GB1369507A - Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates - Google Patents
Method for preventing high temperature blistering of copper coatings electro-deposited on copper substratesInfo
- Publication number
- GB1369507A GB1369507A GB4173271A GB4173271A GB1369507A GB 1369507 A GB1369507 A GB 1369507A GB 4173271 A GB4173271 A GB 4173271A GB 4173271 A GB4173271 A GB 4173271A GB 1369507 A GB1369507 A GB 1369507A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- electro
- deposited
- high temperature
- preventing high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 238000000576 coating method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000010953 base metal Substances 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C23/00—Tools; Devices not mentioned before for moulding
- B22C23/02—Devices for coating moulds or cores
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Mold Materials And Core Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7155970A | 1970-09-11 | 1970-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1369507A true GB1369507A (en) | 1974-10-09 |
Family
ID=22102108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4173271A Expired GB1369507A (en) | 1970-09-11 | 1971-09-07 | Method for preventing high temperature blistering of copper coatings electro-deposited on copper substrates |
Country Status (12)
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4552627A (en) * | 1984-11-13 | 1985-11-12 | Olin Corporation | Preparation for improving the adhesion properties of metal foils |
| EP0342669B1 (en) * | 1988-05-20 | 1995-08-23 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| DE202009013126U1 (de) | 2009-09-29 | 2009-12-10 | Egon Evertz Kg (Gmbh & Co.) | Kokille zum Stranggießen |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2461228A (en) * | 1949-02-08 | Donald lee miles | ||
| US1918159A (en) * | 1932-01-19 | 1933-07-11 | Weisberg & Greenwald Inc | Electrodeposition |
| US1995200A (en) * | 1932-08-30 | 1935-03-19 | Union Switch & Signal Co | Manufacture of photo-electric cells |
| DE715515C (de) * | 1940-04-27 | 1942-01-03 | Richard Beck | Verfahren zur anodischen Vorbehandlung zuvor in ueblicher Weise entfetteter Metalloberflaechen |
| US3202589A (en) * | 1963-09-12 | 1965-08-24 | Diamond Alkali Co | Electroplating |
-
1970
- 1970-09-11 US US71559A patent/US3671407A/en not_active Expired - Lifetime
-
1971
- 1971-08-30 ZA ZA715792A patent/ZA715792B/xx unknown
- 1971-09-01 CA CA121,917A patent/CA999554A/en not_active Expired
- 1971-09-03 DE DE2144280A patent/DE2144280C3/de not_active Expired
- 1971-09-06 BE BE772249A patent/BE772249A/xx unknown
- 1971-09-07 GB GB4173271A patent/GB1369507A/en not_active Expired
- 1971-09-08 ES ES394896A patent/ES394896A1/es not_active Expired
- 1971-09-08 FR FR7132387A patent/FR2106446B1/fr not_active Expired
- 1971-09-10 NL NL7112504A patent/NL7112504A/xx active Search and Examination
- 1971-09-10 IT IT70007/71A patent/IT939804B/it active
- 1971-09-10 BR BR5954/71A patent/BR7105954D0/pt unknown
- 1971-09-11 JP JP7079871A patent/JPS5625519B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ES394896A1 (es) | 1974-12-01 |
| US3671407A (en) | 1972-06-20 |
| NL7112504A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-03-14 |
| DE2144280B2 (de) | 1980-04-10 |
| IT939804B (it) | 1973-02-10 |
| AU3301871A (en) | 1973-03-08 |
| BR7105954D0 (pt) | 1973-04-05 |
| CA999554A (en) | 1976-11-09 |
| FR2106446B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-07-11 |
| FR2106446A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-05-05 |
| BE772249A (fr) | 1972-03-06 |
| ZA715792B (en) | 1972-04-26 |
| DE2144280A1 (de) | 1972-03-16 |
| JPS5625519B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-06-12 |
| DE2144280C3 (de) | 1982-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |