GB1558919A - Electrolytic surface treating process for copper foil for use in printed circuit - Google Patents

Electrolytic surface treating process for copper foil for use in printed circuit Download PDF

Info

Publication number
GB1558919A
GB1558919A GB2292677A GB2292677A GB1558919A GB 1558919 A GB1558919 A GB 1558919A GB 2292677 A GB2292677 A GB 2292677A GB 2292677 A GB2292677 A GB 2292677A GB 1558919 A GB1558919 A GB 1558919A
Authority
GB
United Kingdom
Prior art keywords
copper foil
copper
surface treating
treating process
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2292677A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Publication of GB1558919A publication Critical patent/GB1558919A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
GB2292677A 1976-05-31 1977-05-31 Electrolytic surface treating process for copper foil for use in printed circuit Expired GB1558919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Publications (1)

Publication Number Publication Date
GB1558919A true GB1558919A (en) 1980-01-09

Family

ID=13198566

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2292677A Expired GB1558919A (en) 1976-05-31 1977-05-31 Electrolytic surface treating process for copper foil for use in printed circuit

Country Status (4)

Country Link
JP (1) JPS52145769A (enrdf_load_stackoverflow)
DE (1) DE2724074C2 (enrdf_load_stackoverflow)
GB (1) GB1558919A (enrdf_load_stackoverflow)
LU (1) LU77436A1 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935310A (en) * 1980-04-03 1990-06-19 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
GB2285813A (en) * 1994-01-21 1995-07-26 Olin Corp Electrolytic treatment of copper foil to deposit a dark-coloured,nodular layer of copper-nickel alloy to improve bond strength to dielectric substrate
US7344785B2 (en) 2005-05-16 2008-03-18 Hitachi Cable, Ltd. Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
US8524378B2 (en) 2008-11-25 2013-09-03 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US8642893B2 (en) 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
US9060431B2 (en) 2011-06-07 2015-06-16 Jx Nippon Mining & Metals Corporation Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
US9580829B2 (en) 2010-05-07 2017-02-28 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249735U (enrdf_load_stackoverflow) * 1985-09-14 1987-03-27
JP4626390B2 (ja) 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4904933B2 (ja) 2005-09-27 2012-03-28 日立電線株式会社 ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔
MY172093A (en) 2009-12-24 2019-11-13 Jx Nippon Mining & Metals Corp Surface-treated copper foil
US20140057123A1 (en) 2011-03-30 2014-02-27 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487B1 (en) 2011-11-03 2014-05-14 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
TWI526302B (zh) 2012-09-28 2016-03-21 Jx Nippon Mining & Metals Corp The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil
JP6422658B2 (ja) * 2014-02-27 2018-11-14 新光電気工業株式会社 電気めっき浴及び電気めっき方法
CN110537393B (zh) * 2017-04-17 2022-09-20 住友金属矿山株式会社 导电性基板、导电性基板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935310A (en) * 1980-04-03 1990-06-19 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
GB2285813A (en) * 1994-01-21 1995-07-26 Olin Corp Electrolytic treatment of copper foil to deposit a dark-coloured,nodular layer of copper-nickel alloy to improve bond strength to dielectric substrate
GB2285813B (en) * 1994-01-21 1997-12-10 Olin Corp Nodular copper/nickel alloy treatment for copper foil
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
US7344785B2 (en) 2005-05-16 2008-03-18 Hitachi Cable, Ltd. Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
US8642893B2 (en) 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
US8524378B2 (en) 2008-11-25 2013-09-03 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US9580829B2 (en) 2010-05-07 2017-02-28 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US10472728B2 (en) 2010-05-07 2019-11-12 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
US9060431B2 (en) 2011-06-07 2015-06-16 Jx Nippon Mining & Metals Corporation Liquid crystal polymer copper-clad laminate and copper foil used for said laminate

Also Published As

Publication number Publication date
LU77436A1 (enrdf_load_stackoverflow) 1977-09-09
JPS569028B2 (enrdf_load_stackoverflow) 1981-02-26
JPS52145769A (en) 1977-12-05
DE2724074A1 (de) 1977-12-15
DE2724074C2 (de) 1982-05-13

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years

Effective date: 19970530