GB1362147A - Semiconductor rectifier assemblies - Google Patents

Semiconductor rectifier assemblies

Info

Publication number
GB1362147A
GB1362147A GB3280072A GB3280072A GB1362147A GB 1362147 A GB1362147 A GB 1362147A GB 3280072 A GB3280072 A GB 3280072A GB 3280072 A GB3280072 A GB 3280072A GB 1362147 A GB1362147 A GB 1362147A
Authority
GB
United Kingdom
Prior art keywords
springs
flat plates
extrusions
finned
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3280072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1362147A publication Critical patent/GB1362147A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Die Bonding (AREA)
GB3280072A 1971-07-19 1972-07-13 Semiconductor rectifier assemblies Expired GB1362147A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16366071A 1971-07-19 1971-07-19

Publications (1)

Publication Number Publication Date
GB1362147A true GB1362147A (en) 1974-07-30

Family

ID=22591008

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3280072A Expired GB1362147A (en) 1971-07-19 1972-07-13 Semiconductor rectifier assemblies

Country Status (6)

Country Link
US (1) US3686541A (https=)
CA (1) CA959545A (https=)
DE (1) DE2232953A1 (https=)
FR (1) FR2146364B1 (https=)
GB (1) GB1362147A (https=)
ZA (1) ZA724242B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825804A (en) * 1972-03-03 1974-07-23 Bbc Brown Boveri & Cie Clamped disc type semiconductor assembly with built-in contact pressure gage
US4093958A (en) * 1976-12-09 1978-06-06 Motorola, Inc. Semiconductor device assembly with improved fatigue resistance
US4160992A (en) * 1977-09-14 1979-07-10 Raytheon Company Plural semiconductor devices mounted between plural heat sinks
US4215360A (en) * 1978-11-09 1980-07-29 General Motors Corporation Power semiconductor device assembly having a lead frame with interlock members
JP2556877B2 (ja) * 1988-03-10 1996-11-27 株式会社村田製作所 正特性サーミスタ装置
JPH0225057A (ja) * 1988-07-13 1990-01-26 Mitsubishi Electric Corp 半導体装置の製造方法
US5798916A (en) * 1997-03-20 1998-08-25 Electric Power Research Institute, Inc. High power inverter pole employing series connected devices configured for reduced stray loop inductance
CN101663752B (zh) * 2007-03-30 2011-10-26 Abb技术有限公司 功率半导体装置及设置有功率半导体装置的半导体阀
AT506778B1 (de) * 2008-04-29 2012-04-15 Siemens Ag Kühlanordnung mit zwei nebeneinander angeordneten halbleiterbauelementen
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures
CN114770403B (zh) * 2022-05-25 2024-09-03 惠州市云创电子有限公司 一种整流器加工设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
NL283717A (https=) * 1961-11-28
CH396220A (de) * 1962-03-30 1965-07-31 Bbc Brown Boveri & Cie Halbleiteranordnung
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
FR2004508A1 (https=) * 1968-03-22 1969-11-28 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
FR2146364B1 (https=) 1977-12-23
ZA724242B (en) 1973-03-28
CA959545A (en) 1974-12-17
DE2232953A1 (de) 1973-02-01
US3686541A (en) 1972-08-22
FR2146364A1 (https=) 1973-03-02

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees