GB1145858A - Thermoelectric assembly - Google Patents
Thermoelectric assemblyInfo
- Publication number
- GB1145858A GB1145858A GB24486/66A GB2448666A GB1145858A GB 1145858 A GB1145858 A GB 1145858A GB 24486/66 A GB24486/66 A GB 24486/66A GB 2448666 A GB2448666 A GB 2448666A GB 1145858 A GB1145858 A GB 1145858A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- end plates
- compression
- thermoelectric
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/813—Structural details of the junction the junction being separable, e.g. using a spring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
1,145,858. Thermoelectric devices. T. M. ELFVING. 1 June, 1966 [1 June, 1965; 14 June, 1965], No. 24486/66. Heading H1K. In a thermoelectric heat pump a heat exchanger to a gaseous medium comprises a bimetallic member serving as a junction bridge and consisting of a first part of a metal of good conductivity, e.g. copper, in contact with the semi-conductor body, and a second part of or containing aluminium in contact with the gaseous medium, the semi-conductor body being prestressed by compression means acting along a centre line parallel to the direction of the current path. As shown, Fig. 1, two blocks 11, 12 of semiconductor material of opposite types are soldered between copper strips 13 and end plates 16 using a bismuth-tin solder. Strips 13 are shaped to fit the cylindrical surface of a tube 14 which may be of copper or of aluminium with a copper sheath. Soft solder is provided at the joints between strips 13 and tube 14, the assembly is compressed, and insulating material 22 such as an epoxy resin is applied to encapsulate the device. While the resin is curing the assembly is heated to solder the strips 13 to the tube 14. When it has hardened, the encapsulation maintains the elements in compression. Heat exchangers comprising copper tubes 17 provided with aluminium fins 19, may be soldered to the end plates 16. The copper end plates may be nickel plated. In a modification, Figs. 3 and 4 (not shown), the thermoelectric elements are maintained in compression by means of a pair of bolts engaging ears provided on the end plates. In a second embodiment, a single thermoelectric element is mounted between a pair of end plates to which are soldered finned heat exchangers. The thermoelectric elements can be maintained under compression by an encapsulation of a foamed P.V.C. or poxy resin, Figs. 5 and 6 (not shown), by a central bolt, the element being annular or comprising a plurality of bodies arranged in an annulus, Figs. 7 and 8 (not shown), by a plurality of bolts symmetrically arranged round the element, Fig. 11 (not shown) or by a clamp encircling the edges of the end plates, Figs. 12 and 13 (not shown). In a further embodiment, Figs. 9 and 10 (not shown) a pair of annular thermoelectric elements are provided, each being soldered between an end plate and a washer, the washers being bridged by a finned heat exchanger. The assembly is held in compression by a spring bolt or by a bolt with a compression spring under its head or nut. The space inside the assembly is filled with foamed insulator and sleeves of insulating material cover the outsides of the thermoelectric elements. Each of the thermoelectric elements may comprise a plurality of bodies arranged in an annulus. Various assemblies of the device are described, Figs. 14 to 19 (not shown), and include ones in which the junctions between pairs of annular elements are alternately washers or blocks connected to centrally disposed fluid tubes and circumferentially arranged finned tubes, Figs. 20 and 23 (not shown). It is stated that the compressive force may be such as to obviate the need for soldering the parts together. The contacts may be improved by applying silicone grease or metallic compounds, and the parts may have locating grooves, flanges or depressions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46020965A | 1965-06-01 | 1965-06-01 | |
US463713A US3273347A (en) | 1965-06-14 | 1965-06-14 | Thermoelectric heat pump assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1145858A true GB1145858A (en) | 1969-03-19 |
Family
ID=27039602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB24486/66A Expired GB1145858A (en) | 1965-06-01 | 1966-06-01 | Thermoelectric assembly |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1539286A1 (en) |
GB (1) | GB1145858A (en) |
SE (2) | SE309621B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150682A (en) * | 1983-10-12 | 1985-07-03 | Roger Ivan Bishop | Space heating of barrier structures |
WO2008056154A1 (en) * | 2006-11-08 | 2008-05-15 | 4Energy Limited | Thermoelectric refrigerating device |
CN114777549A (en) * | 2022-06-20 | 2022-07-22 | 甘肃蓝科石化高新装备股份有限公司 | Finned tube with tube-fin bridge for gas to flow in different regions |
-
1966
- 1966-05-28 DE DE19661539286 patent/DE1539286A1/en active Pending
- 1966-06-01 SE SE7514/66A patent/SE309621B/xx unknown
- 1966-06-01 SE SE6801633A patent/SE374233B/xx unknown
- 1966-06-01 GB GB24486/66A patent/GB1145858A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150682A (en) * | 1983-10-12 | 1985-07-03 | Roger Ivan Bishop | Space heating of barrier structures |
WO2008056154A1 (en) * | 2006-11-08 | 2008-05-15 | 4Energy Limited | Thermoelectric refrigerating device |
CN114777549A (en) * | 2022-06-20 | 2022-07-22 | 甘肃蓝科石化高新装备股份有限公司 | Finned tube with tube-fin bridge for gas to flow in different regions |
Also Published As
Publication number | Publication date |
---|---|
DE1539286A1 (en) | 1969-09-18 |
SE374233B (en) | 1975-02-24 |
SE309621B (en) | 1969-03-31 |
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