BE782752A - Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion - Google Patents

Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion

Info

Publication number
BE782752A
BE782752A BE782752A BE782752A BE782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A
Authority
BE
Belgium
Prior art keywords
micropaves
transistor
heat dissipation
high heat
connection method
Prior art date
Application number
BE782752A
Other languages
English (en)
Inventor
B A Hegarty
L H Trevail
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE782752A publication Critical patent/BE782752A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
BE782752A 1971-04-28 1972-04-27 Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion BE782752A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13824471A 1971-04-28 1971-04-28

Publications (1)

Publication Number Publication Date
BE782752A true BE782752A (fr) 1972-08-16

Family

ID=22481133

Family Applications (1)

Application Number Title Priority Date Filing Date
BE782752A BE782752A (fr) 1971-04-28 1972-04-27 Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion

Country Status (10)

Country Link
US (1) US3772575A (fr)
AU (1) AU467540B2 (fr)
BE (1) BE782752A (fr)
CA (1) CA975870A (fr)
DE (1) DE2218230A1 (fr)
ES (2) ES401934A1 (fr)
FR (1) FR2134553B1 (fr)
GB (1) GB1374848A (fr)
IT (1) IT950041B (fr)
NL (1) NL7205728A (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53147968A (en) * 1977-05-30 1978-12-23 Hitachi Ltd Thick film circuit board
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
GB2255672B (en) * 1991-05-10 1994-11-30 Northern Telecom Ltd Opto-electronic components
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
CN114407502A (zh) * 2022-03-01 2022-04-29 苏州通富超威半导体有限公司 印刷治具以及印刷方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL297002A (fr) * 1962-08-23 1900-01-01
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
JPS4831507B1 (fr) * 1969-07-10 1973-09-29
US3631307A (en) * 1970-02-13 1971-12-28 Itt Semiconductor structures having improved high-frequency response and power dissipation capabilities
US3697828A (en) * 1970-12-03 1972-10-10 Gen Motors Corp Geometry for a pnp silicon transistor with overlay contacts

Also Published As

Publication number Publication date
AU467540B2 (en) 1972-10-18
DE2218230A1 (de) 1972-11-09
ES406660A1 (es) 1975-09-16
CA975870A (en) 1975-10-07
GB1374848A (en) 1974-11-20
FR2134553A1 (fr) 1972-12-08
IT950041B (it) 1973-06-20
NL7205728A (fr) 1972-10-31
AU4097072A (en) 1972-10-18
FR2134553B1 (fr) 1977-09-30
ES401934A1 (es) 1975-11-01
US3772575A (en) 1973-11-13

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