GB2388709A - Circuit fabrication method - Google Patents
Circuit fabrication method Download PDFInfo
- Publication number
- GB2388709A GB2388709A GB0211424A GB0211424A GB2388709A GB 2388709 A GB2388709 A GB 2388709A GB 0211424 A GB0211424 A GB 0211424A GB 0211424 A GB0211424 A GB 0211424A GB 2388709 A GB2388709 A GB 2388709A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductive
- layer
- insulator
- semiconductor
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 177
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 141
- 239000004065 semiconductor Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 239000012212 insulator Substances 0.000 claims abstract description 65
- 238000007641 inkjet printing Methods 0.000 claims abstract description 45
- 239000010409 thin film Substances 0.000 claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 20
- 229920000547 conjugated polymer Polymers 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 19
- 239000002861 polymer material Substances 0.000 claims description 19
- 239000000084 colloidal system Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 20
- 229920002457 flexible plastic Polymers 0.000 abstract description 3
- 230000008713 feedback mechanism Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 87
- 238000013519 translation Methods 0.000 description 43
- 230000008569 process Effects 0.000 description 28
- 230000015654 memory Effects 0.000 description 15
- 239000004033 plastic Substances 0.000 description 14
- 229920003023 plastic Polymers 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000003491 array Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 238000000059 patterning Methods 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- -1 poly(vinylphenol) Polymers 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 229910001092 metal group alloy Inorganic materials 0.000 description 5
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004770 highest occupied molecular orbital Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920000767 polyaniline Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- OHZAHWOAMVVGEL-UHFFFAOYSA-N 2,2'-bithiophene Chemical compound C1=CSC(C=2SC=CC=2)=C1 OHZAHWOAMVVGEL-UHFFFAOYSA-N 0.000 description 1
- YMMGRPLNZPTZBS-UHFFFAOYSA-N 2,3-dihydrothieno[2,3-b][1,4]dioxine Chemical compound O1CCOC2=C1C=CS2 YMMGRPLNZPTZBS-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000206607 Porphyra umbilicalis Species 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 101100311221 Streptomyces toyocaensis staL gene Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- FJAOBQORBYMRNO-UHFFFAOYSA-N f16cupc Chemical compound [Cu+2].[N-]1C(N=C2C3=C(F)C(F)=C(F)C(F)=C3C(N=C3C4=C(F)C(F)=C(F)C(F)=C4C(=N4)[N-]3)=N2)=C(C(F)=C(F)C(F)=C2F)C2=C1N=C1C2=C(F)C(F)=C(F)C(F)=C2C4=N1 FJAOBQORBYMRNO-UHFFFAOYSA-N 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical class [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 208000016853 pontine tegmental cap dysplasia Diseases 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- YFGMQDNQVFJKTR-UHFFFAOYSA-N ptcdi-c8 Chemical compound C=12C3=CC=C(C(N(CCCCCCCC)C4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)N(CCCCCCCC)C(=O)C4=CC=C3C1=C42 YFGMQDNQVFJKTR-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0211424A GB2388709A (en) | 2002-05-17 | 2002-05-17 | Circuit fabrication method |
| US10/482,101 US7198885B2 (en) | 2002-05-17 | 2003-05-19 | Circuit fabrication method |
| JP2004506090A JP4165507B2 (ja) | 2002-05-17 | 2003-05-19 | 回路の製造方法 |
| AU2003227947A AU2003227947A1 (en) | 2002-05-17 | 2003-05-19 | Circuit fabrication method |
| TW092113498A TWI253178B (en) | 2002-05-17 | 2003-05-19 | Circuit fabrication method |
| KR1020047000479A KR100606182B1 (ko) | 2002-05-17 | 2003-05-19 | 회로 제조 방법 |
| CN03800694.4A CN100472793C (zh) | 2002-05-17 | 2003-05-19 | 电路制作方法 |
| EP03725412A EP1456887A1 (en) | 2002-05-17 | 2003-05-19 | Circuit fabrication method |
| PCT/GB2003/002131 WO2003098696A1 (en) | 2002-05-17 | 2003-05-19 | Circuit fabrication method |
| JP2008108667A JP2008235919A (ja) | 2002-05-17 | 2008-04-18 | 回路、電気光学装置、および回路の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0211424A GB2388709A (en) | 2002-05-17 | 2002-05-17 | Circuit fabrication method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0211424D0 GB0211424D0 (en) | 2002-06-26 |
| GB2388709A true GB2388709A (en) | 2003-11-19 |
Family
ID=9936937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0211424A Withdrawn GB2388709A (en) | 2002-05-17 | 2002-05-17 | Circuit fabrication method |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7198885B2 (enExample) |
| EP (1) | EP1456887A1 (enExample) |
| JP (2) | JP4165507B2 (enExample) |
| KR (1) | KR100606182B1 (enExample) |
| CN (1) | CN100472793C (enExample) |
| AU (1) | AU2003227947A1 (enExample) |
| GB (1) | GB2388709A (enExample) |
| TW (1) | TWI253178B (enExample) |
| WO (1) | WO2003098696A1 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008041027A1 (en) * | 2006-10-03 | 2008-04-10 | Plastic Logic Limited | Distortion-tolerant processing |
| US7361594B2 (en) | 2003-11-19 | 2008-04-22 | Seiko Epson Corporation | Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus |
| WO2009083438A1 (fr) * | 2007-12-21 | 2009-07-09 | The Swatch Group Research And Development Ltd | Dispositif d ' affichage a matrice active ayant un transistor organique a couches minces |
| WO2011124792A1 (fr) * | 2010-04-08 | 2011-10-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé de fabrication de deux zones adjacentes en matériaux différents |
| JP2012169502A (ja) * | 2011-02-15 | 2012-09-06 | Fuji Xerox Co Ltd | 電子素子及びその製造方法 |
| US10585456B2 (en) | 2015-08-26 | 2020-03-10 | Lg Display Co., Ltd. | Flexible display device having bending sensing device |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4615197B2 (ja) * | 2002-08-30 | 2011-01-19 | シャープ株式会社 | Tftアレイ基板の製造方法および液晶表示装置の製造方法 |
| TWI237892B (en) * | 2004-01-13 | 2005-08-11 | Ind Tech Res Inst | Method of forming thin-film transistor devices with electro-static discharge protection |
| GB0400997D0 (en) | 2004-01-16 | 2004-02-18 | Univ Cambridge Tech | N-channel transistor |
| JP4266842B2 (ja) * | 2004-02-02 | 2009-05-20 | セイコーエプソン株式会社 | 電気光学装置用基板の製造方法及び電気光学装置の製造方法 |
| JP4729855B2 (ja) * | 2004-03-15 | 2011-07-20 | セイコーエプソン株式会社 | 薄膜トランジスタ、薄膜トランジスタ回路、電子デバイスおよび電子機器 |
| JP4800594B2 (ja) * | 2004-06-09 | 2011-10-26 | 三菱電機株式会社 | 高周波デバイス |
| US8001455B2 (en) * | 2004-10-14 | 2011-08-16 | Daktronics, Inc. | Translation table |
| US8344410B2 (en) | 2004-10-14 | 2013-01-01 | Daktronics, Inc. | Flexible pixel element and signal distribution means |
| US7868903B2 (en) | 2004-10-14 | 2011-01-11 | Daktronics, Inc. | Flexible pixel element fabrication and sealing method |
| US7893948B1 (en) * | 2004-10-14 | 2011-02-22 | Daktronics, Inc. | Flexible pixel hardware and method |
| KR101090250B1 (ko) * | 2004-10-15 | 2011-12-06 | 삼성전자주식회사 | 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법 |
| GB0426563D0 (en) * | 2004-12-03 | 2005-01-05 | Plastic Logic Ltd | Alignment tolerant patterning on flexible substrates |
| US20060127817A1 (en) * | 2004-12-10 | 2006-06-15 | Eastman Kodak Company | In-line fabrication of curved surface transistors |
| US7125495B2 (en) * | 2004-12-20 | 2006-10-24 | Palo Alto Research Center, Inc. | Large area electronic device with high and low resolution patterned film features |
| JP2006201217A (ja) | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 配線基板、電気光学装置及び電子機器 |
| US7341680B2 (en) | 2005-03-02 | 2008-03-11 | Hewlett-Packard Development Company, L.P. | Printable composition with nanostructures of first and second types |
| KR101219035B1 (ko) | 2005-05-03 | 2013-01-07 | 삼성디스플레이 주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
| KR101133767B1 (ko) * | 2005-03-09 | 2012-04-09 | 삼성전자주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
| CN101479661B (zh) * | 2005-03-23 | 2012-06-06 | 艾格瑞系统有限公司 | 利用压印光刻和直接写入技术制造器件的方法 |
| KR101133766B1 (ko) | 2005-03-29 | 2012-04-09 | 삼성전자주식회사 | 박막 트랜지스터 표시판의 제조 방법 |
| JP4686232B2 (ja) * | 2005-03-30 | 2011-05-25 | セイコーエプソン株式会社 | 半導体装置及び半導体装置の製造方法 |
| GB2424759A (en) * | 2005-04-01 | 2006-10-04 | Seiko Epson Corp | Inkjet deposition of polythiophene semiconductor material dissolved in halogenated aromatic solvents |
| JP5023437B2 (ja) * | 2005-04-01 | 2012-09-12 | セイコーエプソン株式会社 | 半導体装置の製造方法、電気光学装置の製造方法、及び電子機器の製造方法 |
| JP4254743B2 (ja) * | 2005-05-13 | 2009-04-15 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| EP1727219B1 (en) | 2005-05-25 | 2014-05-07 | Samsung SDI Germany GmbH | Organic thin film transistor and method for producing the same |
| US7750350B2 (en) * | 2005-05-25 | 2010-07-06 | Samsung Mobile Display Co., Ltd. | Organic thin film transistor, flat panel display apparatus having the same, method of producing the organic thin film transistor and shadow mask used in the method |
| US7994509B2 (en) | 2005-11-01 | 2011-08-09 | Hewlett-Packard Development Company, L.P. | Structure and method for thin film device with stranded conductor |
| US7462513B2 (en) * | 2005-08-22 | 2008-12-09 | Lexmark International, Inc. | Methods for making printed fuse devices |
| JP4905762B2 (ja) * | 2005-08-23 | 2012-03-28 | 富士フイルム株式会社 | 光電変換素子、撮像素子、および該光電変換素子の製造方法 |
| US7414262B2 (en) | 2005-09-30 | 2008-08-19 | Lexmark International, Inc. | Electronic devices and methods for forming the same |
| GB2436893A (en) * | 2006-03-31 | 2007-10-10 | Seiko Epson Corp | Inkjet printing of cross point passive matrix devices |
| JP2007281188A (ja) * | 2006-04-06 | 2007-10-25 | Seiko Epson Corp | トランジスタ、画素電極基板、電気光学装置、電子機器及び半導体素子の製造方法 |
| JP2007329417A (ja) * | 2006-06-09 | 2007-12-20 | Seiko Epson Corp | 半導体装置、電気光学装置、電子機器及び半導体装置の製造方法 |
| KR101261605B1 (ko) | 2006-07-12 | 2013-05-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| US7800704B2 (en) * | 2006-11-13 | 2010-09-21 | Hannstar Display Corp. | Liquid crystal display comprising intersecting common lines |
| US8035765B2 (en) * | 2006-11-13 | 2011-10-11 | Hannstar Display Corp. | TFT array substrate, LCD panel and liquid crystal display |
| JP2008122649A (ja) * | 2006-11-13 | 2008-05-29 | Seiko Epson Corp | 電気光学装置の製造方法、電気光学装置、液晶装置、有機エレクトロルミネッセンス装置、及び電子機器 |
| JP5521270B2 (ja) * | 2007-02-21 | 2014-06-11 | 凸版印刷株式会社 | 薄膜トランジスタアレイ、薄膜トランジスタアレイの製造方法、および薄膜トランジスタアレイを用いたアクティブマトリクス型ディスプレイ |
| EP3249635A1 (en) * | 2007-04-13 | 2017-11-29 | Nikon Corporation | Method and apparatus for manufacturing display devices, and display device |
| JP5343330B2 (ja) * | 2007-06-28 | 2013-11-13 | 住友化学株式会社 | 薄膜形成方法、有機エレクトロルミネッセンス素子の製造方法、半導体素子の製造方法及び光学素子の製造方法 |
| JP5200443B2 (ja) * | 2007-07-30 | 2013-06-05 | セイコーエプソン株式会社 | 有機トランジスタ及びアクティブマトリックス基板 |
| DE102007039041A1 (de) | 2007-08-17 | 2009-02-19 | Bundesdruckerei Gmbh | Anzeigevorrichtung, Dokument und Verfahren zur Herstellung einer Anzeigevorrichtung |
| JP2009090637A (ja) | 2007-09-18 | 2009-04-30 | Toppan Printing Co Ltd | 有機機能層及び有機機能性素子の製造方法並びに有機機能性素子製造装置 |
| US7754542B2 (en) * | 2007-12-19 | 2010-07-13 | Palo Alto Research Center Incorporated | Printed TFT array |
| DE102008042259A1 (de) | 2008-09-22 | 2010-04-08 | Bundesdruckerei Gmbh | Kraftfahrzeug-Elektronikgerät, Kraftfahrzeug, Verfahren zur Anzeige von Daten auf einer Kraftfahrzeug-Anzeigevorrichtung und Computerprogrammprodukt |
| RU2507638C2 (ru) * | 2008-10-02 | 2014-02-20 | Конинклейке Филипс Электроникс Н.В. | Устройство oled с покрытой шунтирующей линией |
| DE102008043123A1 (de) | 2008-10-23 | 2010-04-29 | Bundesdruckerei Gmbh | Kraftfahrzeug-Anzeigevorrichtung, Kraftfahrzeug-Elektroniksystem, Kraftfahrzeug, Verfahren zur Anzeige von Daten und Computerprogrammprodukt |
| DE102008043830A1 (de) | 2008-11-18 | 2010-05-20 | Bundesdruckerei Gmbh | Kraftfahrzeug-Anzeigevorrichtung, Kraftfahrzeug-Elektroniksystem, Kraftfahrzeug, Verfahren zur Anzeige von Daten und Computerprogrammprodukt |
| JP5342862B2 (ja) * | 2008-12-16 | 2013-11-13 | 株式会社島津製作所 | 光マトリックスデバイスの製造方法 |
| JP2010205973A (ja) * | 2009-03-04 | 2010-09-16 | Seiko Epson Corp | 回路基板の製造方法、回路基板、電気光学装置及び電子機器 |
| DE102009045544A1 (de) | 2009-10-09 | 2011-05-05 | Bundesdruckerei Gmbh | Dokument |
| JP5397175B2 (ja) * | 2009-11-13 | 2014-01-22 | セイコーエプソン株式会社 | 半導体装置用基板及びその製造方法、半導体装置並びに電子機器 |
| US9156038B2 (en) | 2012-03-30 | 2015-10-13 | Rsr Technologies, Inc. | Magnetic separation of electrochemical cell materials |
| JP5907788B2 (ja) * | 2012-04-11 | 2016-04-26 | 株式会社図研 | 情報処理装置、情報処理方法、プログラムおよび基板製造システム |
| CN103793089B (zh) * | 2012-10-30 | 2017-05-17 | 宸鸿科技(厦门)有限公司 | 触控面板 |
| US8941128B2 (en) * | 2012-11-21 | 2015-01-27 | Intel Corporation | Passivation layer for flexible display |
| US9310626B2 (en) * | 2013-03-15 | 2016-04-12 | Johnson & Johnson Vision Care, Inc. | Ophthalmic devices with organic semiconductor transistors |
| US9817525B2 (en) * | 2013-07-15 | 2017-11-14 | Novatek Microelectronics Corp. | Touch panel |
| JP2015053411A (ja) * | 2013-09-09 | 2015-03-19 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、および電子機器 |
| CN103681875A (zh) * | 2013-12-26 | 2014-03-26 | 南京中电熊猫液晶显示科技有限公司 | 一种具有修复功能的切换薄膜电晶体 |
| CN104505365B (zh) * | 2014-12-25 | 2017-06-30 | 中国电子科技集团公司第二十九研究所 | 一种制作含侧面图形的陶瓷薄膜电路的方法及高精度夹持装置 |
| CN107204375B (zh) * | 2017-05-19 | 2019-11-26 | 深圳市华星光电技术有限公司 | 薄膜晶体管及其制作方法 |
| TWI736695B (zh) * | 2017-10-24 | 2021-08-21 | 啟耀光電股份有限公司 | 電子裝置與其製造方法 |
| US10782606B2 (en) * | 2018-06-29 | 2020-09-22 | Globalfoundries Inc. | Photolithography methods and structures that reduce stochastic defects |
| CN109346482B (zh) * | 2018-09-30 | 2024-01-05 | 武汉华星光电技术有限公司 | 薄膜晶体管阵列基板及其制造方法、显示面板 |
| US11259402B1 (en) | 2020-09-08 | 2022-02-22 | United States Of America As Represented By The Secretary Of The Air Force | Fabrication of electrical and/or optical crossover signal lines through direct write deposition techniques |
| TWI893770B (zh) * | 2024-04-18 | 2025-08-11 | 友達光電股份有限公司 | 顯示裝置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0892028A2 (en) * | 1997-07-16 | 1999-01-20 | Seiko Epson Corporation | Composition for an organic el element and method of manufacturing the organic el element |
| WO1999019900A2 (en) * | 1997-10-14 | 1999-04-22 | Patterning Technologies Limited | Method of forming an electronic device |
| WO1999053371A1 (en) * | 1998-04-10 | 1999-10-21 | E-Ink Corporation | Electronic displays using organic-based field effect transistors |
| WO2001008242A1 (en) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Preferred methods for producing electrical circuit elements used to control an electronic display |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3332822B2 (ja) | 1997-09-05 | 2002-10-07 | キヤノン株式会社 | カラーフィルタ基板の製造方法 |
| US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
| AU3203099A (en) * | 1998-03-27 | 1999-10-18 | Trustees Of Princeton University, The | Method for making multilayer thin-film electronics |
| TW410478B (en) | 1998-05-29 | 2000-11-01 | Lucent Technologies Inc | Thin-film transistor monolithically integrated with an organic light-emitting diode |
| WO2001017029A1 (en) | 1999-08-31 | 2001-03-08 | E Ink Corporation | Transistor for an electronically driven display |
| GB9929614D0 (en) * | 1999-12-15 | 2000-02-09 | Koninkl Philips Electronics Nv | Method of manufacturing a transistor |
| WO2001047045A1 (en) * | 1999-12-21 | 2001-06-28 | Plastic Logic Limited | Solution processing |
| GB2379412A (en) * | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Deposition of soluble materials |
-
2002
- 2002-05-17 GB GB0211424A patent/GB2388709A/en not_active Withdrawn
-
2003
- 2003-05-19 JP JP2004506090A patent/JP4165507B2/ja not_active Expired - Fee Related
- 2003-05-19 TW TW092113498A patent/TWI253178B/zh not_active IP Right Cessation
- 2003-05-19 KR KR1020047000479A patent/KR100606182B1/ko not_active Expired - Fee Related
- 2003-05-19 CN CN03800694.4A patent/CN100472793C/zh not_active Expired - Fee Related
- 2003-05-19 AU AU2003227947A patent/AU2003227947A1/en not_active Abandoned
- 2003-05-19 US US10/482,101 patent/US7198885B2/en not_active Expired - Fee Related
- 2003-05-19 EP EP03725412A patent/EP1456887A1/en not_active Withdrawn
- 2003-05-19 WO PCT/GB2003/002131 patent/WO2003098696A1/en not_active Ceased
-
2008
- 2008-04-18 JP JP2008108667A patent/JP2008235919A/ja not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0892028A2 (en) * | 1997-07-16 | 1999-01-20 | Seiko Epson Corporation | Composition for an organic el element and method of manufacturing the organic el element |
| WO1999019900A2 (en) * | 1997-10-14 | 1999-04-22 | Patterning Technologies Limited | Method of forming an electronic device |
| WO1999053371A1 (en) * | 1998-04-10 | 1999-10-21 | E-Ink Corporation | Electronic displays using organic-based field effect transistors |
| WO2001008242A1 (en) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Preferred methods for producing electrical circuit elements used to control an electronic display |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361594B2 (en) | 2003-11-19 | 2008-04-22 | Seiko Epson Corporation | Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus |
| WO2008041027A1 (en) * | 2006-10-03 | 2008-04-10 | Plastic Logic Limited | Distortion-tolerant processing |
| US8859312B2 (en) | 2006-10-03 | 2014-10-14 | Plastic Logic Limited | Distortion tolerant processing |
| US9287326B2 (en) | 2006-10-03 | 2016-03-15 | Flexenable Limited | Distortion tolerant processing |
| WO2009083438A1 (fr) * | 2007-12-21 | 2009-07-09 | The Swatch Group Research And Development Ltd | Dispositif d ' affichage a matrice active ayant un transistor organique a couches minces |
| WO2011124792A1 (fr) * | 2010-04-08 | 2011-10-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procédé de fabrication de deux zones adjacentes en matériaux différents |
| FR2958561A1 (fr) * | 2010-04-08 | 2011-10-14 | Commissariat Energie Atomique | Procede de fabrication de deux zones adjacentes en materiaux differents |
| US8889473B2 (en) | 2010-04-08 | 2014-11-18 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for manufacturing two adjacent areas made of different materials |
| JP2012169502A (ja) * | 2011-02-15 | 2012-09-06 | Fuji Xerox Co Ltd | 電子素子及びその製造方法 |
| US10585456B2 (en) | 2015-08-26 | 2020-03-10 | Lg Display Co., Ltd. | Flexible display device having bending sensing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005531134A (ja) | 2005-10-13 |
| US20040235227A1 (en) | 2004-11-25 |
| JP4165507B2 (ja) | 2008-10-15 |
| EP1456887A1 (en) | 2004-09-15 |
| AU2003227947A1 (en) | 2003-12-02 |
| US7198885B2 (en) | 2007-04-03 |
| KR100606182B1 (ko) | 2006-08-01 |
| TW200400644A (en) | 2004-01-01 |
| TWI253178B (en) | 2006-04-11 |
| CN100472793C (zh) | 2009-03-25 |
| GB0211424D0 (en) | 2002-06-26 |
| JP2008235919A (ja) | 2008-10-02 |
| WO2003098696A1 (en) | 2003-11-27 |
| KR20040015806A (ko) | 2004-02-19 |
| CN1533607A (zh) | 2004-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7198885B2 (en) | Circuit fabrication method | |
| Burns et al. | Inkjet printing of polymer thin-film transistor circuits | |
| US7781760B2 (en) | Thin film transistor, electro-optical device, and electronic apparatus | |
| US8139005B2 (en) | Display device | |
| EP2059957B1 (en) | Organic thin film transistor | |
| RU2499326C2 (ru) | Конфигурация смещенного верхнего пиксельного электрода | |
| US7977144B2 (en) | Thin film transistor array panel and manufacture thereof | |
| CN100552517C (zh) | 有源矩阵基板及其制造方法、电光学装置、电子器件 | |
| US7786484B2 (en) | Display device having a portion of a pixel circuit exposed by a connection hole | |
| US20070295960A1 (en) | Semiconductor device, electro-optical device, electronic apparatus, and method of producing semiconductor device | |
| US10930726B2 (en) | Display substrate and preparation method thereof, display panel, and display device | |
| KR101186966B1 (ko) | 유기 트랜지스터를 제조하기 위한 자체-정렬 공정 | |
| CN100505186C (zh) | 垂直薄膜晶体管的制造方法 | |
| Rogers | Printing Techniques and Plastic Electronics for Paperlike Displays |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |