FR2236572B1 - - Google Patents

Info

Publication number
FR2236572B1
FR2236572B1 FR7423882A FR7423882A FR2236572B1 FR 2236572 B1 FR2236572 B1 FR 2236572B1 FR 7423882 A FR7423882 A FR 7423882A FR 7423882 A FR7423882 A FR 7423882A FR 2236572 B1 FR2236572 B1 FR 2236572B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7423882A
Other versions
FR2236572A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7705173A external-priority patent/JPS5116300B2/ja
Priority claimed from JP13072773A external-priority patent/JPS5132954B2/ja
Application filed by Individual filed Critical Individual
Publication of FR2236572A1 publication Critical patent/FR2236572A1/fr
Application granted granted Critical
Publication of FR2236572B1 publication Critical patent/FR2236572B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Forging (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
FR7423882A 1973-07-10 1974-07-09 Expired FR2236572B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7705173A JPS5116300B2 (fr) 1973-07-10 1973-07-10
JP13072773A JPS5132954B2 (fr) 1973-11-22 1973-11-22

Publications (2)

Publication Number Publication Date
FR2236572A1 FR2236572A1 (fr) 1975-02-07
FR2236572B1 true FR2236572B1 (fr) 1978-01-20

Family

ID=26418154

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7423882A Expired FR2236572B1 (fr) 1973-07-10 1974-07-09

Country Status (4)

Country Link
US (1) US3893325A (fr)
FR (1) FR2236572B1 (fr)
GB (1) GB1467168A (fr)
NL (1) NL7409192A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4341106A (en) * 1977-04-13 1982-07-27 Gleason Works Apparatus for controlling the movement of a reciprocatory hydraulically driven element of a metal forming machine
CA1114779A (fr) * 1978-07-18 1981-12-22 Nissan Motor Co., Ltd. Methode et dispositif de faconnage par extrusion de tiges metalliques
JPS5812089B2 (ja) * 1980-01-17 1983-03-07 日産自動車株式会社 閉塞押出成形装置
WO1994019246A2 (fr) * 1993-02-18 1994-09-01 David Robert Sergeant Couvercle de fermeture d'un contenant
CN1060415C (zh) * 1997-04-25 2001-01-10 张应宪 钢法兰毛坯制造新工艺
US7506527B2 (en) * 2000-04-10 2009-03-24 Honeywell International, Inc. Making integral heat spreader by coining
CN105499463B (zh) * 2015-12-28 2018-10-02 无锡透平叶片有限公司 一种带预应力压边的大型矩形模座结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186209A (en) * 1960-04-14 1965-06-01 Nat Machinery Co Method of cold forming an elongated hollow article
US3417597A (en) * 1967-02-06 1968-12-24 Francis S. Napoli Weld stud
JPS5147659B1 (fr) * 1971-06-14 1976-12-16

Also Published As

Publication number Publication date
GB1467168A (en) 1977-03-16
DE2432681B2 (de) 1976-06-16
US3893325A (en) 1975-07-08
FR2236572A1 (fr) 1975-02-07
NL7409192A (nl) 1975-01-14
DE2432681A1 (de) 1975-01-30

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Legal Events

Date Code Title Description
ST Notification of lapse