NL7216124A - - Google Patents

Info

Publication number
NL7216124A
NL7216124A NL7216124A NL7216124A NL7216124A NL 7216124 A NL7216124 A NL 7216124A NL 7216124 A NL7216124 A NL 7216124A NL 7216124 A NL7216124 A NL 7216124A NL 7216124 A NL7216124 A NL 7216124A
Authority
NL
Netherlands
Application number
NL7216124A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7216124A publication Critical patent/NL7216124A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NL7216124A 1971-12-08 1972-11-28 NL7216124A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160821A DE2160821C3 (de) 1971-12-08 1971-12-08 Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden

Publications (1)

Publication Number Publication Date
NL7216124A true NL7216124A (enrdf_load_stackoverflow) 1973-06-13

Family

ID=5827354

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7216124A NL7216124A (enrdf_load_stackoverflow) 1971-12-08 1972-11-28

Country Status (10)

Country Link
US (1) US3881049A (enrdf_load_stackoverflow)
JP (1) JPS4866168A (enrdf_load_stackoverflow)
AT (1) AT322320B (enrdf_load_stackoverflow)
BE (1) BE792310A (enrdf_load_stackoverflow)
CA (1) CA990593A (enrdf_load_stackoverflow)
DE (1) DE2160821C3 (enrdf_load_stackoverflow)
FR (1) FR2162526B1 (enrdf_load_stackoverflow)
GB (1) GB1403219A (enrdf_load_stackoverflow)
IT (1) IT973915B (enrdf_load_stackoverflow)
NL (1) NL7216124A (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176479C (nl) * 1971-12-08 1985-04-16 Hoechst Ag Werkwijze voor het bekleden van kunststofvoorwerpen met koper.
GB2040969B (en) * 1978-12-19 1983-04-13 Crown City Plating Co Conditioning of polyamides for electroless plating
DE3328765A1 (de) * 1983-08-05 1985-02-14 Schering AG, 1000 Berlin und 4709 Bergkamen Loesung zur vorbehandlung von polyimid
US4720401A (en) * 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
EP0341504A3 (en) * 1988-05-09 1991-01-16 General Electric Company Plastic chip carrier package and method of preparation
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
DE69127279T2 (de) * 1990-05-04 1998-03-19 Battelle Memorial Institute Bildung eines dünnen keramischen oxidfilms durch niederschlagung auf modifizierten polymeroberflächen
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
JP4917841B2 (ja) * 2006-06-09 2012-04-18 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 樹脂表面への無電解めっき方法
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
TWI595024B (zh) * 2016-06-23 2017-08-11 臻鼎科技股份有限公司 聚醯胺酸、覆銅板及電路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) * 1968-03-19 1970-12-01 Chisso Corp Electroplating plastic articles
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
US3736170A (en) * 1971-06-28 1973-05-29 Ibm Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface

Also Published As

Publication number Publication date
DE2160821B2 (de) 1978-06-08
AT322320B (de) 1975-05-12
FR2162526A1 (enrdf_load_stackoverflow) 1973-07-20
JPS4866168A (enrdf_load_stackoverflow) 1973-09-11
DE2160821A1 (de) 1973-06-20
US3881049A (en) 1975-04-29
FR2162526B1 (enrdf_load_stackoverflow) 1976-08-20
DE2160821C3 (de) 1979-02-08
BE792310A (fr) 1973-06-05
IT973915B (it) 1974-06-10
CA990593A (en) 1976-06-08
GB1403219A (en) 1975-08-28

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