NL7401454A - - Google Patents

Info

Publication number
NL7401454A
NL7401454A NL7401454A NL7401454A NL7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A
Authority
NL
Netherlands
Application number
NL7401454A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7401454A publication Critical patent/NL7401454A/xx

Links

Classifications

    • H10P52/402
NL7401454A 1973-02-02 1974-02-01 NL7401454A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2305188A DE2305188A1 (de) 1973-02-02 1973-02-02 Verfahren zur herstellung von polierten halbleiteroberflaechen

Publications (1)

Publication Number Publication Date
NL7401454A true NL7401454A (enExample) 1974-08-06

Family

ID=5870787

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7401454A NL7401454A (enExample) 1973-02-02 1974-02-01

Country Status (6)

Country Link
JP (1) JPS49111580A (enExample)
DE (1) DE2305188A1 (enExample)
FR (1) FR2216077B1 (enExample)
GB (1) GB1449702A (enExample)
IT (1) IT1002811B (enExample)
NL (1) NL7401454A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device
DE3517665A1 (de) * 1985-05-15 1986-11-20 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum polieren von siliciumscheiben
JPS6287242A (ja) * 1985-05-29 1987-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd 安定な金属酸化物系ゾル組成物
DE3545383A1 (de) * 1985-12-20 1987-07-02 Wacker Chemitronic Verfahren zum eindiffundieren von wasserstoff in halbleiter-, insbesondere siliciumscheiben
JPS62162462A (ja) * 1986-01-10 1987-07-18 Rohm Co Ltd ウエハ表面仕上方法
JP2651144B2 (ja) * 1987-01-26 1997-09-10 キヤノン株式会社 結晶基材の製造方法
JPH01153262A (ja) * 1987-12-10 1989-06-15 Mitsubishi Metal Corp 鏡面研磨方法
US5226930A (en) * 1988-06-03 1993-07-13 Monsanto Japan, Ltd. Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same
JPH0236067A (ja) * 1988-07-25 1990-02-06 Toshiba Corp 研磨方法及びその装置
JPH02146732A (ja) * 1988-07-28 1990-06-05 Fujitsu Ltd 研摩液及び研摩方法
NL8802028A (nl) * 1988-08-16 1990-03-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting.
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US6533832B2 (en) 1998-06-26 2003-03-18 Cabot Microelectronics Corporation Chemical mechanical polishing slurry and method for using same
KR20130016265A (ko) 2010-03-29 2013-02-14 아사히 가라스 가부시키가이샤 연마제, 연마 방법 및 반도체 집적 회로 장치의 제조 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385682A (en) * 1965-04-29 1968-05-28 Sprague Electric Co Method and reagent for surface polishing

Also Published As

Publication number Publication date
JPS49111580A (enExample) 1974-10-24
GB1449702A (en) 1976-09-15
FR2216077A1 (enExample) 1974-08-30
DE2305188A1 (de) 1974-08-08
FR2216077B1 (enExample) 1976-04-30
IT1002811B (it) 1976-05-20

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Legal Events

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