GB2388709A - Circuit fabrication method - Google Patents

Circuit fabrication method Download PDF

Info

Publication number
GB2388709A
GB2388709A GB0211424A GB0211424A GB2388709A GB 2388709 A GB2388709 A GB 2388709A GB 0211424 A GB0211424 A GB 0211424A GB 0211424 A GB0211424 A GB 0211424A GB 2388709 A GB2388709 A GB 2388709A
Authority
GB
United Kingdom
Prior art keywords
conductive
layer
insulator
semiconductor
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0211424A
Other languages
English (en)
Other versions
GB0211424D0 (en
Inventor
Takeo Kawase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to GB0211424A priority Critical patent/GB2388709A/en
Publication of GB0211424D0 publication Critical patent/GB0211424D0/en
Priority to KR1020047000479A priority patent/KR100606182B1/ko
Priority to AU2003227947A priority patent/AU2003227947A1/en
Priority to TW092113498A priority patent/TWI253178B/zh
Priority to JP2004506090A priority patent/JP4165507B2/ja
Priority to CN03800694.4A priority patent/CN100472793C/zh
Priority to EP03725412A priority patent/EP1456887A1/en
Priority to PCT/GB2003/002131 priority patent/WO2003098696A1/en
Priority to US10/482,101 priority patent/US7198885B2/en
Publication of GB2388709A publication Critical patent/GB2388709A/en
Priority to JP2008108667A priority patent/JP2008235919A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0241Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
GB0211424A 2002-05-17 2002-05-17 Circuit fabrication method Withdrawn GB2388709A (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
GB0211424A GB2388709A (en) 2002-05-17 2002-05-17 Circuit fabrication method
US10/482,101 US7198885B2 (en) 2002-05-17 2003-05-19 Circuit fabrication method
JP2004506090A JP4165507B2 (ja) 2002-05-17 2003-05-19 回路の製造方法
AU2003227947A AU2003227947A1 (en) 2002-05-17 2003-05-19 Circuit fabrication method
TW092113498A TWI253178B (en) 2002-05-17 2003-05-19 Circuit fabrication method
KR1020047000479A KR100606182B1 (ko) 2002-05-17 2003-05-19 회로 제조 방법
CN03800694.4A CN100472793C (zh) 2002-05-17 2003-05-19 电路制作方法
EP03725412A EP1456887A1 (en) 2002-05-17 2003-05-19 Circuit fabrication method
PCT/GB2003/002131 WO2003098696A1 (en) 2002-05-17 2003-05-19 Circuit fabrication method
JP2008108667A JP2008235919A (ja) 2002-05-17 2008-04-18 回路、電気光学装置、および回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0211424A GB2388709A (en) 2002-05-17 2002-05-17 Circuit fabrication method

Publications (2)

Publication Number Publication Date
GB0211424D0 GB0211424D0 (en) 2002-06-26
GB2388709A true GB2388709A (en) 2003-11-19

Family

ID=9936937

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0211424A Withdrawn GB2388709A (en) 2002-05-17 2002-05-17 Circuit fabrication method

Country Status (9)

Country Link
US (1) US7198885B2 (enExample)
EP (1) EP1456887A1 (enExample)
JP (2) JP4165507B2 (enExample)
KR (1) KR100606182B1 (enExample)
CN (1) CN100472793C (enExample)
AU (1) AU2003227947A1 (enExample)
GB (1) GB2388709A (enExample)
TW (1) TWI253178B (enExample)
WO (1) WO2003098696A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041027A1 (en) * 2006-10-03 2008-04-10 Plastic Logic Limited Distortion-tolerant processing
US7361594B2 (en) 2003-11-19 2008-04-22 Seiko Epson Corporation Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
WO2009083438A1 (fr) * 2007-12-21 2009-07-09 The Swatch Group Research And Development Ltd Dispositif d ' affichage a matrice active ayant un transistor organique a couches minces
WO2011124792A1 (fr) * 2010-04-08 2011-10-13 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de fabrication de deux zones adjacentes en matériaux différents
JP2012169502A (ja) * 2011-02-15 2012-09-06 Fuji Xerox Co Ltd 電子素子及びその製造方法
US10585456B2 (en) 2015-08-26 2020-03-10 Lg Display Co., Ltd. Flexible display device having bending sensing device

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615197B2 (ja) * 2002-08-30 2011-01-19 シャープ株式会社 Tftアレイ基板の製造方法および液晶表示装置の製造方法
TWI237892B (en) * 2004-01-13 2005-08-11 Ind Tech Res Inst Method of forming thin-film transistor devices with electro-static discharge protection
GB0400997D0 (en) 2004-01-16 2004-02-18 Univ Cambridge Tech N-channel transistor
JP4266842B2 (ja) * 2004-02-02 2009-05-20 セイコーエプソン株式会社 電気光学装置用基板の製造方法及び電気光学装置の製造方法
JP4729855B2 (ja) * 2004-03-15 2011-07-20 セイコーエプソン株式会社 薄膜トランジスタ、薄膜トランジスタ回路、電子デバイスおよび電子機器
JP4800594B2 (ja) * 2004-06-09 2011-10-26 三菱電機株式会社 高周波デバイス
US8001455B2 (en) * 2004-10-14 2011-08-16 Daktronics, Inc. Translation table
US8344410B2 (en) 2004-10-14 2013-01-01 Daktronics, Inc. Flexible pixel element and signal distribution means
US7868903B2 (en) 2004-10-14 2011-01-11 Daktronics, Inc. Flexible pixel element fabrication and sealing method
US7893948B1 (en) * 2004-10-14 2011-02-22 Daktronics, Inc. Flexible pixel hardware and method
KR101090250B1 (ko) * 2004-10-15 2011-12-06 삼성전자주식회사 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법
GB0426563D0 (en) * 2004-12-03 2005-01-05 Plastic Logic Ltd Alignment tolerant patterning on flexible substrates
US20060127817A1 (en) * 2004-12-10 2006-06-15 Eastman Kodak Company In-line fabrication of curved surface transistors
US7125495B2 (en) * 2004-12-20 2006-10-24 Palo Alto Research Center, Inc. Large area electronic device with high and low resolution patterned film features
JP2006201217A (ja) 2005-01-18 2006-08-03 Seiko Epson Corp 配線基板、電気光学装置及び電子機器
US7341680B2 (en) 2005-03-02 2008-03-11 Hewlett-Packard Development Company, L.P. Printable composition with nanostructures of first and second types
KR101219035B1 (ko) 2005-05-03 2013-01-07 삼성디스플레이 주식회사 유기 박막 트랜지스터 표시판 및 그 제조 방법
KR101133767B1 (ko) * 2005-03-09 2012-04-09 삼성전자주식회사 유기 박막 트랜지스터 표시판 및 그 제조 방법
CN101479661B (zh) * 2005-03-23 2012-06-06 艾格瑞系统有限公司 利用压印光刻和直接写入技术制造器件的方法
KR101133766B1 (ko) 2005-03-29 2012-04-09 삼성전자주식회사 박막 트랜지스터 표시판의 제조 방법
JP4686232B2 (ja) * 2005-03-30 2011-05-25 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
GB2424759A (en) * 2005-04-01 2006-10-04 Seiko Epson Corp Inkjet deposition of polythiophene semiconductor material dissolved in halogenated aromatic solvents
JP5023437B2 (ja) * 2005-04-01 2012-09-12 セイコーエプソン株式会社 半導体装置の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
JP4254743B2 (ja) * 2005-05-13 2009-04-15 セイコーエプソン株式会社 薄膜トランジスタの製造方法
EP1727219B1 (en) 2005-05-25 2014-05-07 Samsung SDI Germany GmbH Organic thin film transistor and method for producing the same
US7750350B2 (en) * 2005-05-25 2010-07-06 Samsung Mobile Display Co., Ltd. Organic thin film transistor, flat panel display apparatus having the same, method of producing the organic thin film transistor and shadow mask used in the method
US7994509B2 (en) 2005-11-01 2011-08-09 Hewlett-Packard Development Company, L.P. Structure and method for thin film device with stranded conductor
US7462513B2 (en) * 2005-08-22 2008-12-09 Lexmark International, Inc. Methods for making printed fuse devices
JP4905762B2 (ja) * 2005-08-23 2012-03-28 富士フイルム株式会社 光電変換素子、撮像素子、および該光電変換素子の製造方法
US7414262B2 (en) 2005-09-30 2008-08-19 Lexmark International, Inc. Electronic devices and methods for forming the same
GB2436893A (en) * 2006-03-31 2007-10-10 Seiko Epson Corp Inkjet printing of cross point passive matrix devices
JP2007281188A (ja) * 2006-04-06 2007-10-25 Seiko Epson Corp トランジスタ、画素電極基板、電気光学装置、電子機器及び半導体素子の製造方法
JP2007329417A (ja) * 2006-06-09 2007-12-20 Seiko Epson Corp 半導体装置、電気光学装置、電子機器及び半導体装置の製造方法
KR101261605B1 (ko) 2006-07-12 2013-05-06 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
US7800704B2 (en) * 2006-11-13 2010-09-21 Hannstar Display Corp. Liquid crystal display comprising intersecting common lines
US8035765B2 (en) * 2006-11-13 2011-10-11 Hannstar Display Corp. TFT array substrate, LCD panel and liquid crystal display
JP2008122649A (ja) * 2006-11-13 2008-05-29 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、液晶装置、有機エレクトロルミネッセンス装置、及び電子機器
JP5521270B2 (ja) * 2007-02-21 2014-06-11 凸版印刷株式会社 薄膜トランジスタアレイ、薄膜トランジスタアレイの製造方法、および薄膜トランジスタアレイを用いたアクティブマトリクス型ディスプレイ
EP3249635A1 (en) * 2007-04-13 2017-11-29 Nikon Corporation Method and apparatus for manufacturing display devices, and display device
JP5343330B2 (ja) * 2007-06-28 2013-11-13 住友化学株式会社 薄膜形成方法、有機エレクトロルミネッセンス素子の製造方法、半導体素子の製造方法及び光学素子の製造方法
JP5200443B2 (ja) * 2007-07-30 2013-06-05 セイコーエプソン株式会社 有機トランジスタ及びアクティブマトリックス基板
DE102007039041A1 (de) 2007-08-17 2009-02-19 Bundesdruckerei Gmbh Anzeigevorrichtung, Dokument und Verfahren zur Herstellung einer Anzeigevorrichtung
JP2009090637A (ja) 2007-09-18 2009-04-30 Toppan Printing Co Ltd 有機機能層及び有機機能性素子の製造方法並びに有機機能性素子製造装置
US7754542B2 (en) * 2007-12-19 2010-07-13 Palo Alto Research Center Incorporated Printed TFT array
DE102008042259A1 (de) 2008-09-22 2010-04-08 Bundesdruckerei Gmbh Kraftfahrzeug-Elektronikgerät, Kraftfahrzeug, Verfahren zur Anzeige von Daten auf einer Kraftfahrzeug-Anzeigevorrichtung und Computerprogrammprodukt
RU2507638C2 (ru) * 2008-10-02 2014-02-20 Конинклейке Филипс Электроникс Н.В. Устройство oled с покрытой шунтирующей линией
DE102008043123A1 (de) 2008-10-23 2010-04-29 Bundesdruckerei Gmbh Kraftfahrzeug-Anzeigevorrichtung, Kraftfahrzeug-Elektroniksystem, Kraftfahrzeug, Verfahren zur Anzeige von Daten und Computerprogrammprodukt
DE102008043830A1 (de) 2008-11-18 2010-05-20 Bundesdruckerei Gmbh Kraftfahrzeug-Anzeigevorrichtung, Kraftfahrzeug-Elektroniksystem, Kraftfahrzeug, Verfahren zur Anzeige von Daten und Computerprogrammprodukt
JP5342862B2 (ja) * 2008-12-16 2013-11-13 株式会社島津製作所 光マトリックスデバイスの製造方法
JP2010205973A (ja) * 2009-03-04 2010-09-16 Seiko Epson Corp 回路基板の製造方法、回路基板、電気光学装置及び電子機器
DE102009045544A1 (de) 2009-10-09 2011-05-05 Bundesdruckerei Gmbh Dokument
JP5397175B2 (ja) * 2009-11-13 2014-01-22 セイコーエプソン株式会社 半導体装置用基板及びその製造方法、半導体装置並びに電子機器
US9156038B2 (en) 2012-03-30 2015-10-13 Rsr Technologies, Inc. Magnetic separation of electrochemical cell materials
JP5907788B2 (ja) * 2012-04-11 2016-04-26 株式会社図研 情報処理装置、情報処理方法、プログラムおよび基板製造システム
CN103793089B (zh) * 2012-10-30 2017-05-17 宸鸿科技(厦门)有限公司 触控面板
US8941128B2 (en) * 2012-11-21 2015-01-27 Intel Corporation Passivation layer for flexible display
US9310626B2 (en) * 2013-03-15 2016-04-12 Johnson & Johnson Vision Care, Inc. Ophthalmic devices with organic semiconductor transistors
US9817525B2 (en) * 2013-07-15 2017-11-14 Novatek Microelectronics Corp. Touch panel
JP2015053411A (ja) * 2013-09-09 2015-03-19 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、および電子機器
CN103681875A (zh) * 2013-12-26 2014-03-26 南京中电熊猫液晶显示科技有限公司 一种具有修复功能的切换薄膜电晶体
CN104505365B (zh) * 2014-12-25 2017-06-30 中国电子科技集团公司第二十九研究所 一种制作含侧面图形的陶瓷薄膜电路的方法及高精度夹持装置
CN107204375B (zh) * 2017-05-19 2019-11-26 深圳市华星光电技术有限公司 薄膜晶体管及其制作方法
TWI736695B (zh) * 2017-10-24 2021-08-21 啟耀光電股份有限公司 電子裝置與其製造方法
US10782606B2 (en) * 2018-06-29 2020-09-22 Globalfoundries Inc. Photolithography methods and structures that reduce stochastic defects
CN109346482B (zh) * 2018-09-30 2024-01-05 武汉华星光电技术有限公司 薄膜晶体管阵列基板及其制造方法、显示面板
US11259402B1 (en) 2020-09-08 2022-02-22 United States Of America As Represented By The Secretary Of The Air Force Fabrication of electrical and/or optical crossover signal lines through direct write deposition techniques
TWI893770B (zh) * 2024-04-18 2025-08-11 友達光電股份有限公司 顯示裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892028A2 (en) * 1997-07-16 1999-01-20 Seiko Epson Corporation Composition for an organic el element and method of manufacturing the organic el element
WO1999019900A2 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
WO1999053371A1 (en) * 1998-04-10 1999-10-21 E-Ink Corporation Electronic displays using organic-based field effect transistors
WO2001008242A1 (en) * 1999-07-21 2001-02-01 E Ink Corporation Preferred methods for producing electrical circuit elements used to control an electronic display

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332822B2 (ja) 1997-09-05 2002-10-07 キヤノン株式会社 カラーフィルタ基板の製造方法
US6087196A (en) * 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
AU3203099A (en) * 1998-03-27 1999-10-18 Trustees Of Princeton University, The Method for making multilayer thin-film electronics
TW410478B (en) 1998-05-29 2000-11-01 Lucent Technologies Inc Thin-film transistor monolithically integrated with an organic light-emitting diode
WO2001017029A1 (en) 1999-08-31 2001-03-08 E Ink Corporation Transistor for an electronically driven display
GB9929614D0 (en) * 1999-12-15 2000-02-09 Koninkl Philips Electronics Nv Method of manufacturing a transistor
WO2001047045A1 (en) * 1999-12-21 2001-06-28 Plastic Logic Limited Solution processing
GB2379412A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Deposition of soluble materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892028A2 (en) * 1997-07-16 1999-01-20 Seiko Epson Corporation Composition for an organic el element and method of manufacturing the organic el element
WO1999019900A2 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
WO1999053371A1 (en) * 1998-04-10 1999-10-21 E-Ink Corporation Electronic displays using organic-based field effect transistors
WO2001008242A1 (en) * 1999-07-21 2001-02-01 E Ink Corporation Preferred methods for producing electrical circuit elements used to control an electronic display

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361594B2 (en) 2003-11-19 2008-04-22 Seiko Epson Corporation Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
WO2008041027A1 (en) * 2006-10-03 2008-04-10 Plastic Logic Limited Distortion-tolerant processing
US8859312B2 (en) 2006-10-03 2014-10-14 Plastic Logic Limited Distortion tolerant processing
US9287326B2 (en) 2006-10-03 2016-03-15 Flexenable Limited Distortion tolerant processing
WO2009083438A1 (fr) * 2007-12-21 2009-07-09 The Swatch Group Research And Development Ltd Dispositif d ' affichage a matrice active ayant un transistor organique a couches minces
WO2011124792A1 (fr) * 2010-04-08 2011-10-13 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de fabrication de deux zones adjacentes en matériaux différents
FR2958561A1 (fr) * 2010-04-08 2011-10-14 Commissariat Energie Atomique Procede de fabrication de deux zones adjacentes en materiaux differents
US8889473B2 (en) 2010-04-08 2014-11-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Method for manufacturing two adjacent areas made of different materials
JP2012169502A (ja) * 2011-02-15 2012-09-06 Fuji Xerox Co Ltd 電子素子及びその製造方法
US10585456B2 (en) 2015-08-26 2020-03-10 Lg Display Co., Ltd. Flexible display device having bending sensing device

Also Published As

Publication number Publication date
JP2005531134A (ja) 2005-10-13
US20040235227A1 (en) 2004-11-25
JP4165507B2 (ja) 2008-10-15
EP1456887A1 (en) 2004-09-15
AU2003227947A1 (en) 2003-12-02
US7198885B2 (en) 2007-04-03
KR100606182B1 (ko) 2006-08-01
TW200400644A (en) 2004-01-01
TWI253178B (en) 2006-04-11
CN100472793C (zh) 2009-03-25
GB0211424D0 (en) 2002-06-26
JP2008235919A (ja) 2008-10-02
WO2003098696A1 (en) 2003-11-27
KR20040015806A (ko) 2004-02-19
CN1533607A (zh) 2004-09-29

Similar Documents

Publication Publication Date Title
US7198885B2 (en) Circuit fabrication method
Burns et al. Inkjet printing of polymer thin-film transistor circuits
US7781760B2 (en) Thin film transistor, electro-optical device, and electronic apparatus
US8139005B2 (en) Display device
EP2059957B1 (en) Organic thin film transistor
RU2499326C2 (ru) Конфигурация смещенного верхнего пиксельного электрода
US7977144B2 (en) Thin film transistor array panel and manufacture thereof
CN100552517C (zh) 有源矩阵基板及其制造方法、电光学装置、电子器件
US7786484B2 (en) Display device having a portion of a pixel circuit exposed by a connection hole
US20070295960A1 (en) Semiconductor device, electro-optical device, electronic apparatus, and method of producing semiconductor device
US10930726B2 (en) Display substrate and preparation method thereof, display panel, and display device
KR101186966B1 (ko) 유기 트랜지스터를 제조하기 위한 자체-정렬 공정
CN100505186C (zh) 垂直薄膜晶体管的制造方法
Rogers Printing Techniques and Plastic Electronics for Paperlike Displays

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)