GB2375880A - A conductor for a cryogenic device - Google Patents
A conductor for a cryogenic device Download PDFInfo
- Publication number
- GB2375880A GB2375880A GB0206371A GB0206371A GB2375880A GB 2375880 A GB2375880 A GB 2375880A GB 0206371 A GB0206371 A GB 0206371A GB 0206371 A GB0206371 A GB 0206371A GB 2375880 A GB2375880 A GB 2375880A
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- Prior art keywords
- conductor
- coating
- thickness
- alloy
- noble metal
- Prior art date
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- 239000004020 conductor Substances 0.000 title claims abstract description 64
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 17
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910001020 Au alloy Inorganic materials 0.000 claims description 6
- 239000003353 gold alloy Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Non-Insulated Conductors (AREA)
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
A metallic conductor 3 is described comprising an inner conductor 1 and a coating 2 of a noble metal or an alloy of a noble metal and at least one sub-group element, the thick-ness of the inner conductor D being from 1 mm to 0.01 mm and the thickness of the coating d being from 1 m to 1 nm. A cryogenic device having such a conductor is also described.
Description
Metallic conductor and cryogenic device The present invention relates to a
metallic conductor containing a noble metal and to a cryogenic device compris-
ing at least one such electrical conductor.
Metallic conductors containing a noble metal in the form of a pure metal or an alloy are already known in principle from JP 52 05 18 57, JP 11 24 31 11 and from EP O 967 635. That prior art also deals in particular with the problems of
bonding such metallic conductors, which can be provided for by suitable coatings.
However, a special problem arises in the case of metallic conductors of that type that, on the one hand, are to be disposed between components having different operating temperatures and must therefore, as a rule, have a low thermal conductivity and that, on the other hand, are never-
theless to be solderable. An example of such components having different operating temperatures are cryogenic devices in which at least one component is maintained at a very low temperature level. If, for example, wires of steel, especially high-grade steel, are used, although they have a low thermal conductivity and do not corrode, they are never-
theless not easy to solder as a rule and can be connected to the corresponding components only by welding. If high-grade steel wires are to be rendered solderable, the high-grade steel wire has hitherto been treated with a fluxing agent (chloride) and a special solder. However, as a result of that treatment, the wire is no longer protected against corrosion at the places that have been treated and the solder connection is therefore subject to a high risk of wear through corrosion.
Although a metallic conductor can be rendered solderable as a result of coating, as indicated in the prior art, the
problem nevertheless arises that the thermal conductivity of the metallic conductor is increased by the coating and there is therefore an increased heat flow by way of the conductor.
The problem addressed by the present invention is therefore to provide a metallic conductor which, on the one hand, exhibits good solderability without detrimental effects, especially with regard to resistance to corrosion, and which, on the other hand, continues to have as low a thermal conductivity as possible.
The problem is solved by the features of patent claim 1.
Claim 1 includes a metallic conductor which has an inner
conductor and a coating of a noble metal or an alloy of a noble metal and at least one sub-group element. The coating renders the metallic conductor solderable. The coating may cover the inner conductor over the entire extent of the conductor but it may also cover only those partial regions of the inner conductor at which soldering is to be carried out. The conductor is then solderable at any desired place having a coating, without any additional treatment. The retention of as low a thermal conductivity as possible is achieved by a suitable choice of the thickness ratios of the conductor and the coating, the thickness (that is to say, the diameter in the case of round conductors) of the inner conductor being from 1 mm to 0.01 mm and the thickness of the coating being from 1 Am to 1 am. Owing to the distinctly thinner coating compared with the conductor, the thermal conductivity of the conductor is altered only slightly. This is particularly true when, instead of a pure noble metal, an alloy of a noble metal with at least one sub-group element
is used, because such an alloy still has low thermal conduc-
tivity precisely also at lower temperatures.
In particular, it may be provided that the thickness of the inner conductor is from 0.5 mm to 0.05 mm and the thickness of the coating is from 100 am to 1 em. For example, the thickness of the inner conductor may be from 1000 times to 5000 times the thickness of the coating.
It is possible to provide, for example, gold as the noble metal for the coating but other noble metals are in princi-
ple also possible. It is, however, also possible to provide for the coating an alloy of a noble metal and at least one element of a sub-group, especially the eighth sub-group (Fe, Co, Ni, Ru, Rh, Pd. Os, It, Pt). In that case, for example, a gold alloy may be provided as the noble metal alloy but other noble metal alloys are in principle also possible. Any suitable material having low thermal conductivity and suffi-
cient electrical conductivity may be used for the inner conductor. In particular, the conductor may comprise steel, for example high-grade steel.
The present invention relates also to a cryogenic device comprising at least one metallic conductor as described above within the framework of the invention. Such a cryogenic device, which may be produced, for example, in the field of cryophysics, aerospace technology, medical technol-
ogy or the like, has at least one component that has a distinctly lower temperature than other components of the device. Examples are devices that use liquid gases at low temperature as operating or cooling media. The field of use
of the metallic conductors can extend to temperatures of the colder components of less than 100 K, possibly even to temperatures of less than 50 K. It is precisely here that
metallic conductors having a low thermal conductivity are especially important.
A specific embodiment is described hereinafter with refer-
ence to Figure 1.
Figure 1: diagrammatic representation, which is not to scale, of a crosssection through a conductor according to the invention.
A metallic conductor 3, which is shown diagrammatically in Figure 1 in a representation which is not to scale, is designed specifically for uses where components having distinctly different operating temperatures are present, such as especially in cryogenic devices. An example are uses in aerospace technology where, for example, cryogenic satel-
lite payloads or containers for cryogenic fuels form a component of a spacecraft. However, the conductor 3 may also be used in other cryogenic devices. The conductor 3 may be constructed to be round, as in Figure 1, but it may also be in any other suitable form, for example, flattened.
The conductor 3 has an inner conductor 1 of high-grade steel. High-grade steel has sufficient electrical conductiv-
ity while at the same time having low thermal conductivity.
In order to render the conductor 3 solderable, a coating 2 is provided on the inner conductor 1, the coating comprising gold or an alloy of gold and an element of the eighth sub-group. Up to a temperature of approximately 80 K, the influence of a gold coating on the thermal conductivity of the conductor 3 is slight, so that, at temperatures in the cryogenic device up to that range, instead of a gold alloy, a coating of gold may also be selected. If, however, lower temperatures are to be provided in the cryogenic device, it
must be borne in mind that the thermal conductivity of gold increases below 80 K, especially below 40 K. If such temperatures are to be provided, it has been found to be advantageous to provide alloys of gold and at least one sub-group element because they have a lower thermal conduc-
tivity than pure gold even in the range below 80 K. An example of such an alloy is an alloy of gold and cobalt or a similar sub-group element, the alloy containing, in addition to pure gold, for example, up to 5% of the sub-group element, especially a maximum of 1% of the sub-group element. The optimum combination of solderability, on the one hand, and low thermal conductivity, on the other hand, is achieved by the skilful choice of the thickness ratios of the thick-
ness D of the inner conductor and the thickness d of the coating. It is especially provided that the inner conductor has a thickness in the range of tenths of a millimetre and the coating has a thickness in the range of a few nanometres up to approximately one hundred nanometres. For example, the thickness of the inner conductor may be from 1000 times to 5000 times the thickness of the coating. For example, a thickness of the inner conductor of 0.1 mm and a thickness of the coating of from 30 nm to 50 am, especially 40 no, may be provided for.
The electrical conductor so configured is then solderable at any desired place at which a coating 2 has been provided on the inner conductor 1, without additional treatment steps, that is to say, especially without the risks of corrosion which have existed hitherto. In the simplest case, the coating 2 may cover the entire inner conductor 1. It may, however, also be provided only on specific portions of the inner conductor 1 which are then intended for soldering. The
advantages of using such a conductor 3 are, in particular, simple manufacture, for example, of measuring connections in cryogenic apparatuses, such as, for example, those used in medical technology, and, owing to the low thermal conductiv-
ity, a reduction in operating costs because, for example, cryogenic fluids are heated to a lesser extent in the contacted components, that is to say, the cryogenic fluids are consumed to a lesser extent.
Claims (8)
1. Metallic conductor, comprising an inner conductor and a coating of a noble metal or an alloy of a noble metal and at least one sub-group element, the thickness of the inner conductor being from about 1 mm to about 0.01 mm and the thickness of the coating being from about 1 Em to about 1 am.
2. Metallic conductor according to claim 1, wherein the thickness of the inner conductor is from about 0.5 mm to about 0.05 mm and the thickness of the coating is from about 100 nm to about 1 nm.
3. Metallic conductor according to claim 1 or 2, wherein the coating comprises gold.
4. Metallic conductor according to claim 1 or 2, wherein the coating comprises an alloy of a noble metal and at least one element of the eighth sub-group (Fe, Co, Ni, Ru, Rh, Pd.
Os, Ir, Pt).
5. Metallic conductor according to claim 4, wherein a gold alloy is provided as the noble metal alloy.
6. Metallic conductor according to any one of claims 1 to 5, wherein the inner conductor comprises steel.
7. Cryogenic device, comprising a metallic conductor according to any one of claims 1 to 6.
8. Metallic conductor or cryogenic device, substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10113492A DE10113492B4 (en) | 2001-03-19 | 2001-03-19 | Electrically conductive wire for applications in low temperature ranges |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0206371D0 GB0206371D0 (en) | 2002-05-01 |
GB2375880A true GB2375880A (en) | 2002-11-27 |
GB2375880A9 GB2375880A9 (en) | 2002-12-19 |
Family
ID=7678214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0206371A Withdrawn GB2375880A (en) | 2001-03-19 | 2002-03-18 | A conductor for a cryogenic device |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE10113492B4 (en) |
FR (1) | FR2822288A1 (en) |
GB (1) | GB2375880A (en) |
IT (1) | ITMI20020483A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006073206A1 (en) * | 2005-01-05 | 2006-07-13 | Nippon Steel Materials Co., Ltd. | Bonding wire for semiconductor device |
CN105810652A (en) * | 2015-01-19 | 2016-07-27 | Mk电子株式会社 | Bonding wire |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128232A (en) * | 1983-12-14 | 1985-07-09 | Furukawa Electric Co Ltd:The | Electrical contact material |
JPH0266101A (en) * | 1988-09-01 | 1990-03-06 | Matsushita Electric Ind Co Ltd | Electric conductive particles and manufacture thereof |
JPH0412402A (en) * | 1990-04-27 | 1992-01-17 | Fujikura Ltd | Extremely thin conductor and extremely thin enamel wire |
JPH0547294A (en) * | 1990-10-18 | 1993-02-26 | Sumitomo Electric Ind Ltd | Conductor for fuse |
US5486721A (en) * | 1993-04-10 | 1996-01-23 | W.C. Heraeus Gmbh | Lead frame for integrated circuits |
US5981090A (en) * | 1996-02-20 | 1999-11-09 | Berkenhoff Gmbh | Pins for electronic assemblies |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5621354A (en) * | 1979-07-30 | 1981-02-27 | Tanaka Kikinzoku Kogyo Kk | Bonding wire for semiconductor element |
JPS56118344A (en) * | 1980-02-23 | 1981-09-17 | Toshiba Corp | Bonding wire |
JPS6297360A (en) * | 1985-10-24 | 1987-05-06 | Mitsubishi Metal Corp | Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device |
EP0481493B1 (en) * | 1990-10-18 | 1996-02-07 | Sumitomo Electric Industries, Limited | Fuse Conductor |
DE4125980A1 (en) * | 1991-08-06 | 1993-02-11 | Heraeus Sensor Gmbh | Temp.-resistant connector wire - consists of a highly conductive core and a platinum@-rich mantle into which gold@ has been diffused to allow easier connection |
US5704993A (en) * | 1995-10-10 | 1998-01-06 | The Regents Of The Univerisity Of California, Office Of Technology Transfer | High conductivity composite metal |
JPH11243111A (en) * | 1998-02-25 | 1999-09-07 | Noge Denki Kogyo:Kk | Gold-plated bonding wire and manufacture thereof |
DE19827521C1 (en) * | 1998-06-22 | 1999-07-29 | Heraeus Gmbh W C | Aluminum wire bonded to a substrate having a bondable metallic coating |
-
2001
- 2001-03-19 DE DE10113492A patent/DE10113492B4/en not_active Expired - Fee Related
-
2002
- 2002-03-08 IT IT2002MI000483A patent/ITMI20020483A1/en unknown
- 2002-03-18 GB GB0206371A patent/GB2375880A/en not_active Withdrawn
- 2002-03-19 FR FR0203390A patent/FR2822288A1/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60128232A (en) * | 1983-12-14 | 1985-07-09 | Furukawa Electric Co Ltd:The | Electrical contact material |
JPH0266101A (en) * | 1988-09-01 | 1990-03-06 | Matsushita Electric Ind Co Ltd | Electric conductive particles and manufacture thereof |
JPH0412402A (en) * | 1990-04-27 | 1992-01-17 | Fujikura Ltd | Extremely thin conductor and extremely thin enamel wire |
JPH0547294A (en) * | 1990-10-18 | 1993-02-26 | Sumitomo Electric Ind Ltd | Conductor for fuse |
US5486721A (en) * | 1993-04-10 | 1996-01-23 | W.C. Heraeus Gmbh | Lead frame for integrated circuits |
US5981090A (en) * | 1996-02-20 | 1999-11-09 | Berkenhoff Gmbh | Pins for electronic assemblies |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006073206A1 (en) * | 2005-01-05 | 2006-07-13 | Nippon Steel Materials Co., Ltd. | Bonding wire for semiconductor device |
US7820913B2 (en) | 2005-01-05 | 2010-10-26 | Nippon Steel Materials Co., Ltd. | Bonding wire for semiconductor device |
CN105810652A (en) * | 2015-01-19 | 2016-07-27 | Mk电子株式会社 | Bonding wire |
Also Published As
Publication number | Publication date |
---|---|
GB2375880A9 (en) | 2002-12-19 |
DE10113492A1 (en) | 2002-10-02 |
ITMI20020483A1 (en) | 2003-09-08 |
ITMI20020483A0 (en) | 2002-03-08 |
DE10113492B4 (en) | 2005-12-01 |
FR2822288A1 (en) | 2002-09-20 |
GB0206371D0 (en) | 2002-05-01 |
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Legal Events
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WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |