JPS6297360A - Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device - Google Patents

Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device

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Publication number
JPS6297360A
JPS6297360A JP60237901A JP23790185A JPS6297360A JP S6297360 A JPS6297360 A JP S6297360A JP 60237901 A JP60237901 A JP 60237901A JP 23790185 A JP23790185 A JP 23790185A JP S6297360 A JPS6297360 A JP S6297360A
Authority
JP
Japan
Prior art keywords
minute
impurity
coated
copper wire
whose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60237901A
Other languages
Japanese (ja)
Inventor
Kiyoshi Furukawa
Tamotsu Mori
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60237901A priority Critical patent/JPS6297360A/en
Publication of JPS6297360A publication Critical patent/JPS6297360A/en
Pending legal-status Critical Current

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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
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    • H01—BASIC ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
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    • H01—BASIC ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01205—5N purity grades, i.e. 99.999%
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Abstract

PURPOSE:To prevent oxidation of a surface, by forming a film of noble metal or corrosion resisting metal on the surface of minute high impurity copper wire having the specified value of impurity. CONSTITUTION:On the surface of minute high impurity copper wire having the impurity of 99.999% or higher, a film, which comprises noble metal such as alloy, whose main components are Au, Ag, Pt, Pd, and corrosion resisting metal, whose main components are Ni, Co, Cr, Ti, is formed. The surface property of the surface-coated minute high impurity copper is excellent. There is almost no time change. Even after bonding, stable performances can be obtained.
JP60237901A 1985-10-24 1985-10-24 Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device Pending JPS6297360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60237901A JPS6297360A (en) 1985-10-24 1985-10-24 Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60237901A JPS6297360A (en) 1985-10-24 1985-10-24 Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6297360A true JPS6297360A (en) 1987-05-06

Family

ID=17022106

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Application Number Title Priority Date Filing Date
JP60237901A Pending JPS6297360A (en) 1985-10-24 1985-10-24 Minute high impurity copper wire, whose surface is coated, for bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6297360A (en)

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EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc Electrical contact structures from flexible wire
US6068917A (en) * 1996-03-29 2000-05-30 Ngk Insulators, Ltd. Composite metallic wire and magnetic head using said composite metal wire
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
FR2822288A1 (en) * 2001-03-19 2002-09-20 Astrium Gmbh Cryogenic installation metallic superconductor having central conductor width between 1 and 0.01 mm and precious metal/precious metal alloy width between 1 micron and 1 nm
WO2003036710A1 (en) * 2001-10-23 2003-05-01 Sumitomo Electric Wintec, Incorporated Bonding wire
JPWO2002023618A1 (en) * 2000-09-18 2004-01-22 新日本製鐵株式会社 Semiconductor bonding wire and method of manufacturing the same
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
WO2006073206A1 (en) * 2005-01-05 2006-07-13 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
JP2006216929A (en) * 2005-01-05 2006-08-17 Nippon Steel Corp Bonding wire for semiconductor device
JP2006520103A (en) * 2003-03-10 2006-08-31 フェアチャイルド・セミコンダクター・コーポレーション Flip chip coated metal stud bumps made of coated wire
JP2007502737A (en) * 2003-08-18 2007-02-15 コンチネンタル・テベス・アーゲー・ウント・コンパニー・オーハーゲー Cylinders especially for vehicle hydraulic brake systems
WO2009014168A1 (en) 2007-07-24 2009-01-29 Nippon Steel Materials Co., Ltd. Semiconductor device bonding wire and wire bonding method
WO2009093554A1 (en) 2008-01-25 2009-07-30 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
KR100926932B1 (en) * 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 Semiconductor package having copper wire prevented from oxidation and manufacturing method thereof
JP2010062395A (en) * 2008-09-04 2010-03-18 Sumitomo Metal Mining Co Ltd Copper bonding wire
JP2010199528A (en) * 2009-01-27 2010-09-09 Tatsuta System Electronics Kk Bonding wire
WO2010109693A1 (en) * 2009-03-23 2010-09-30 田中電子工業株式会社 Coated copper wire for ball bonding
US7812358B2 (en) 2005-09-13 2010-10-12 Showa Denko K.K. Light-emitting device
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US9331049B2 (en) 2008-07-11 2016-05-03 Nippon Steel & Sumikin Materials Co., Ltd. Bonding structure of bonding wire
KR101659254B1 (en) 2015-07-23 2016-09-22 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 Bonding wire for semiconductor device
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US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc Electrical contact structures from flexible wire
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6068917A (en) * 1996-03-29 2000-05-30 Ngk Insulators, Ltd. Composite metallic wire and magnetic head using said composite metal wire
US6180890B1 (en) 1996-03-29 2001-01-30 Ngk Insulators, Ltd. Composite type magnetic head using composite metallic wire
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