GB2375880A - A conductor for a cryogenic device - Google Patents

A conductor for a cryogenic device Download PDF

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Publication number
GB2375880A
GB2375880A GB0206371A GB0206371A GB2375880A GB 2375880 A GB2375880 A GB 2375880A GB 0206371 A GB0206371 A GB 0206371A GB 0206371 A GB0206371 A GB 0206371A GB 2375880 A GB2375880 A GB 2375880A
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United Kingdom
Prior art keywords
conductor
coating
thickness
alloy
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0206371A
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GB2375880A9 (en
GB0206371D0 (en
Inventor
Andreas Grasl
Rudolf Kameter
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Airbus DS GmbH
Original Assignee
Astrium GmbH
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Publication of GB0206371D0 publication Critical patent/GB0206371D0/en
Publication of GB2375880A publication Critical patent/GB2375880A/en
Publication of GB2375880A9 publication Critical patent/GB2375880A9/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/45663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2224/45663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2924/0001—Technical content checked by a classifier
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  • Non-Insulated Conductors (AREA)
  • Insulated Conductors (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Abstract

A metallic conductor 3 is described comprising an inner conductor 1 and a coating 2 of a noble metal or an alloy of a noble metal and at least one sub-group element, the thick-ness of the inner conductor D being from 1 mm to 0.01 mm and the thickness of the coating d being from 1 žm to 1 nm. A cryogenic device having such a conductor is also described.

Description

Metallic conductor and cryogenic device The present invention relates to a
metallic conductor containing a noble metal and to a cryogenic device compris-
ing at least one such electrical conductor.
Metallic conductors containing a noble metal in the form of a pure metal or an alloy are already known in principle from JP 52 05 18 57, JP 11 24 31 11 and from EP O 967 635. That prior art also deals in particular with the problems of
bonding such metallic conductors, which can be provided for by suitable coatings.
However, a special problem arises in the case of metallic conductors of that type that, on the one hand, are to be disposed between components having different operating temperatures and must therefore, as a rule, have a low thermal conductivity and that, on the other hand, are never-
theless to be solderable. An example of such components having different operating temperatures are cryogenic devices in which at least one component is maintained at a very low temperature level. If, for example, wires of steel, especially high-grade steel, are used, although they have a low thermal conductivity and do not corrode, they are never-
theless not easy to solder as a rule and can be connected to the corresponding components only by welding. If high-grade steel wires are to be rendered solderable, the high-grade steel wire has hitherto been treated with a fluxing agent (chloride) and a special solder. However, as a result of that treatment, the wire is no longer protected against corrosion at the places that have been treated and the solder connection is therefore subject to a high risk of wear through corrosion.
Although a metallic conductor can be rendered solderable as a result of coating, as indicated in the prior art, the
problem nevertheless arises that the thermal conductivity of the metallic conductor is increased by the coating and there is therefore an increased heat flow by way of the conductor.
The problem addressed by the present invention is therefore to provide a metallic conductor which, on the one hand, exhibits good solderability without detrimental effects, especially with regard to resistance to corrosion, and which, on the other hand, continues to have as low a thermal conductivity as possible.
The problem is solved by the features of patent claim 1.
Claim 1 includes a metallic conductor which has an inner
conductor and a coating of a noble metal or an alloy of a noble metal and at least one sub-group element. The coating renders the metallic conductor solderable. The coating may cover the inner conductor over the entire extent of the conductor but it may also cover only those partial regions of the inner conductor at which soldering is to be carried out. The conductor is then solderable at any desired place having a coating, without any additional treatment. The retention of as low a thermal conductivity as possible is achieved by a suitable choice of the thickness ratios of the conductor and the coating, the thickness (that is to say, the diameter in the case of round conductors) of the inner conductor being from 1 mm to 0.01 mm and the thickness of the coating being from 1 Am to 1 am. Owing to the distinctly thinner coating compared with the conductor, the thermal conductivity of the conductor is altered only slightly. This is particularly true when, instead of a pure noble metal, an alloy of a noble metal with at least one sub-group element
is used, because such an alloy still has low thermal conduc-
tivity precisely also at lower temperatures.
In particular, it may be provided that the thickness of the inner conductor is from 0.5 mm to 0.05 mm and the thickness of the coating is from 100 am to 1 em. For example, the thickness of the inner conductor may be from 1000 times to 5000 times the thickness of the coating.
It is possible to provide, for example, gold as the noble metal for the coating but other noble metals are in princi-
ple also possible. It is, however, also possible to provide for the coating an alloy of a noble metal and at least one element of a sub-group, especially the eighth sub-group (Fe, Co, Ni, Ru, Rh, Pd. Os, It, Pt). In that case, for example, a gold alloy may be provided as the noble metal alloy but other noble metal alloys are in principle also possible. Any suitable material having low thermal conductivity and suffi-
cient electrical conductivity may be used for the inner conductor. In particular, the conductor may comprise steel, for example high-grade steel.
The present invention relates also to a cryogenic device comprising at least one metallic conductor as described above within the framework of the invention. Such a cryogenic device, which may be produced, for example, in the field of cryophysics, aerospace technology, medical technol-
ogy or the like, has at least one component that has a distinctly lower temperature than other components of the device. Examples are devices that use liquid gases at low temperature as operating or cooling media. The field of use
of the metallic conductors can extend to temperatures of the colder components of less than 100 K, possibly even to temperatures of less than 50 K. It is precisely here that
metallic conductors having a low thermal conductivity are especially important.
A specific embodiment is described hereinafter with refer-
ence to Figure 1.
Figure 1: diagrammatic representation, which is not to scale, of a crosssection through a conductor according to the invention.
A metallic conductor 3, which is shown diagrammatically in Figure 1 in a representation which is not to scale, is designed specifically for uses where components having distinctly different operating temperatures are present, such as especially in cryogenic devices. An example are uses in aerospace technology where, for example, cryogenic satel-
lite payloads or containers for cryogenic fuels form a component of a spacecraft. However, the conductor 3 may also be used in other cryogenic devices. The conductor 3 may be constructed to be round, as in Figure 1, but it may also be in any other suitable form, for example, flattened.
The conductor 3 has an inner conductor 1 of high-grade steel. High-grade steel has sufficient electrical conductiv-
ity while at the same time having low thermal conductivity.
In order to render the conductor 3 solderable, a coating 2 is provided on the inner conductor 1, the coating comprising gold or an alloy of gold and an element of the eighth sub-group. Up to a temperature of approximately 80 K, the influence of a gold coating on the thermal conductivity of the conductor 3 is slight, so that, at temperatures in the cryogenic device up to that range, instead of a gold alloy, a coating of gold may also be selected. If, however, lower temperatures are to be provided in the cryogenic device, it
must be borne in mind that the thermal conductivity of gold increases below 80 K, especially below 40 K. If such temperatures are to be provided, it has been found to be advantageous to provide alloys of gold and at least one sub-group element because they have a lower thermal conduc-
tivity than pure gold even in the range below 80 K. An example of such an alloy is an alloy of gold and cobalt or a similar sub-group element, the alloy containing, in addition to pure gold, for example, up to 5% of the sub-group element, especially a maximum of 1% of the sub-group element. The optimum combination of solderability, on the one hand, and low thermal conductivity, on the other hand, is achieved by the skilful choice of the thickness ratios of the thick-
ness D of the inner conductor and the thickness d of the coating. It is especially provided that the inner conductor has a thickness in the range of tenths of a millimetre and the coating has a thickness in the range of a few nanometres up to approximately one hundred nanometres. For example, the thickness of the inner conductor may be from 1000 times to 5000 times the thickness of the coating. For example, a thickness of the inner conductor of 0.1 mm and a thickness of the coating of from 30 nm to 50 am, especially 40 no, may be provided for.
The electrical conductor so configured is then solderable at any desired place at which a coating 2 has been provided on the inner conductor 1, without additional treatment steps, that is to say, especially without the risks of corrosion which have existed hitherto. In the simplest case, the coating 2 may cover the entire inner conductor 1. It may, however, also be provided only on specific portions of the inner conductor 1 which are then intended for soldering. The
advantages of using such a conductor 3 are, in particular, simple manufacture, for example, of measuring connections in cryogenic apparatuses, such as, for example, those used in medical technology, and, owing to the low thermal conductiv-
ity, a reduction in operating costs because, for example, cryogenic fluids are heated to a lesser extent in the contacted components, that is to say, the cryogenic fluids are consumed to a lesser extent.

Claims (8)

r CLAIMS
1. Metallic conductor, comprising an inner conductor and a coating of a noble metal or an alloy of a noble metal and at least one sub-group element, the thickness of the inner conductor being from about 1 mm to about 0.01 mm and the thickness of the coating being from about 1 Em to about 1 am.
2. Metallic conductor according to claim 1, wherein the thickness of the inner conductor is from about 0.5 mm to about 0.05 mm and the thickness of the coating is from about 100 nm to about 1 nm.
3. Metallic conductor according to claim 1 or 2, wherein the coating comprises gold.
4. Metallic conductor according to claim 1 or 2, wherein the coating comprises an alloy of a noble metal and at least one element of the eighth sub-group (Fe, Co, Ni, Ru, Rh, Pd.
Os, Ir, Pt).
5. Metallic conductor according to claim 4, wherein a gold alloy is provided as the noble metal alloy.
6. Metallic conductor according to any one of claims 1 to 5, wherein the inner conductor comprises steel.
7. Cryogenic device, comprising a metallic conductor according to any one of claims 1 to 6.
8. Metallic conductor or cryogenic device, substantially as hereinbefore described with reference to the accompanying drawing.
GB0206371A 2001-03-19 2002-03-18 A conductor for a cryogenic device Withdrawn GB2375880A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10113492A DE10113492B4 (en) 2001-03-19 2001-03-19 Electrically conductive wire for applications in low temperature ranges

Publications (3)

Publication Number Publication Date
GB0206371D0 GB0206371D0 (en) 2002-05-01
GB2375880A true GB2375880A (en) 2002-11-27
GB2375880A9 GB2375880A9 (en) 2002-12-19

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Application Number Title Priority Date Filing Date
GB0206371A Withdrawn GB2375880A (en) 2001-03-19 2002-03-18 A conductor for a cryogenic device

Country Status (4)

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DE (1) DE10113492B4 (en)
FR (1) FR2822288A1 (en)
GB (1) GB2375880A (en)
IT (1) ITMI20020483A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006073206A1 (en) * 2005-01-05 2006-07-13 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
CN105810652A (en) * 2015-01-19 2016-07-27 Mk电子株式会社 Bonding wire

Citations (6)

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GB2375880A9 (en) 2002-12-19
DE10113492A1 (en) 2002-10-02
ITMI20020483A1 (en) 2003-09-08
ITMI20020483A0 (en) 2002-03-08
DE10113492B4 (en) 2005-12-01
FR2822288A1 (en) 2002-09-20
GB0206371D0 (en) 2002-05-01

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