GB1467168A - Process for manufacturing a base for a semiconductor device - Google Patents

Process for manufacturing a base for a semiconductor device

Info

Publication number
GB1467168A
GB1467168A GB2956274A GB2956274A GB1467168A GB 1467168 A GB1467168 A GB 1467168A GB 2956274 A GB2956274 A GB 2956274A GB 2956274 A GB2956274 A GB 2956274A GB 1467168 A GB1467168 A GB 1467168A
Authority
GB
United Kingdom
Prior art keywords
recess
base
projection
blank
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2956274A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7705173A external-priority patent/JPS5116300B2/ja
Priority claimed from JP13072773A external-priority patent/JPS5132954B2/ja
Application filed by Individual filed Critical Individual
Publication of GB1467168A publication Critical patent/GB1467168A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Forging (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
GB2956274A 1973-07-10 1974-07-03 Process for manufacturing a base for a semiconductor device Expired GB1467168A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7705173A JPS5116300B2 (nl) 1973-07-10 1973-07-10
JP13072773A JPS5132954B2 (nl) 1973-11-22 1973-11-22

Publications (1)

Publication Number Publication Date
GB1467168A true GB1467168A (en) 1977-03-16

Family

ID=26418154

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2956274A Expired GB1467168A (en) 1973-07-10 1974-07-03 Process for manufacturing a base for a semiconductor device

Country Status (4)

Country Link
US (1) US3893325A (nl)
FR (1) FR2236572B1 (nl)
GB (1) GB1467168A (nl)
NL (1) NL7409192A (nl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4341106A (en) * 1977-04-13 1982-07-27 Gleason Works Apparatus for controlling the movement of a reciprocatory hydraulically driven element of a metal forming machine
CA1114779A (en) * 1978-07-18 1981-12-22 Nissan Motor Co., Ltd. Process of closed extrusion shaping of a metal rod material and an apparatus therefor
JPS5812089B2 (ja) * 1980-01-17 1983-03-07 日産自動車株式会社 閉塞押出成形装置
WO1994019246A2 (en) * 1993-02-18 1994-09-01 David Robert Sergeant Container end closure
CN1060415C (zh) * 1997-04-25 2001-01-10 张应宪 钢法兰毛坯制造新工艺
US7506527B2 (en) * 2000-04-10 2009-03-24 Honeywell International, Inc. Making integral heat spreader by coining
CN105499463B (zh) * 2015-12-28 2018-10-02 无锡透平叶片有限公司 一种带预应力压边的大型矩形模座结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186209A (en) * 1960-04-14 1965-06-01 Nat Machinery Co Method of cold forming an elongated hollow article
US3417597A (en) * 1967-02-06 1968-12-24 Francis S. Napoli Weld stud
JPS5147659B1 (nl) * 1971-06-14 1976-12-16

Also Published As

Publication number Publication date
DE2432681B2 (de) 1976-06-16
US3893325A (en) 1975-07-08
FR2236572B1 (nl) 1978-01-20
FR2236572A1 (nl) 1975-02-07
NL7409192A (nl) 1975-01-14
DE2432681A1 (de) 1975-01-30

Similar Documents

Publication Publication Date Title
US4023613A (en) Method of making a composite metal casting
US4005991A (en) Metal made of steel plate and aluminum material
GB1467168A (en) Process for manufacturing a base for a semiconductor device
GB1284471A (en) Producing erosion electrodes
CN109093112A (zh) 一种用于粉末冶金汽车发动机活塞的模架
CN208288906U (zh) 一种用于冷锻鱼眼环的模具
CN105234240A (zh) 带弹性压板的拉深模
US2026337A (en) Process of making tile-dies
CN206779269U (zh) 一种汽车驱动桥u形折边abs传感器线束固定支架成型模具
KR960002415B1 (ko) 분말 성형용 금형
CN205253927U (zh) 用于二次拉延冲压模具的锁紧装置
CN211842779U (zh) 一种滑动式定位模具
CN214447783U (zh) 灯壳模具的顶出结构
CN214161124U (zh) 一种用于生产环保设备的外模具
KR870000927Y1 (ko) 성형 프레스의 제품 취출장치
CN210676656U (zh) 一种五金模具加工冲压杆固定安装底座
CN216989713U (zh) 一种便于脱模的内凹件锻压工装
CN214919775U (zh) 一种鱼盘的冲压成型模具
CN211707896U (zh) 一种冲压模具
CN210586740U (zh) 产品成型后整形模具结构
CN216027557U (zh) 一种具有缓冲结构的高精度冲压模具
CN217315474U (zh) 薄型四面扁平封装框架打凹模具
CN216095976U (zh) 一种汽车挡板盖模具
CN216297863U (zh) 一种预、精锻合并双顶出机构模具
CN209755560U (zh) 一种用于机压成型转炉镶锆板闸阀砖的模具

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee