GB1403219A - Process for depositing copper layers on shaped articles of a polyimide - Google Patents
Process for depositing copper layers on shaped articles of a polyimideInfo
- Publication number
- GB1403219A GB1403219A GB5607872A GB5607872A GB1403219A GB 1403219 A GB1403219 A GB 1403219A GB 5607872 A GB5607872 A GB 5607872A GB 5607872 A GB5607872 A GB 5607872A GB 1403219 A GB1403219 A GB 1403219A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acid
- polyimide
- per cent
- dec
- shaped articles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 title abstract 4
- 239000004642 Polyimide Substances 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- 229910000510 noble metal Inorganic materials 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 abstract 1
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical class OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000009719 polyimide resin Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000001119 stannous chloride Substances 0.000 abstract 1
- 235000011150 stannous chloride Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2160821A DE2160821C3 (de) | 1971-12-08 | 1971-12-08 | Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1403219A true GB1403219A (en) | 1975-08-28 |
Family
ID=5827354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5607872A Expired GB1403219A (en) | 1971-12-08 | 1972-12-05 | Process for depositing copper layers on shaped articles of a polyimide |
Country Status (10)
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL176479C (nl) * | 1971-12-08 | 1985-04-16 | Hoechst Ag | Werkwijze voor het bekleden van kunststofvoorwerpen met koper. |
| GB2040969B (en) * | 1978-12-19 | 1983-04-13 | Crown City Plating Co | Conditioning of polyamides for electroless plating |
| DE3328765A1 (de) * | 1983-08-05 | 1985-02-14 | Schering AG, 1000 Berlin und 4709 Bergkamen | Loesung zur vorbehandlung von polyimid |
| US4720401A (en) * | 1985-01-11 | 1988-01-19 | International Business Machines Corporation | Enhanced adhesion between metals and polymers |
| DE3743780A1 (de) * | 1987-12-23 | 1989-07-06 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen |
| US5032427A (en) * | 1988-04-25 | 1991-07-16 | Macdermid, Incorporated | Process for preparation printed circuit through-holes for metallization |
| EP0341504A3 (en) * | 1988-05-09 | 1991-01-16 | General Electric Company | Plastic chip carrier package and method of preparation |
| US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
| US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
| US5178956A (en) * | 1989-10-03 | 1993-01-12 | Shipley Company Inc. | Pretreatment process for electroless plating of polyimides |
| EP0527926B1 (en) * | 1990-05-04 | 1997-08-13 | Battelle Memorial Institute | Process for depositing thin film layers onto surfaces modified with organic functional groups |
| US5187241A (en) * | 1990-05-15 | 1993-02-16 | International Business Machines Corporation | Isoimide modifications of a polyimide and reaction thereof with nucleophiles |
| US5441770A (en) * | 1990-05-18 | 1995-08-15 | Shipley Company Inc. | Conditioning process for electroless plating of polyetherimides |
| US5151304A (en) * | 1991-01-22 | 1992-09-29 | International Business Machines Corporation | Structure and method for enhancing adhesion to a polyimide surface |
| US5183692A (en) * | 1991-07-01 | 1993-02-02 | Motorola, Inc. | Polyimide coating having electroless metal plate |
| US5290597A (en) * | 1992-04-27 | 1994-03-01 | General Electric Company | Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon |
| JP4086946B2 (ja) * | 1998-01-05 | 2008-05-14 | 日東電工株式会社 | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
| JP4917841B2 (ja) * | 2006-06-09 | 2012-04-18 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 樹脂表面への無電解めっき方法 |
| US7981508B1 (en) | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
| US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
| TWI595024B (zh) * | 2016-06-23 | 2017-08-11 | 臻鼎科技股份有限公司 | 聚醯胺酸、覆銅板及電路板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3544432A (en) * | 1968-03-19 | 1970-12-01 | Chisso Corp | Electroplating plastic articles |
| US3704156A (en) * | 1970-07-13 | 1972-11-28 | Du Pont | Catalyst solution for electroless plating on nonconductors |
| US3684572A (en) * | 1970-07-13 | 1972-08-15 | Du Pont | Electroless nickel plating process for nonconductors |
| DE2101049A1 (de) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
| US3736170A (en) * | 1971-06-28 | 1973-05-29 | Ibm | Process for improved adhesion of electroless copper to a polyimide surface |
| US3791848A (en) * | 1972-05-19 | 1974-02-12 | Western Electric Co | A method of improving the adherence of a metal deposit to a polyimide surface |
-
0
- BE BE792310D patent/BE792310A/xx unknown
-
1971
- 1971-12-08 DE DE2160821A patent/DE2160821C3/de not_active Expired
-
1972
- 1972-11-28 NL NL7216124A patent/NL7216124A/xx unknown
- 1972-12-05 GB GB5607872A patent/GB1403219A/en not_active Expired
- 1972-12-05 US US31227272 patent/US3881049A/en not_active Expired - Lifetime
- 1972-12-05 AT AT1033772A patent/AT322320B/de not_active IP Right Cessation
- 1972-12-06 CA CA158,211A patent/CA990593A/en not_active Expired
- 1972-12-06 JP JP12237972A patent/JPS4866168A/ja active Pending
- 1972-12-06 IT IT5450572A patent/IT973915B/it active
- 1972-12-07 FR FR7243524A patent/FR2162526B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4866168A (enrdf_load_stackoverflow) | 1973-09-11 |
| DE2160821A1 (de) | 1973-06-20 |
| BE792310A (fr) | 1973-06-05 |
| FR2162526B1 (enrdf_load_stackoverflow) | 1976-08-20 |
| FR2162526A1 (enrdf_load_stackoverflow) | 1973-07-20 |
| US3881049A (en) | 1975-04-29 |
| CA990593A (en) | 1976-06-08 |
| AT322320B (de) | 1975-05-12 |
| IT973915B (it) | 1974-06-10 |
| DE2160821C3 (de) | 1979-02-08 |
| DE2160821B2 (de) | 1978-06-08 |
| NL7216124A (enrdf_load_stackoverflow) | 1973-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |