NL7401454A - - Google Patents
Info
- Publication number
- NL7401454A NL7401454A NL7401454A NL7401454A NL7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A NL 7401454 A NL7401454 A NL 7401454A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Surface Treatment Of Glass (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19732305188 DE2305188A1 (de) | 1973-02-02 | 1973-02-02 | Verfahren zur herstellung von polierten halbleiteroberflaechen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7401454A true NL7401454A (enExample) | 1974-08-06 |
Family
ID=5870787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7401454A NL7401454A (enExample) | 1973-02-02 | 1974-02-01 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS49111580A (enExample) |
| DE (1) | DE2305188A1 (enExample) |
| FR (1) | FR2216077B1 (enExample) |
| GB (1) | GB1449702A (enExample) |
| IT (1) | IT1002811B (enExample) |
| NL (1) | NL7401454A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2538855A1 (de) * | 1975-09-01 | 1977-03-10 | Wacker Chemitronic | Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid |
| JPS5531582A (en) * | 1978-08-15 | 1980-03-05 | Ibm | Free polishing device |
| DE3517665A1 (de) * | 1985-05-15 | 1986-11-20 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum polieren von siliciumscheiben |
| JPS6287242A (ja) * | 1985-05-29 | 1987-04-21 | Nippon Shokubai Kagaku Kogyo Co Ltd | 安定な金属酸化物系ゾル組成物 |
| DE3545383A1 (de) * | 1985-12-20 | 1987-07-02 | Wacker Chemitronic | Verfahren zum eindiffundieren von wasserstoff in halbleiter-, insbesondere siliciumscheiben |
| JPS62162462A (ja) * | 1986-01-10 | 1987-07-18 | Rohm Co Ltd | ウエハ表面仕上方法 |
| JP2651144B2 (ja) * | 1987-01-26 | 1997-09-10 | キヤノン株式会社 | 結晶基材の製造方法 |
| JPH01153262A (ja) * | 1987-12-10 | 1989-06-15 | Mitsubishi Metal Corp | 鏡面研磨方法 |
| US5226930A (en) * | 1988-06-03 | 1993-07-13 | Monsanto Japan, Ltd. | Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same |
| JPH0236067A (ja) * | 1988-07-25 | 1990-02-06 | Toshiba Corp | 研磨方法及びその装置 |
| JPH02146732A (ja) * | 1988-07-28 | 1990-06-05 | Fujitsu Ltd | 研摩液及び研摩方法 |
| NL8802028A (nl) * | 1988-08-16 | 1990-03-16 | Philips Nv | Werkwijze voor het vervaardigen van een inrichting. |
| US5084071A (en) * | 1989-03-07 | 1992-01-28 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
| US6533832B2 (en) | 1998-06-26 | 2003-03-18 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry and method for using same |
| CN102822308B (zh) | 2010-03-29 | 2014-12-03 | 旭硝子株式会社 | 研磨剂、研磨方法及半导体集成电路装置的制造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3385682A (en) * | 1965-04-29 | 1968-05-28 | Sprague Electric Co | Method and reagent for surface polishing |
-
1973
- 1973-02-02 DE DE19732305188 patent/DE2305188A1/de active Pending
-
1974
- 1974-01-31 JP JP49013296A patent/JPS49111580A/ja active Pending
- 1974-01-31 IT IT4805674A patent/IT1002811B/it active
- 1974-02-01 NL NL7401454A patent/NL7401454A/xx not_active Application Discontinuation
- 1974-02-01 FR FR7403420A patent/FR2216077B1/fr not_active Expired
- 1974-02-04 GB GB512274A patent/GB1449702A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1449702A (en) | 1976-09-15 |
| JPS49111580A (enExample) | 1974-10-24 |
| IT1002811B (it) | 1976-05-20 |
| DE2305188A1 (de) | 1974-08-08 |
| FR2216077A1 (enExample) | 1974-08-30 |
| FR2216077B1 (enExample) | 1976-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BV | The patent application has lapsed |