GB830837A - Improvements relating to printed circuits - Google Patents

Improvements relating to printed circuits

Info

Publication number
GB830837A
GB830837A GB1377757A GB1377757A GB830837A GB 830837 A GB830837 A GB 830837A GB 1377757 A GB1377757 A GB 1377757A GB 1377757 A GB1377757 A GB 1377757A GB 830837 A GB830837 A GB 830837A
Authority
GB
United Kingdom
Prior art keywords
pattern
layer
resist
solvent
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1377757A
Inventor
George Ernest Leonard Morgan
Gordon William Fletcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Burndept Ltd
Original Assignee
Burndept Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burndept Ltd filed Critical Burndept Ltd
Priority to GB1377757A priority Critical patent/GB830837A/en
Publication of GB830837A publication Critical patent/GB830837A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

830,837. Etching. BURNDEPT Ltd. April 30, 1958 [April 30, 1957], No. 13777/57. Drawings to Specification. Class 100(2) In the manufacture of printed circuits, a method of providing a resist pattern on the surface of a metal layer comprises the steps of forming on the layer an initial pattern which is a negative of the resist pattern to be produced and is constituted by a material soluble in a specified solvent, covering the layer, with the initial pattern thereon, overall with a resist material which is substantially insoluble in the specified solvent but which is porous thereto where it overlies the initial pattern, and removing the initial pattern and hence the overlying resist material with the aid of the specified solvent, leaving the resist pattern on the surface of the metal layer. The layer may be a layer of copper foil bonded to a sheet of electrically insulating material, or may be of other metal in the form of a foil or deposited as by spraying on an insulating base. The metal is subsequently etched to form a printed circuit. The solvent may be water, and the watersoluble material may comprise 100 grammes gum acacia, 150 ccs. water, 56.7 grammes zinc oxide, and 10 ccs. glycerine. The resist may comprise 15-20% by volume resin, and methylated spirit to 100%, or 61% colophony, 14% castor oil, 5% wax, and 20% solvent naphtha, the latter material acting also as a flux for a subsequent soldering operation. The water may be applied in hot high-pressure jets, and the pattern removable may be assisted by gentle wiping with a soft-bristle brush or soft cloth.
GB1377757A 1957-04-30 1957-04-30 Improvements relating to printed circuits Expired GB830837A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1377757A GB830837A (en) 1957-04-30 1957-04-30 Improvements relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1377757A GB830837A (en) 1957-04-30 1957-04-30 Improvements relating to printed circuits

Publications (1)

Publication Number Publication Date
GB830837A true GB830837A (en) 1960-03-23

Family

ID=10029177

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1377757A Expired GB830837A (en) 1957-04-30 1957-04-30 Improvements relating to printed circuits

Country Status (1)

Country Link
GB (1) GB830837A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425437A2 (en) * 1989-10-26 1991-05-02 Ciba-Geigy Ag Method for making metallic patterns

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425437A2 (en) * 1989-10-26 1991-05-02 Ciba-Geigy Ag Method for making metallic patterns
EP0425437A3 (en) * 1989-10-26 1992-05-27 Ciba-Geigy Ag Method for making metallic patterns

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