GB4015859A patent/GB920922A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2324762A1 (en) * | 1975-09-22 | 1977-04-15 | M & T Chemicals Inc | METHOD AND COMPOSITION FOR THE PREPARATION OF AN ELECTROLYTIC DEPOSIT BASED ON NICKEL, COBALT AND ALLOYS OF THESE METALS BETWEEN THEM AND WITH THE IRON |
US4036709A (en) * | 1975-09-22 | 1977-07-19 | M & T Chemicals Inc. | Electroplating nickel, cobalt, nickel-cobalt alloys and binary or ternary alloys of nickel, cobalt and iron |
KR101462562B1 (en) * | 2012-10-04 | 2014-11-19 | 주식회사 케이피엠테크 | Electroless nikel plating solution and electronic component using same |
EP3467148A1 (en) * | 2017-10-06 | 2019-04-10 | Rohm and Haas Electronic Materials LLC | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
TWI686508B (en) * | 2017-10-06 | 2020-03-01 | 美商羅門哈斯電子材料有限公司 | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
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Howitt | 45—SULPHUR-CONTAINING COMPOUNDS—NOMENCLATURE |