GB820246A - Improvements relating to the encapsulation of electrical components - Google Patents
Improvements relating to the encapsulation of electrical componentsInfo
- Publication number
- GB820246A GB820246A GB2121157A GB2121157A GB820246A GB 820246 A GB820246 A GB 820246A GB 2121157 A GB2121157 A GB 2121157A GB 2121157 A GB2121157 A GB 2121157A GB 820246 A GB820246 A GB 820246A
- Authority
- GB
- United Kingdom
- Prior art keywords
- component
- mould
- embedded
- coil
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
820,246. Electrical component assemblies. SIEMENS EDISON SWAN Ltd. June 10, 1958 [July 4, 1957], No. 21211/57. Class 37. A method of providing an encapsulated assembly of at least two components, which have different requirements as to embedding materials, is characterized in that one component is first embedded in a body of moulding material, and is then placed with the second component in a mould, and the second component at least embedded in a second material such that the two embedding materials form a single integrated block. In the embodiment shown, a capacitor 1 is embedded in a generally rectangular block 2 of cold setting synthetic resin, e.g. an epoxy resin, having projecting lugs 3. The pre-moulded capacitor is then placed in a mould, leaving a space between the side formed with the lugs 3 and the wall of the mould, into which the coil 4 is inserted. A resilient embedding material, e.g. a mixture of epoxy resin and synthetic rubber is then introduced into the space around the coil and allowed to set, resulting in a composite block having a rigid part 2 and a resilient part 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2121157A GB820246A (en) | 1957-07-04 | 1957-07-04 | Improvements relating to the encapsulation of electrical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2121157A GB820246A (en) | 1957-07-04 | 1957-07-04 | Improvements relating to the encapsulation of electrical components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB820246A true GB820246A (en) | 1959-09-16 |
Family
ID=10159057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2121157A Expired GB820246A (en) | 1957-07-04 | 1957-07-04 | Improvements relating to the encapsulation of electrical components |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB820246A (en) |
-
1957
- 1957-07-04 GB GB2121157A patent/GB820246A/en not_active Expired
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