GB1441433A - Heat conductive pastes - Google Patents

Heat conductive pastes

Info

Publication number
GB1441433A
GB1441433A GB4377573A GB4377573A GB1441433A GB 1441433 A GB1441433 A GB 1441433A GB 4377573 A GB4377573 A GB 4377573A GB 4377573 A GB4377573 A GB 4377573A GB 1441433 A GB1441433 A GB 1441433A
Authority
GB
United Kingdom
Prior art keywords
heat conductive
conductive pastes
heat
sept
heading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4377573A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IND INSTR Ltd
Original Assignee
IND INSTR Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IND INSTR Ltd filed Critical IND INSTR Ltd
Priority to GB4377573A priority Critical patent/GB1441433A/en
Publication of GB1441433A publication Critical patent/GB1441433A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1441433 Heat conductive pastes INDUSTRIAL INSTRUMENTS Ltd 26 July 1974 [18 Sept 1973] 43775/73 Heading C3T [Also in Division H1] A paste for use in improving the heat transfer between a pair of adjacent surfaces, e.g. a semiconductor device mounted on a heat sink, consists of aluminium powder and a silicone fluid, for example in a weight ratio of 1 : 2.
GB4377573A 1973-09-18 1973-09-18 Heat conductive pastes Expired GB1441433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4377573A GB1441433A (en) 1973-09-18 1973-09-18 Heat conductive pastes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4377573A GB1441433A (en) 1973-09-18 1973-09-18 Heat conductive pastes

Publications (1)

Publication Number Publication Date
GB1441433A true GB1441433A (en) 1976-06-30

Family

ID=10430262

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4377573A Expired GB1441433A (en) 1973-09-18 1973-09-18 Heat conductive pastes

Country Status (1)

Country Link
GB (1) GB1441433A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0000856A1 (en) * 1977-08-12 1979-02-21 International Business Machines Corporation Magnetic heat transfer device for semiconductor chip
FR2412168A1 (en) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc OVERVOLTAGE DIODES
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
EP0696630A2 (en) * 1994-08-10 1996-02-14 Fujitsu Limited Heat conductive material and method for producing the same
EP0982392A1 (en) * 1998-08-21 2000-03-01 Shin-Etsu Chemical Co., Ltd. Thermally conductive grease composition and semiconductor device using the same
US8778231B2 (en) 2010-12-16 2014-07-15 E I Du Pont De Nemours And Company Aluminum pastes comprising boron nitride and their use in manufacturing solar cells

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0000856A1 (en) * 1977-08-12 1979-02-21 International Business Machines Corporation Magnetic heat transfer device for semiconductor chip
FR2412168A1 (en) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc OVERVOLTAGE DIODES
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
EP0696630A2 (en) * 1994-08-10 1996-02-14 Fujitsu Limited Heat conductive material and method for producing the same
EP0696630A3 (en) * 1994-08-10 1997-05-14 Fujitsu Ltd Heat conductive material and method for producing the same
EP0982392A1 (en) * 1998-08-21 2000-03-01 Shin-Etsu Chemical Co., Ltd. Thermally conductive grease composition and semiconductor device using the same
US8778231B2 (en) 2010-12-16 2014-07-15 E I Du Pont De Nemours And Company Aluminum pastes comprising boron nitride and their use in manufacturing solar cells

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee