GB827251A - Improvements relating to the encapsulation of electrical components - Google Patents
Improvements relating to the encapsulation of electrical componentsInfo
- Publication number
- GB827251A GB827251A GB2431657A GB2431657A GB827251A GB 827251 A GB827251 A GB 827251A GB 2431657 A GB2431657 A GB 2431657A GB 2431657 A GB2431657 A GB 2431657A GB 827251 A GB827251 A GB 827251A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cavity
- embedded
- electrical components
- encapsulation
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
827,251. Electrical component assemblies. SIEMENS EDISON SWAN Ltd. June 17, 1958 [July 31, 1957], No. 24316/57. Class 37. A method of providing an encapsulated assembly of at least two electrical components is characterized in that one of the components is embedded in a body of material, and the other is positioned in a cavity formed in the body, and is embedded in a material which forms, with the body, a unitary block having the components encapsulated therein. As shown in Fig. 1, a capacitor 1, and terminal pins 5 are embedded in a moulded body 2, in which is formed a cavity 3. A coil 4 is positioned in the cavity and connected to pins 5 and further moulding material, which may be different from that used to form the block, is poured into the cavity to embed the coil. Specification 820,246 is referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2431657A GB827251A (en) | 1957-07-31 | 1957-07-31 | Improvements relating to the encapsulation of electrical components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2431657A GB827251A (en) | 1957-07-31 | 1957-07-31 | Improvements relating to the encapsulation of electrical components |
Publications (1)
Publication Number | Publication Date |
---|---|
GB827251A true GB827251A (en) | 1960-02-03 |
Family
ID=10209779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2431657A Expired GB827251A (en) | 1957-07-31 | 1957-07-31 | Improvements relating to the encapsulation of electrical components |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB827251A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3181034A (en) * | 1960-12-12 | 1965-04-27 | Sylvania Electric Prod | Encapsulated electronic module package |
-
1957
- 1957-07-31 GB GB2431657A patent/GB827251A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3181034A (en) * | 1960-12-12 | 1965-04-27 | Sylvania Electric Prod | Encapsulated electronic module package |
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