GB1390451A - Manufacture of metallized shaped bodies of macromolecular material - Google Patents

Manufacture of metallized shaped bodies of macromolecular material

Info

Publication number
GB1390451A
GB1390451A GB1052072A GB1052072A GB1390451A GB 1390451 A GB1390451 A GB 1390451A GB 1052072 A GB1052072 A GB 1052072A GB 1052072 A GB1052072 A GB 1052072A GB 1390451 A GB1390451 A GB 1390451A
Authority
GB
United Kingdom
Prior art keywords
plating
coating
march
baths
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1052072A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712111137 external-priority patent/DE2111137A1/en
Application filed by Hoechst AG filed Critical Hoechst AG
Publication of GB1390451A publication Critical patent/GB1390451A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B05D5/067—Metallic effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06Q—DECORATING TEXTILES
    • D06Q1/00—Decorating textiles
    • D06Q1/04—Decorating textiles by metallising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Textile Engineering (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)

Abstract

1390451 Electroless plating HOECHST AG 7 March 1972 [9 March 1971] 10520/72 Heading C7F Prior to electroless plating with e.g. Cu or Ni a substrate is coated with a solution or dispersion of p.t.f.e. containing a noble metal salt e.g. the chlorides of Pd, Pt or Au or silver nitrate, and the coating heated to remove the liquid component. The coating may be sintered before or after plating, and it may be removed from the substrate. The liquid may be water, acetone or butanone, and it may include a wetting agent, e.g. dodecyl benzene sulphonate. The coating may be activated with a reducing agent before plating. The electroless bath may contain sodium hypophosphite, sodium hydride, nitrogen diethyl borane, formaldehyde, hydrazine hydrate, and sodium bisulphite as reducing agent, and telluric acid as stabilizer. Copper plating baths may contain saccharin, and Ni baths lactic and succinic acids. The support may be glass, steel, Al, unglazed ceramics, cotton or polyester or a polyimide film. The metal plating may be subsequently coated with plastics or electro-plated with Ni.
GB1052072A 1971-03-09 1972-03-07 Manufacture of metallized shaped bodies of macromolecular material Expired GB1390451A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19712111136 DE2111136A1 (en) 1971-03-09 1971-03-09 Process for the production of metallized moldings from macromolecular material
DE19712111137 DE2111137A1 (en) 1971-03-09 1971-03-09 Metallized, porous molded body and process for its production

Publications (1)

Publication Number Publication Date
GB1390451A true GB1390451A (en) 1975-04-16

Family

ID=25760769

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1052072A Expired GB1390451A (en) 1971-03-09 1972-03-07 Manufacture of metallized shaped bodies of macromolecular material

Country Status (8)

Country Link
BE (1) BE780276A (en)
CA (1) CA968235A (en)
CH (1) CH576346A5 (en)
DE (1) DE2111136A1 (en)
FR (1) FR2128762B1 (en)
GB (1) GB1390451A (en)
LU (1) LU64914A1 (en)
NL (1) NL7202554A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231063A (en) * 1989-02-27 1990-11-07 Omi International Electroless plating composition containing saccharin

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4287253A (en) * 1975-04-08 1981-09-01 Photocircuits Division Of Kollmorgen Corp. Catalytic filler for electroless metallization of hole walls
PH23907A (en) * 1983-09-28 1989-12-18 Rohm & Haas Catalytic process and systems
CN113293364B (en) * 2020-02-24 2022-10-28 北京化工大学 Method for continuously preparing surface-silvered polyimide film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA797510A (en) * 1968-10-29 Hidaka Yasukuni Net for use in paper making, process for and apparatus for manufacturing the same
US3600330A (en) * 1967-01-03 1971-08-17 Photocircuits Division Of Koli Metallization of insulating substrates
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231063A (en) * 1989-02-27 1990-11-07 Omi International Electroless plating composition containing saccharin

Also Published As

Publication number Publication date
CH576346A5 (en) 1976-06-15
NL7202554A (en) 1972-09-12
CA968235A (en) 1975-05-27
DE2111136A1 (en) 1972-09-28
FR2128762B1 (en) 1975-10-24
LU64914A1 (en) 1973-09-12
FR2128762A1 (en) 1972-10-20
BE780276A (en) 1972-09-06

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Legal Events

Date Code Title Description
429A Application made for amendment of specification (sect. 29/1949)
429H Application (made) for amendment of specification now open to opposition (sect. 29/1949)
429D Case decided by the comptroller ** specification amended (sect. 29/1949)
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee