AU3230971A - Heat conducting paste - Google Patents

Heat conducting paste

Info

Publication number
AU3230971A
AU3230971A AU32309/71A AU3230971A AU3230971A AU 3230971 A AU3230971 A AU 3230971A AU 32309/71 A AU32309/71 A AU 32309/71A AU 3230971 A AU3230971 A AU 3230971A AU 3230971 A AU3230971 A AU 3230971A
Authority
AU
Australia
Prior art keywords
heat conducting
conducting paste
paste
heat
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU32309/71A
Inventor
KONRAD CUSHNER and HEIMO SCHERER DR.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of AU3230971A publication Critical patent/AU3230971A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU32309/71A 1970-08-27 1971-08-12 Heat conducting paste Expired AU3230971A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19702042494 DE2042494A1 (en) 1970-08-27 1970-08-27 Heat conducting pastes - mixture of zinc oxide and low viscosity epoxide esp for transistorised equipment
DEDE820424 1970-08-27

Publications (1)

Publication Number Publication Date
AU3230971A true AU3230971A (en) 1973-02-15

Family

ID=5780861

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32309/71A Expired AU3230971A (en) 1970-08-27 1971-08-12 Heat conducting paste

Country Status (2)

Country Link
AU (1) AU3230971A (en)
DE (1) DE2042494A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4538171A (en) * 1980-10-30 1985-08-27 Cableform Limited High power semiconductor heat sink assembly
EP0375980A3 (en) * 1988-12-29 1991-10-30 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
JPH02271558A (en) * 1989-04-12 1990-11-06 Mitsubishi Electric Corp Semiconductor device and its manufacture

Also Published As

Publication number Publication date
DE2042494A1 (en) 1972-03-02

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