GB1374848A - High heat dissipation solder-reflow flip chip transistor - Google Patents

High heat dissipation solder-reflow flip chip transistor

Info

Publication number
GB1374848A
GB1374848A GB1866972A GB1866972A GB1374848A GB 1374848 A GB1374848 A GB 1374848A GB 1866972 A GB1866972 A GB 1866972A GB 1866972 A GB1866972 A GB 1866972A GB 1374848 A GB1374848 A GB 1374848A
Authority
GB
United Kingdom
Prior art keywords
glass layer
conductor
flip chip
substrate
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1866972A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of GB1374848A publication Critical patent/GB1374848A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/237—Multiple bump connectors having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/936—Multiple bond pads having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
GB1866972A 1971-04-28 1972-04-21 High heat dissipation solder-reflow flip chip transistor Expired GB1374848A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13824471A 1971-04-28 1971-04-28

Publications (1)

Publication Number Publication Date
GB1374848A true GB1374848A (en) 1974-11-20

Family

ID=22481133

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1866972A Expired GB1374848A (en) 1971-04-28 1972-04-21 High heat dissipation solder-reflow flip chip transistor

Country Status (10)

Country Link
US (1) US3772575A (enExample)
AU (1) AU467540B2 (enExample)
BE (1) BE782752A (enExample)
CA (1) CA975870A (enExample)
DE (1) DE2218230A1 (enExample)
ES (2) ES401934A1 (enExample)
FR (1) FR2134553B1 (enExample)
GB (1) GB1374848A (enExample)
IT (1) IT950041B (enExample)
NL (1) NL7205728A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255672A (en) * 1991-05-10 1992-11-11 Northern Telecom Ltd Providing solder bumps for use in flip-chip bonding

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53147968A (en) * 1977-05-30 1978-12-23 Hitachi Ltd Thick film circuit board
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
CN114407502A (zh) * 2022-03-01 2022-04-29 苏州通富超威半导体有限公司 印刷治具以及印刷方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE636316A (enExample) * 1962-08-23 1900-01-01
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
JPS4831507B1 (enExample) * 1969-07-10 1973-09-29
US3631307A (en) * 1970-02-13 1971-12-28 Itt Semiconductor structures having improved high-frequency response and power dissipation capabilities
US3697828A (en) * 1970-12-03 1972-10-10 Gen Motors Corp Geometry for a pnp silicon transistor with overlay contacts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255672A (en) * 1991-05-10 1992-11-11 Northern Telecom Ltd Providing solder bumps for use in flip-chip bonding
GB2255672B (en) * 1991-05-10 1994-11-30 Northern Telecom Ltd Opto-electronic components

Also Published As

Publication number Publication date
AU4097072A (en) 1972-10-18
NL7205728A (enExample) 1972-10-31
ES401934A1 (es) 1975-11-01
FR2134553B1 (enExample) 1977-09-30
FR2134553A1 (enExample) 1972-12-08
US3772575A (en) 1973-11-13
DE2218230A1 (de) 1972-11-09
ES406660A1 (es) 1975-09-16
IT950041B (it) 1973-06-20
AU467540B2 (en) 1972-10-18
CA975870A (en) 1975-10-07
BE782752A (fr) 1972-08-16

Similar Documents

Publication Publication Date Title
US3657610A (en) Self-sealing face-down bonded semiconductor device
US3958195A (en) R.f. transistor package having an isolated common lead
EP0218438A3 (en) Apparatus for mounting a semiconductor chip and making electrical connections thereto
JPS59141249A (ja) 電力チツプ・パツケ−ジ
US3617819A (en) A semiconductor device having a connecting pad of low resistivity semiconductor material interconnecting gold electrodes and aluminum contacts of an enclosure
US4161740A (en) High frequency power transistor having reduced interconnection inductance and thermal resistance
US3772575A (en) High heat dissipation solder-reflow flip chip transistor
GB1130666A (en) A semiconductor device
JP2956786B2 (ja) 合成ハイブリッド半導体ストラクチャ
UST955008I4 (en) Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate
GB1240977A (en) Improvements in or relating to semiconductor components
US3808474A (en) Semiconductor devices
US3581166A (en) Gold-aluminum leadout structure of a semiconductor device
US5894166A (en) Chip mounting scheme
JPH04249353A (ja) 樹脂封止型半導体装置
US3823469A (en) High heat dissipation solder-reflow flip chip transistor
JPS56148857A (en) Semiconductor device
JPS5850021B2 (ja) 半導体装置の製法
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
GB1204805A (en) Semiconductor device
JPH0358537B2 (enExample)
GB1280610A (en) Improvements in or relating to semiconductor components
JPH04245459A (ja) 半導体装置
JPS53110371A (en) Ceramic package type semiconductor device
JPS595977Y2 (ja) 集積回路の塔載装置

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees