BE782752A - Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion - Google Patents

Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion

Info

Publication number
BE782752A
BE782752A BE782752A BE782752A BE782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A BE 782752 A BE782752 A BE 782752A
Authority
BE
Belgium
Prior art keywords
micropaves
transistor
heat dissipation
high heat
connection method
Prior art date
Application number
BE782752A
Other languages
English (en)
French (fr)
Inventor
B A Hegarty
L H Trevail
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE782752A publication Critical patent/BE782752A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/237—Multiple bump connectors having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/936—Multiple bond pads having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
BE782752A 1971-04-28 1972-04-27 Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion BE782752A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13824471A 1971-04-28 1971-04-28

Publications (1)

Publication Number Publication Date
BE782752A true BE782752A (fr) 1972-08-16

Family

ID=22481133

Family Applications (1)

Application Number Title Priority Date Filing Date
BE782752A BE782752A (fr) 1971-04-28 1972-04-27 Transistor a micropaves a reflux de soudure et a grande dissipation de chaleur et son procede de connexion

Country Status (10)

Country Link
US (1) US3772575A (enExample)
AU (1) AU467540B2 (enExample)
BE (1) BE782752A (enExample)
CA (1) CA975870A (enExample)
DE (1) DE2218230A1 (enExample)
ES (2) ES401934A1 (enExample)
FR (1) FR2134553B1 (enExample)
GB (1) GB1374848A (enExample)
IT (1) IT950041B (enExample)
NL (1) NL7205728A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53147968A (en) * 1977-05-30 1978-12-23 Hitachi Ltd Thick film circuit board
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
GB2255672B (en) * 1991-05-10 1994-11-30 Northern Telecom Ltd Opto-electronic components
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
CN114407502A (zh) * 2022-03-01 2022-04-29 苏州通富超威半导体有限公司 印刷治具以及印刷方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL297002A (enExample) * 1962-08-23 1900-01-01
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung
US3539882A (en) * 1967-05-22 1970-11-10 Solitron Devices Flip chip thick film device
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
JPS4831507B1 (enExample) * 1969-07-10 1973-09-29
US3631307A (en) * 1970-02-13 1971-12-28 Itt Semiconductor structures having improved high-frequency response and power dissipation capabilities
US3697828A (en) * 1970-12-03 1972-10-10 Gen Motors Corp Geometry for a pnp silicon transistor with overlay contacts

Also Published As

Publication number Publication date
US3772575A (en) 1973-11-13
ES406660A1 (es) 1975-09-16
DE2218230A1 (de) 1972-11-09
FR2134553B1 (enExample) 1977-09-30
AU467540B2 (en) 1972-10-18
ES401934A1 (es) 1975-11-01
IT950041B (it) 1973-06-20
NL7205728A (enExample) 1972-10-31
FR2134553A1 (enExample) 1972-12-08
AU4097072A (en) 1972-10-18
GB1374848A (en) 1974-11-20
CA975870A (en) 1975-10-07

Similar Documents

Publication Publication Date Title
AR197790A1 (es) Dispositivo de produccion de frio
IT944595B (it) Dispositivo perturbatore di flus so e scambiatore di calore incor porante il medesimo
FR1465852A (fr) échangeurs de chaleur
CH528716A (de) Wärmeaustauscher mit Rohrdistanzhaltern
AT307464B (de) Wärmetransportvorrichtung
AT312117B (de) Hiezvorrichtung mit einem Wärmespeicher
BE771372A (fr) Disque chauffant et son procede de fabrication
IT970221B (it) Dispositivo di trasferimento di calore
NL7807815A (nl) Halfgeleiderinrichting met geisoleerde poort.
SE409004B (sv) Anordning for tillslutning av defekta vermevexlare
BE781574A (fr) Refrigerateur a absorption et son procede de refroidissement
BE767662A (fr) Echangeur de chaleur
BE757922A (fr) Echangeur de chaleur et procede pour son exploitation
BE776245A (fr) Rotor echangeur de chaleur pour fluides gazeux et son procede de realisation
BE771254A (fr) Procede de soufflage pour refroidisseur a grille et installations en comportant application
SE390083B (sv) Fastklemningsorgan for att klemma fast en halvledaranordning mellan tva vermeavledande kroppar
SE388003B (sv) Vermeoverforingsanordning
AT310204B (de) Vorrichtung an Wärmeaustauschern
BE774723A (fr) Echangeur tubulaire de chaleur
CH535416A (fr) Echangeur de chaleur
BE772705A (fr) Echangeurs de chaleur
FR1472815A (fr) Surface de transmission de chaleur perfectionnée
NL171109B (nl) Halfgeleiderinrichting met koude emissie.
AT310811B (de) Halbleiterelement mit Kühleinrichtung
BE777737A (fr) Perfectionnements aux echangeurs de chaleur