GB1353602A - Pressure-assembled diode assemblies diode assemblies and their manufacture - Google Patents

Pressure-assembled diode assemblies diode assemblies and their manufacture

Info

Publication number
GB1353602A
GB1353602A GB1353602DA GB1353602A GB 1353602 A GB1353602 A GB 1353602A GB 1353602D A GB1353602D A GB 1353602DA GB 1353602 A GB1353602 A GB 1353602A
Authority
GB
United Kingdom
Prior art keywords
silastomer
electrodes
pressure
recess
diode assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Reigate Ltd
Original Assignee
International Rectifier Company Great Britain Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Company Great Britain Ltd filed Critical International Rectifier Company Great Britain Ltd
Publication of GB1353602A publication Critical patent/GB1353602A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

1353602 Semi-conductor devices INTERNATIONAL RECTIFIER CO (GREAT BRITAIN) Ltd 22 July 1971 [24 April 1970] 19854/70 Heading H1K A pressure-assembled diode assembly comprises a semi-conductor diode element 10 maintained under pressure between electrodes 13, 14 by an expansion buffer 18 of silastomer, e.g. silicone rubber, which encloses peripheral portions of the electrodes, the silastomer being compressed within a substantially rigid outer housing 19 of synthetic resin, e.g. epoxy resin. The lower electrode 14 may include a recess 15 in an axial face in which recess the element 10 is situated, the other electrode 13 including a circumferential recess 20 which extends to above the margin of the element. The electrodes may include peripheral flanges 16, against which the silastomer exerts pressure. Thermal expansion of the electrodes, which may be of copper, in a radial direction, may be allowed for by the silastomer, and in an axial direction by sliding between the electrodes and the casing, or by flexing of the casing. Several devices may be simultaneously manufactured in a mould with spacers therebetween, the devices being held under pressure while the silastomer is injected. Alternatively a preformed silastomer buffer may be used, compression in both cases being achieved by shrinkage of the resin housing during curing.
GB1353602D 1970-04-24 1970-04-24 Pressure-assembled diode assemblies diode assemblies and their manufacture Expired GB1353602A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1985470 1970-04-24

Publications (1)

Publication Number Publication Date
GB1353602A true GB1353602A (en) 1974-05-22

Family

ID=10136320

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1353602D Expired GB1353602A (en) 1970-04-24 1970-04-24 Pressure-assembled diode assemblies diode assemblies and their manufacture

Country Status (1)

Country Link
GB (1) GB1353602A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material
WO1982002797A1 (en) * 1981-01-30 1982-08-19 Inc Motorola Button rectifier package
US4587550A (en) * 1980-12-16 1986-05-06 Tokyo Shibaura Denki Kabushiki Kaisha Press-packed semiconductor device with lateral fixing member
WO2022078725A1 (en) 2020-10-15 2022-04-21 Hitachi Energy Switzerland Ag Power semiconductor module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188637A (en) * 1976-07-06 1980-02-12 Licentia Patent-Verwaltungs-G.M.B.H. Disc-shaped semiconductor device having an annular housing of elastomer material
US4587550A (en) * 1980-12-16 1986-05-06 Tokyo Shibaura Denki Kabushiki Kaisha Press-packed semiconductor device with lateral fixing member
WO1982002797A1 (en) * 1981-01-30 1982-08-19 Inc Motorola Button rectifier package
WO2022078725A1 (en) 2020-10-15 2022-04-21 Hitachi Energy Switzerland Ag Power semiconductor module
DE212021000482U1 (en) 2020-10-15 2023-08-22 Hitachi Energy Switzerland Ag Power semiconductor module

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees