IT950041B - Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato - Google Patents

Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato

Info

Publication number
IT950041B
IT950041B IT21647/72A IT2164772A IT950041B IT 950041 B IT950041 B IT 950041B IT 21647/72 A IT21647/72 A IT 21647/72A IT 2164772 A IT2164772 A IT 2164772A IT 950041 B IT950041 B IT 950041B
Authority
IT
Italy
Prior art keywords
substrate
mounting
high thermal
thermal dissipation
dissipation transistor
Prior art date
Application number
IT21647/72A
Other languages
English (en)
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Application granted granted Critical
Publication of IT950041B publication Critical patent/IT950041B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/237—Multiple bump connectors having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/936—Multiple bond pads having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
IT21647/72A 1971-04-28 1972-03-09 Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato IT950041B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13824471A 1971-04-28 1971-04-28

Publications (1)

Publication Number Publication Date
IT950041B true IT950041B (it) 1973-06-20

Family

ID=22481133

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21647/72A IT950041B (it) 1971-04-28 1972-03-09 Transistore ad elevata dissipazio ne termica e metodo per il montag gio dello stesso su di un substrato

Country Status (10)

Country Link
US (1) US3772575A (it)
AU (1) AU467540B2 (it)
BE (1) BE782752A (it)
CA (1) CA975870A (it)
DE (1) DE2218230A1 (it)
ES (2) ES401934A1 (it)
FR (1) FR2134553B1 (it)
GB (1) GB1374848A (it)
IT (1) IT950041B (it)
NL (1) NL7205728A (it)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53147968A (en) * 1977-05-30 1978-12-23 Hitachi Ltd Thick film circuit board
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
GB2255672B (en) * 1991-05-10 1994-11-30 Northern Telecom Ltd Opto-electronic components
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5937276A (en) * 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
CN114407502A (zh) * 2022-03-01 2022-04-29 苏州通富超威半导体有限公司 印刷治具以及印刷方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE636317A (it) * 1962-08-23 1900-01-01
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
JPS4831507B1 (it) * 1969-07-10 1973-09-29
US3631307A (en) * 1970-02-13 1971-12-28 Itt Semiconductor structures having improved high-frequency response and power dissipation capabilities
US3697828A (en) * 1970-12-03 1972-10-10 Gen Motors Corp Geometry for a pnp silicon transistor with overlay contacts

Also Published As

Publication number Publication date
DE2218230A1 (de) 1972-11-09
ES401934A1 (es) 1975-11-01
FR2134553A1 (it) 1972-12-08
NL7205728A (it) 1972-10-31
GB1374848A (en) 1974-11-20
CA975870A (en) 1975-10-07
BE782752A (fr) 1972-08-16
ES406660A1 (es) 1975-09-16
FR2134553B1 (it) 1977-09-30
AU4097072A (en) 1972-10-18
AU467540B2 (en) 1972-10-18
US3772575A (en) 1973-11-13

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