GB1507115A - Transistor having integrated protection - Google Patents
Transistor having integrated protectionInfo
- Publication number
- GB1507115A GB1507115A GB26343/76A GB2634376A GB1507115A GB 1507115 A GB1507115 A GB 1507115A GB 26343/76 A GB26343/76 A GB 26343/76A GB 2634376 A GB2634376 A GB 2634376A GB 1507115 A GB1507115 A GB 1507115A
- Authority
- GB
- United Kingdom
- Prior art keywords
- junction
- breakdown
- region
- highly doped
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000015556 catabolic process Effects 0.000 abstract 4
- 230000001066 destructive effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/108—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having localised breakdown regions, e.g. built-in avalanching regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/40—Vertical BJTs
- H10D10/441—Vertical BJTs having an emitter-base junction ending at a main surface of the body and a base-collector junction ending at a lateral surface of the body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/177—Base regions of bipolar transistors, e.g. BJTs or IGBTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/913—Active solid-state devices, e.g. transistors, solid-state diodes with means to absorb or localize unwanted impurities or defects from semiconductors, e.g. heavy metal gettering
Landscapes
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59301775A | 1975-07-03 | 1975-07-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1507115A true GB1507115A (en) | 1978-04-12 |
Family
ID=24373010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB26343/76A Expired GB1507115A (en) | 1975-07-03 | 1976-06-24 | Transistor having integrated protection |
Country Status (5)
Country | Link |
---|---|
US (1) | US4071852A (en, 2012) |
JP (1) | JPS529380A (en, 2012) |
DE (1) | DE2628273A1 (en, 2012) |
GB (1) | GB1507115A (en, 2012) |
IT (1) | IT1061511B (en, 2012) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4167748A (en) * | 1978-07-03 | 1979-09-11 | Bell Telephone Laboratories, Incorporated | High voltage monolithic transistor circuit |
JPS56152261A (en) * | 1980-04-28 | 1981-11-25 | Toshiba Corp | I2l element withstanding high surge |
US4398206A (en) * | 1981-02-11 | 1983-08-09 | Rca Corporation | Transistor with integrated diode and resistor |
US4797720A (en) * | 1981-07-29 | 1989-01-10 | American Telephone And Telegraph Company, At&T Bell Laboratories | Controlled breakover bidirectional semiconductor switch |
JPS61158177A (ja) * | 1984-12-28 | 1986-07-17 | Toshiba Corp | 半導体装置 |
EP0310836A3 (de) * | 1987-10-08 | 1989-06-14 | Siemens Aktiengesellschaft | Halbleiterbauelement mit einem planaren pn-Übergang |
JPH0766975B2 (ja) * | 1988-12-09 | 1995-07-19 | サンケン電気株式会社 | 複合型ダイオード装置 |
US4999683A (en) * | 1988-12-30 | 1991-03-12 | Sanken Electric Co., Ltd. | Avalanche breakdown semiconductor device |
US5027165A (en) * | 1990-05-22 | 1991-06-25 | Maxim Integrated Products | Buried zener diode |
US5479031A (en) * | 1993-09-10 | 1995-12-26 | Teccor Electronics, Inc. | Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value |
KR100263912B1 (ko) * | 1998-05-20 | 2000-09-01 | 김덕중 | 반도체 소자의 다이오드 및 그 제조방법 |
JP2001352079A (ja) * | 2000-06-07 | 2001-12-21 | Nec Corp | ダイオードおよびその製造方法 |
JP5228123B1 (ja) * | 2011-11-28 | 2013-07-03 | 株式会社東芝 | 半導体装置及びその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1453086A (fr) * | 1964-11-06 | 1966-04-15 | Telefunken Patent | Dispositif semiconducteur et procédé de fabrication d'un tel dispositif |
US3338758A (en) * | 1964-12-31 | 1967-08-29 | Fairchild Camera Instr Co | Surface gradient protected high breakdown junctions |
US3551760A (en) * | 1966-03-28 | 1970-12-29 | Hitachi Ltd | Semiconductor device with an inversion preventing layer formed in a diffused region |
US3714526A (en) * | 1971-02-19 | 1973-01-30 | Nasa | Phototransistor |
-
1976
- 1976-05-18 IT IT23369/76A patent/IT1061511B/it active
- 1976-06-24 DE DE19762628273 patent/DE2628273A1/de active Pending
- 1976-06-24 GB GB26343/76A patent/GB1507115A/en not_active Expired
- 1976-07-02 JP JP51079405A patent/JPS529380A/ja active Granted
-
1977
- 1977-01-10 US US05/758,185 patent/US4071852A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4071852A (en) | 1978-01-31 |
DE2628273A1 (de) | 1977-01-27 |
JPS529380A (en) | 1977-01-24 |
IT1061511B (it) | 1983-04-30 |
JPS5634105B2 (en, 2012) | 1981-08-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |