GB2393329B - Heat sink with heat pipe in direct contact with component - Google Patents

Heat sink with heat pipe in direct contact with component

Info

Publication number
GB2393329B
GB2393329B GB0320066A GB0320066A GB2393329B GB 2393329 B GB2393329 B GB 2393329B GB 0320066 A GB0320066 A GB 0320066A GB 0320066 A GB0320066 A GB 0320066A GB 2393329 B GB2393329 B GB 2393329B
Authority
GB
United Kingdom
Prior art keywords
component
direct contact
heat
heat sink
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0320066A
Other languages
English (en)
Other versions
GB2393329A (en
GB0320066D0 (en
Inventor
Christopher Gregory Malone
Harold Miyamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of GB0320066D0 publication Critical patent/GB0320066D0/en
Publication of GB2393329A publication Critical patent/GB2393329A/en
Application granted granted Critical
Publication of GB2393329B publication Critical patent/GB2393329B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0320066A 2002-09-17 2003-08-27 Heat sink with heat pipe in direct contact with component Expired - Fee Related GB2393329B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/246,299 US7140422B2 (en) 2002-09-17 2002-09-17 Heat sink with heat pipe in direct contact with component

Publications (3)

Publication Number Publication Date
GB0320066D0 GB0320066D0 (en) 2003-10-01
GB2393329A GB2393329A (en) 2004-03-24
GB2393329B true GB2393329B (en) 2006-05-03

Family

ID=28791705

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0320066A Expired - Fee Related GB2393329B (en) 2002-09-17 2003-08-27 Heat sink with heat pipe in direct contact with component

Country Status (3)

Country Link
US (1) US7140422B2 (enExample)
JP (1) JP2004111968A (enExample)
GB (1) GB2393329B (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7140422B2 (en) 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6894900B2 (en) 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
TWM244509U (en) * 2003-07-16 2004-09-21 Hon Hai Prec Ind Co Ltd A heat pipe radiator
TWM243912U (en) * 2003-08-25 2004-09-11 Tatung Co Heating dissipating device
CN2657082Y (zh) * 2003-10-18 2004-11-17 鸿富锦精密工业（深圳）有限公司 热管散热装置
US20060175045A1 (en) * 2004-03-19 2006-08-10 Yin-Hung Chen Heat dissipation device
CN2696124Y (zh) * 2004-04-22 2005-04-27 鸿富锦精密工业（深圳）有限公司 散热装置
CN100338767C (zh) * 2004-05-26 2007-09-19 鸿富锦精密工业（深圳）有限公司 热管散热装置及其制造方法
US6978828B1 (en) 2004-06-18 2005-12-27 Schlumberger Technology Corporation Heat pipe cooling system
US7129501B2 (en) * 2004-06-29 2006-10-31 Sii Nanotechnology Usa, Inc. Radiation detector system having heat pipe based cooling
US20060104032A1 (en) * 2004-11-16 2006-05-18 Hon Hai Precision Industry Co., Ltd Heat dissipation device
JP4539425B2 (ja) * 2005-04-28 2010-09-08 日立電線株式会社 ヒートパイプ式ヒートシンク及びその製造方法
CN100456461C (zh) * 2005-06-04 2009-01-28 富准精密工业(深圳)有限公司 热管散热装置
CN101072482A (zh) * 2006-05-12 2007-11-14 富准精密工业(深圳)有限公司 散热装置及使用该散热装置的散热系统
US20080115914A1 (en) * 2006-11-17 2008-05-22 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7942194B2 (en) * 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US20090059524A1 (en) * 2007-08-27 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7770632B2 (en) * 2007-09-26 2010-08-10 Coolit Systems, Inc. Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition
CN101408301B (zh) * 2007-10-10 2012-09-19 富准精密工业(深圳)有限公司 带有散热装置的发光二极管灯具
US7866043B2 (en) * 2008-04-28 2011-01-11 Golden Sun News Techniques Co., Ltd. Method of flatting evaporating section of heat pipe embedded in heat dissipation device
US8640031B2 (en) * 2009-09-01 2014-01-28 Samsung Electronics Co., Ltd Method and apparatus for controlling remote user interface in a home network
US8584736B2 (en) * 2009-11-23 2013-11-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a fin also functioning as a supporting bracket
CN101764167B (zh) * 2009-12-25 2011-08-24 赵耀华 太阳能光伏电池高效散热装置及热电联供系统
CN102473696A (zh) * 2010-01-18 2012-05-23 古河电气工业株式会社 散热器
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
TWI531303B (zh) * 2011-11-16 2016-04-21 宏碁股份有限公司 散熱模組
CN104519718A (zh) * 2013-10-08 2015-04-15 英业达科技有限公司 散热模块
US20160102920A1 (en) * 2014-10-08 2016-04-14 Mersen Canada Toronto Inc. Heat pipe assembly with bonded fins on the baseplate hybrid
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
US12309962B2 (en) * 2022-03-21 2025-05-20 International Business Machines Corporation Configurable multi-chip module heatsink for selective dissipation of heat

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833859A (ja) * 1981-08-21 1983-02-28 Mitsubishi Electric Corp 半導体装置用パツケ−ジ
US5949647A (en) * 1996-06-28 1999-09-07 Intel Corporation Heat pipe to baseplate attachment method
JP2001267772A (ja) * 2000-03-15 2001-09-28 Fujitsu Ltd 電子部品の放熱構造
JP2002064170A (ja) * 2000-08-22 2002-02-28 Fujikura Ltd 平板型ヒートパイプを備えたヒートシンク
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips

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US4008615A (en) * 1975-04-28 1977-02-22 Emhart Industries, Inc. Temperature averaging device
JPS5742154A (en) 1980-08-26 1982-03-09 Furukawa Electric Co Ltd:The Heat pipe type heat sink
JP3020790B2 (ja) * 1993-12-28 2000-03-15 株式会社日立製作所 ヒートパイプ式冷却装置とこれを用いた車両制御装置
JP3094780B2 (ja) * 1994-04-05 2000-10-03 株式会社日立製作所 電子装置
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
JPH09126669A (ja) 1995-10-30 1997-05-16 Furukawa Electric Co Ltd:The ヒートパイプ式ヒートシンクおよび電子部品ユニット
JP3106428B2 (ja) 1996-06-12 2000-11-06 古河電気工業株式会社 ヒートシンクおよびその製造方法、並びにヒートシンク付き電子装置およびその製造方法
US5699853A (en) * 1996-08-30 1997-12-23 International Business Machines Corporation Combined heat sink and sink plate
US5901040A (en) * 1997-07-30 1999-05-04 Hewlett-Packard Company Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
JPH1183355A (ja) 1997-09-02 1999-03-26 Furukawa Electric Co Ltd:The ファン付きヒートシンク
JPH11121667A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd ヒートパイプ式冷却装置
JPH11317482A (ja) 1997-12-25 1999-11-16 Furukawa Electric Co Ltd:The ヒートシンク
FR2773941B1 (fr) * 1998-01-19 2000-04-21 Ferraz Echangeur di-phasique pour au moins un composant electronique de puissance
DE29806082U1 (de) * 1998-04-02 1998-06-18 Ideal Electronics Inc., San Chung, Taipei Kühleinrichtung für eine zentrale Recheneinheit
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
JPH11351769A (ja) 1998-06-12 1999-12-24 Furukawa Electric Co Ltd:The ヒートシンク
JP2000040891A (ja) 1998-07-24 2000-02-08 Fujikura Ltd ヒートパイプ付きヒートシンク
US6021044A (en) * 1998-08-13 2000-02-01 Data General Corporation Heatsink assembly
US5926370A (en) * 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
JP4426684B2 (ja) 2000-02-07 2010-03-03 ティーエス ヒートロニクス 株式会社 ヒートシンク
US6377459B1 (en) * 2000-08-04 2002-04-23 Sun Microsystems, Inc. Chip cooling management
JP2002151636A (ja) 2000-11-10 2002-05-24 Ts Heatronics Co Ltd ヒートシンク
JP2002271074A (ja) 2001-03-08 2002-09-20 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
US6499894B1 (en) * 2001-06-28 2002-12-31 Behavior Tech Computer Corporation Push key with replaceable key cap
WO2003041472A1 (fr) * 2001-07-26 2003-05-15 Jefferson Liu Module de dissipation thermique
US6830098B1 (en) * 2002-06-14 2004-12-14 Thermal Corp. Heat pipe fin stack with extruded base
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US6785140B2 (en) * 2002-08-28 2004-08-31 Dell Products L.P. Multiple heat pipe heat sink
US7140422B2 (en) 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
US6827136B2 (en) * 2002-10-18 2004-12-07 Hon Hai Precision Ind. Co., Ltd. Heat dissipating apparatus and method for producing same
US6796373B1 (en) * 2003-08-27 2004-09-28 Inventec Corporation Heat sink module
US6779595B1 (en) * 2003-09-16 2004-08-24 Cpumate Inc. Integrated heat dissipation apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833859A (ja) * 1981-08-21 1983-02-28 Mitsubishi Electric Corp 半導体装置用パツケ−ジ
US5949647A (en) * 1996-06-28 1999-09-07 Intel Corporation Heat pipe to baseplate attachment method
JP2001267772A (ja) * 2000-03-15 2001-09-28 Fujitsu Ltd 電子部品の放熱構造
JP2002064170A (ja) * 2000-08-22 2002-02-28 Fujikura Ltd 平板型ヒートパイプを備えたヒートシンク
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips

Also Published As

Publication number Publication date
GB2393329A (en) 2004-03-24
GB0320066D0 (en) 2003-10-01
US20040050534A1 (en) 2004-03-18
JP2004111968A (ja) 2004-04-08
US7140422B2 (en) 2006-11-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20140827