GB1561620A - Method of producingcomposite rigid-flexible printed-circuit - Google Patents

Method of producingcomposite rigid-flexible printed-circuit Download PDF

Info

Publication number
GB1561620A
GB1561620A GB4940477A GB4940477A GB1561620A GB 1561620 A GB1561620 A GB 1561620A GB 4940477 A GB4940477 A GB 4940477A GB 4940477 A GB4940477 A GB 4940477A GB 1561620 A GB1561620 A GB 1561620A
Authority
GB
United Kingdom
Prior art keywords
rigid
flexible
layers
printed
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4940477A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoeller and Co Elektronik GmbH
Original Assignee
Schoeller and Co Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller and Co Elektronik GmbH filed Critical Schoeller and Co Elektronik GmbH
Publication of GB1561620A publication Critical patent/GB1561620A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
GB4940477A 1976-12-17 1977-11-28 Method of producingcomposite rigid-flexible printed-circuit Expired GB1561620A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762657212 DE2657212C3 (de) 1976-12-17 1976-12-17 Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten

Publications (1)

Publication Number Publication Date
GB1561620A true GB1561620A (en) 1980-02-27

Family

ID=5995786

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4940477A Expired GB1561620A (en) 1976-12-17 1977-11-28 Method of producingcomposite rigid-flexible printed-circuit

Country Status (10)

Country Link
BE (1) BE861966A (it)
CH (1) CH630202A5 (it)
DE (1) DE2657212C3 (it)
DK (1) DK142475C (it)
FR (1) FR2374818A1 (it)
GB (1) GB1561620A (it)
IE (1) IE46109B1 (it)
IT (1) IT1091374B (it)
NL (1) NL180294C (it)
SE (1) SE424132B (it)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2207288A (en) * 1987-06-30 1989-01-25 Nippon Mektron Kk A method of producing a hybrid multi-layered circuit substrate
GB2231205A (en) * 1989-05-01 1990-11-07 Ibiden Co Ltd Method of manufacturing circuit board for mounting electronic components
CN113286437A (zh) * 2021-06-11 2021-08-20 四川英创力电子科技股份有限公司 一种加工软硬结合板的辅助装置及其使用方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946726C2 (de) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
DE3047197C1 (de) * 1980-12-15 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Leiterplatten,die abschnittsweise relativ starre und demgegenueber relativ flexible Bereiche aufweisen
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
DE3140061C1 (de) * 1981-10-08 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
DE3318717C1 (de) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Verfahren zum Herstellen von Leiterplatten mit starren und flexiblen Bereichen
DE3434672C2 (de) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
DE3535773C1 (en) * 1985-10-07 1987-04-23 Messerschmitt Boelkow Blohm Method for producing rigid-flexible multilayer circuits
DE3624718A1 (de) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik Mehrlagige, starre und flexible bereiche aufweisende leiterplatte
DE3624719A1 (de) * 1986-07-22 1988-01-28 Schoeller & Co Elektronik Vorlaminat fuer starr-flexible leiterplatten
DE3723414A1 (de) * 1987-07-15 1989-01-26 Leitron Leiterplatten Verfahren zur herstellung von gedruckten schaltungen in starrer oder starrflexibler mehrlagentechnik
ATE91377T1 (de) * 1989-07-15 1993-07-15 Freudenberg Carl Fa Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen.
DE4003344C1 (it) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003345C1 (it) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4131934A1 (de) * 1991-09-25 1993-04-08 Degussa Verfahren zur herstellung von starren, in teilbereichen biegbaren gedruckten schaltungen
DE4206746C1 (en) * 1992-03-04 1993-06-24 Degussa Ag, 6000 Frankfurt, De Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
US6298013B1 (en) 1993-11-15 2001-10-02 Siemens Aktiengesellschaft Device for monitoring the travel time of mail shipments
DE10248112B4 (de) * 2002-09-09 2007-01-04 Ruwel Ag Verfahren zur Herstellung von gedruckten elektrischen Schaltungen
DE10258090B4 (de) * 2002-09-19 2009-01-29 Ruwel Ag Verfahren zur Herstellung von starr-flexiblen Leiterplatten und Leiterplatten mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
DE20221189U1 (de) * 2002-09-19 2005-05-19 Ruwel Ag Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich
DE10243637B4 (de) 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3459626A (en) * 1964-11-06 1969-08-05 Morgan Adhesives Co Label carrier and release laminate
AT256275B (de) * 1965-06-01 1967-08-10 Philips Nv Leiterplatte, welche entlang einer durch eine Perforation, Einkerbungen od. dgl. festgelegten Bruchlinie bzw. Bruchlinien in mindestens zwei Leiterplattenteile teilbar ist
FR1481461A (fr) * 1965-06-01 1967-05-19 Philips Nv Plaque à câblage imprimé

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2207288A (en) * 1987-06-30 1989-01-25 Nippon Mektron Kk A method of producing a hybrid multi-layered circuit substrate
GB2207288B (en) * 1987-06-30 1991-09-11 Nippon Mektron Kk An improved method of producing a hybrid multi-layered circuit substrate
GB2231205A (en) * 1989-05-01 1990-11-07 Ibiden Co Ltd Method of manufacturing circuit board for mounting electronic components
US5022960A (en) * 1989-05-01 1991-06-11 Ibiden Co., Ltd. Method of manufacturing circuit board for mounting electronic components
GB2231205B (en) * 1989-05-01 1993-08-04 Ibiden Co Ltd Method of manufacturing circuit board for mounting electronic components
CN113286437A (zh) * 2021-06-11 2021-08-20 四川英创力电子科技股份有限公司 一种加工软硬结合板的辅助装置及其使用方法
CN113286437B (zh) * 2021-06-11 2021-10-01 四川英创力电子科技股份有限公司 一种加工软硬结合板的辅助装置及其使用方法

Also Published As

Publication number Publication date
NL180294B (nl) 1986-09-01
FR2374818B1 (it) 1982-05-21
IE46109L (en) 1978-06-17
DK546677A (da) 1978-06-18
SE7714310L (sv) 1978-06-18
DE2657212C3 (de) 1982-09-02
DE2657212B2 (de) 1979-08-09
DK142475C (da) 1981-03-30
DE2657212A1 (de) 1978-06-22
IT1091374B (it) 1985-07-06
CH630202A5 (en) 1982-05-28
NL7713431A (nl) 1978-06-20
SE424132B (sv) 1982-06-28
NL180294C (nl) 1987-02-02
DK142475B (da) 1980-11-03
FR2374818A1 (fr) 1978-07-13
BE861966A (fr) 1978-06-16
IE46109B1 (en) 1983-02-23

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951128