DE2724074C2 - Verfahren zur Behandlung der Oberfläche von Kupferfolien für gedruckte Schaltungen - Google Patents

Verfahren zur Behandlung der Oberfläche von Kupferfolien für gedruckte Schaltungen

Info

Publication number
DE2724074C2
DE2724074C2 DE19772724074 DE2724074A DE2724074C2 DE 2724074 C2 DE2724074 C2 DE 2724074C2 DE 19772724074 DE19772724074 DE 19772724074 DE 2724074 A DE2724074 A DE 2724074A DE 2724074 C2 DE2724074 C2 DE 2724074C2
Authority
DE
Germany
Prior art keywords
copper
treatment
copper foil
bath
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19772724074
Other languages
German (de)
English (en)
Other versions
DE2724074A1 (de
Inventor
Yoshiu Urawa Saitama Kawasumi
Mitsuo Tokyo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Publication of DE2724074A1 publication Critical patent/DE2724074A1/de
Application granted granted Critical
Publication of DE2724074C2 publication Critical patent/DE2724074C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE19772724074 1976-05-31 1977-05-27 Verfahren zur Behandlung der Oberfläche von Kupferfolien für gedruckte Schaltungen Expired DE2724074C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6238476A JPS52145769A (en) 1976-05-31 1976-05-31 Method of surface treating printed circuit copper foil

Publications (2)

Publication Number Publication Date
DE2724074A1 DE2724074A1 (de) 1977-12-15
DE2724074C2 true DE2724074C2 (de) 1982-05-13

Family

ID=13198566

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772724074 Expired DE2724074C2 (de) 1976-05-31 1977-05-27 Verfahren zur Behandlung der Oberfläche von Kupferfolien für gedruckte Schaltungen

Country Status (4)

Country Link
JP (1) JPS52145769A (enrdf_load_stackoverflow)
DE (1) DE2724074C2 (enrdf_load_stackoverflow)
GB (1) GB1558919A (enrdf_load_stackoverflow)
LU (1) LU77436A1 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6249735U (enrdf_load_stackoverflow) * 1985-09-14 1987-03-27
TW317575B (enrdf_load_stackoverflow) * 1994-01-21 1997-10-11 Olin Corp
JP4492434B2 (ja) 2005-05-16 2010-06-30 日立電線株式会社 プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
JP4626390B2 (ja) 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
JP4904933B2 (ja) 2005-09-27 2012-03-28 日立電線株式会社 ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔
CN101809206B (zh) 2007-09-28 2013-10-02 Jx日矿日石金属株式会社 印刷电路用铜箔及覆铜箔层压板
JP5318886B2 (ja) 2008-11-25 2013-10-16 Ｊｘ日鉱日石金属株式会社 印刷回路用銅箔
MY172093A (en) 2009-12-24 2019-11-13 Jx Nippon Mining & Metals Corp Surface-treated copper foil
SG183311A1 (en) 2010-05-07 2012-09-27 Jx Nippon Mining & Metals Corp Copper foil for printed circuit
US20140057123A1 (en) 2011-03-30 2014-02-27 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit
JP5654416B2 (ja) 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
US9115441B2 (en) 2011-10-18 2015-08-25 Nan Ya Plastics Corporation Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards
EP2590487B1 (en) 2011-11-03 2014-05-14 Nan-Ya Plastics Corporation Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards
TWI526302B (zh) 2012-09-28 2016-03-21 Jx Nippon Mining & Metals Corp The copper foil of the attached carrier and the copper-clad laminate with the attached copper foil
JP6422658B2 (ja) * 2014-02-27 2018-11-14 新光電気工業株式会社 電気めっき浴及び電気めっき方法
CN110537393B (zh) * 2017-04-17 2022-09-20 住友金属矿山株式会社 导电性基板、导电性基板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
GB1558919A (en) 1980-01-09
LU77436A1 (enrdf_load_stackoverflow) 1977-09-09
JPS569028B2 (enrdf_load_stackoverflow) 1981-02-26
JPS52145769A (en) 1977-12-05
DE2724074A1 (de) 1977-12-15

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Legal Events

Date Code Title Description
OD Request for examination
8125 Change of the main classification

Ipc: H05K 3/38

D2 Grant after examination
8327 Change in the person/name/address of the patent owner

Owner name: JAPAN ENERGY CORP., TOKIO/TOKYO, JP