GB1449702A - Polishing semi-conductor surfaces - Google Patents

Polishing semi-conductor surfaces

Info

Publication number
GB1449702A
GB1449702A GB512274A GB512274A GB1449702A GB 1449702 A GB1449702 A GB 1449702A GB 512274 A GB512274 A GB 512274A GB 512274 A GB512274 A GB 512274A GB 1449702 A GB1449702 A GB 1449702A
Authority
GB
United Kingdom
Prior art keywords
amine
wheel
suspension
polishing
calcium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB512274A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of GB1449702A publication Critical patent/GB1449702A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Surface Treatment Of Glass (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
GB512274A 1973-02-02 1974-02-04 Polishing semi-conductor surfaces Expired GB1449702A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305188 DE2305188A1 (de) 1973-02-02 1973-02-02 Verfahren zur herstellung von polierten halbleiteroberflaechen

Publications (1)

Publication Number Publication Date
GB1449702A true GB1449702A (en) 1976-09-15

Family

ID=5870787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB512274A Expired GB1449702A (en) 1973-02-02 1974-02-04 Polishing semi-conductor surfaces

Country Status (6)

Country Link
JP (1) JPS49111580A (enExample)
DE (1) DE2305188A1 (enExample)
FR (1) FR2216077B1 (enExample)
GB (1) GB1449702A (enExample)
IT (1) IT1002811B (enExample)
NL (1) NL7401454A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692223A (en) * 1985-05-15 1987-09-08 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for polishing silicon wafers
WO2000000560A3 (en) * 1998-06-26 2001-12-13 Cabot Microelectronics Corp Chemical mechanical polishing slurry and method for using same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device
JPS6287242A (ja) * 1985-05-29 1987-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd 安定な金属酸化物系ゾル組成物
DE3545383A1 (de) * 1985-12-20 1987-07-02 Wacker Chemitronic Verfahren zum eindiffundieren von wasserstoff in halbleiter-, insbesondere siliciumscheiben
JPS62162462A (ja) * 1986-01-10 1987-07-18 Rohm Co Ltd ウエハ表面仕上方法
JP2651144B2 (ja) * 1987-01-26 1997-09-10 キヤノン株式会社 結晶基材の製造方法
JPH01153262A (ja) * 1987-12-10 1989-06-15 Mitsubishi Metal Corp 鏡面研磨方法
US5226930A (en) * 1988-06-03 1993-07-13 Monsanto Japan, Ltd. Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same
JPH0236067A (ja) * 1988-07-25 1990-02-06 Toshiba Corp 研磨方法及びその装置
JPH02146732A (ja) * 1988-07-28 1990-06-05 Fujitsu Ltd 研摩液及び研摩方法
NL8802028A (nl) * 1988-08-16 1990-03-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting.
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
CN102822308B (zh) 2010-03-29 2014-12-03 旭硝子株式会社 研磨剂、研磨方法及半导体集成电路装置的制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385682A (en) * 1965-04-29 1968-05-28 Sprague Electric Co Method and reagent for surface polishing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692223A (en) * 1985-05-15 1987-09-08 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for polishing silicon wafers
WO2000000560A3 (en) * 1998-06-26 2001-12-13 Cabot Microelectronics Corp Chemical mechanical polishing slurry and method for using same
US6533832B2 (en) 1998-06-26 2003-03-18 Cabot Microelectronics Corporation Chemical mechanical polishing slurry and method for using same

Also Published As

Publication number Publication date
NL7401454A (enExample) 1974-08-06
JPS49111580A (enExample) 1974-10-24
IT1002811B (it) 1976-05-20
DE2305188A1 (de) 1974-08-08
FR2216077A1 (enExample) 1974-08-30
FR2216077B1 (enExample) 1976-04-30

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee