GB1527108A - Methods of forming conductors on substrates involving electroplating - Google Patents

Methods of forming conductors on substrates involving electroplating

Info

Publication number
GB1527108A
GB1527108A GB50291/75A GB5029175A GB1527108A GB 1527108 A GB1527108 A GB 1527108A GB 50291/75 A GB50291/75 A GB 50291/75A GB 5029175 A GB5029175 A GB 5029175A GB 1527108 A GB1527108 A GB 1527108A
Authority
GB
United Kingdom
Prior art keywords
layer
thick
layers
substrate
dec
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50291/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/531,430 external-priority patent/US4068022A/en
Priority claimed from US05/576,711 external-priority patent/US4016050A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1527108A publication Critical patent/GB1527108A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
GB50291/75A 1974-12-10 1975-12-08 Methods of forming conductors on substrates involving electroplating Expired GB1527108A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/531,430 US4068022A (en) 1974-12-10 1974-12-10 Methods of strengthening bonds
US05/576,711 US4016050A (en) 1975-05-12 1975-05-12 Conduction system for thin film and hybrid integrated circuits

Publications (1)

Publication Number Publication Date
GB1527108A true GB1527108A (en) 1978-10-04

Family

ID=27063541

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50291/75A Expired GB1527108A (en) 1974-12-10 1975-12-08 Methods of forming conductors on substrates involving electroplating

Country Status (8)

Country Link
JP (1) JPS6032311B2 (enExample)
DE (1) DE2554691C2 (enExample)
ES (1) ES443346A1 (enExample)
FR (1) FR2294610A1 (enExample)
GB (1) GB1527108A (enExample)
IT (1) IT1051461B (enExample)
NL (1) NL185249C (enExample)
SE (1) SE427400B (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2476913A1 (fr) * 1980-02-25 1981-08-28 Nippon Electric Co Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
EP0060436A1 (de) * 1981-03-02 1982-09-22 Siemens Aktiengesellschaft Verfahren zur Herstellung von lötbaren und temperfähigen edelmetallfreien Dünnschichtleiterbahnen
FR2557755A1 (fr) * 1983-12-28 1985-07-05 Nec Corp Substrat de cablage multi-couche
EP0097833A3 (en) * 1982-06-30 1985-10-30 International Business Machines Corporation Substrate for integrated circuit packages
EP0264648A1 (en) * 1986-09-25 1988-04-27 Kabushiki Kaisha Toshiba Method of producing a film carrier
EP0266877A3 (en) * 1986-09-10 1989-12-13 Engelhard Corporation Metallized substrates and process for their production
EP0526656A4 (en) * 1991-02-25 1993-04-14 Sumitomo Electric Industries, Ltd. Wiring board
EP0675674A1 (en) * 1994-04-01 1995-10-04 AT&T Corp. Film circuit metal system for use with bumped IC packages
EP1429590A4 (en) * 2001-09-21 2007-07-11 Sony Corp THIN FILM PLATE DEVICE AND METHOD FOR THE PRODUCTION THEREOF
CN116093573A (zh) * 2022-12-14 2023-05-09 北京航天微电科技有限公司 一种微带电路制备方法以及微带环隔器

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153518A (en) * 1977-11-18 1979-05-08 Tektronix, Inc. Method of making a metalized substrate having a thin film barrier layer
JPS54127572A (en) * 1978-03-28 1979-10-03 Oki Electric Ind Co Ltd Thin film circuit
DE2833919C2 (de) * 1978-08-02 1982-06-09 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Schichtschaltungen auf Kunststoffolien
JPS5559795A (en) * 1978-10-30 1980-05-06 Nippon Electric Co Printed circuit board and method of manufacturing same
EP0016263B1 (de) * 1979-03-21 1983-07-06 BBC Brown Boveri AG Dünnschichtwiderstand mit grossem Temperaturkoeffizienten und Verfahren zu dessen Herstellung
DE3029277C2 (de) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Aufbau von Metallschichten
DE3029382A1 (de) * 1980-08-01 1982-03-04 Siemens AG, 1000 Berlin und 8000 München Aufbau von metallschichten und verfahren zur herstellung dieses aufbaus
JPS57198696A (en) * 1981-06-01 1982-12-06 Shimada Rika Kogyo Kk Method of producing thin film circuit
DE3207659A1 (de) * 1982-03-03 1983-09-15 Siemens AG, 1000 Berlin und 8000 München Duennfilmschaltungen mit durchkontaktierungen
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
DE3433251A1 (de) * 1984-08-16 1986-02-27 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung von galvanischen lotschichten auf anorganischen substraten
JPH03108797A (ja) * 1989-09-22 1991-05-08 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
DE4017181C2 (de) * 1990-05-29 1998-08-27 Daimler Benz Aerospace Ag Elektrisches Bauelement
DE10004453B4 (de) * 2000-02-03 2009-08-13 Ust Umweltsensortechnik Gmbh Elektrische Sicherung und Verfahren zu deren Herstellung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2108730A1 (en) * 1970-03-06 1971-09-16 Motorola Inc Integrated hybrid circuit

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2476913A1 (fr) * 1980-02-25 1981-08-28 Nippon Electric Co Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
EP0060436A1 (de) * 1981-03-02 1982-09-22 Siemens Aktiengesellschaft Verfahren zur Herstellung von lötbaren und temperfähigen edelmetallfreien Dünnschichtleiterbahnen
EP0097833A3 (en) * 1982-06-30 1985-10-30 International Business Machines Corporation Substrate for integrated circuit packages
EP0270752A1 (en) * 1982-06-30 1988-06-15 International Business Machines Corporation Substrates for integrated circuit packages
FR2557755A1 (fr) * 1983-12-28 1985-07-05 Nec Corp Substrat de cablage multi-couche
EP0266877A3 (en) * 1986-09-10 1989-12-13 Engelhard Corporation Metallized substrates and process for their production
US4808769A (en) * 1986-09-25 1989-02-28 Kabushiki Kaisha Toshiba Film carrier and bonding method using the film carrier
US4857671A (en) * 1986-09-25 1989-08-15 Kabushiki Kaisha Toshiba Film carrier and bonding method using the film carrier
EP0264648A1 (en) * 1986-09-25 1988-04-27 Kabushiki Kaisha Toshiba Method of producing a film carrier
EP0526656A4 (en) * 1991-02-25 1993-04-14 Sumitomo Electric Industries, Ltd. Wiring board
EP0675674A1 (en) * 1994-04-01 1995-10-04 AT&T Corp. Film circuit metal system for use with bumped IC packages
EP1429590A4 (en) * 2001-09-21 2007-07-11 Sony Corp THIN FILM PLATE DEVICE AND METHOD FOR THE PRODUCTION THEREOF
CN116093573A (zh) * 2022-12-14 2023-05-09 北京航天微电科技有限公司 一种微带电路制备方法以及微带环隔器

Also Published As

Publication number Publication date
SE427400B (sv) 1983-03-28
FR2294610A1 (fr) 1976-07-09
NL185249C (nl) 1990-02-16
DE2554691C2 (de) 1982-11-18
DE2554691A1 (de) 1976-06-16
NL185249B (nl) 1989-09-18
JPS51101864A (en) 1976-09-08
SE7513853L (sv) 1976-06-11
ES443346A1 (es) 1977-08-16
FR2294610B1 (enExample) 1980-03-21
IT1051461B (it) 1981-04-21
NL7514325A (nl) 1976-06-14
JPS6032311B2 (ja) 1985-07-27

Similar Documents

Publication Publication Date Title
GB1527108A (en) Methods of forming conductors on substrates involving electroplating
US4810332A (en) Method of making an electrical multilayer copper interconnect
GB1269973A (en) Method of forming a thin film pattern of metal or metal compounds
US2834723A (en) Method of electroplating printed circuits
US4640739A (en) Process of producing galvanic layers of solder of precise contour on inorganic substrates
GB1125394A (en) Thin-film electrical components
GB1248142A (en) Improvements in or relating to electrical circuits assemblies
GB1434766A (en) Micro-miniature electronic components
GB1531327A (en) Thin film circuit assemblies
GB1424980A (en) Thin-film electrical circuits
GB1354956A (en) Process for making a thin film network
US3872356A (en) Thin film electronic circuit unit and method of making the same
JPS59215790A (ja) 印刷回路板の製造法
GB1241574A (en) A method of plating conductive metals on film-forming materials
JPH05267025A (ja) チップ部品の製造法及び電子部品の製造法
US3398032A (en) Method of making cermet resistors by etching
US3487522A (en) Multilayered thin-film intermediates employing parting layers to permit selective,sequential etching
JPH0245996A (ja) 混成集積回路の製造方法
GB980468A (en) Improvements in and relating to electrical circuit elements
US3554876A (en) Process for etching and electro plating a printed circuit
US3634202A (en) Process for the production of thick film conductors and circuits incorporating such conductors
JPS58207696A (ja) パタ−ンめつきによるプリント配線板の製法
GB1136752A (en) Improvements relating to electrical connecting arrangements
JP3018830B2 (ja) 電子部品及びその製造方法
GB1261057A (en) Improvements in or relating to electrolytically reinforced metallic micro-structures

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years

Effective date: 19951207