DE2232953A1 - Einrichtung zur verklammerung von thyristoren - Google Patents
Einrichtung zur verklammerung von thyristorenInfo
- Publication number
- DE2232953A1 DE2232953A1 DE2232953A DE2232953A DE2232953A1 DE 2232953 A1 DE2232953 A1 DE 2232953A1 DE 2232953 A DE2232953 A DE 2232953A DE 2232953 A DE2232953 A DE 2232953A DE 2232953 A1 DE2232953 A1 DE 2232953A1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- semiconductor
- rectifiers
- rectifier
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/625—Clamping parts not primarily conducting heat
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16366071A | 1971-07-19 | 1971-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2232953A1 true DE2232953A1 (de) | 1973-02-01 |
Family
ID=22591008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2232953A Pending DE2232953A1 (de) | 1971-07-19 | 1972-07-05 | Einrichtung zur verklammerung von thyristoren |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3686541A (https=) |
| CA (1) | CA959545A (https=) |
| DE (1) | DE2232953A1 (https=) |
| FR (1) | FR2146364B1 (https=) |
| GB (1) | GB1362147A (https=) |
| ZA (1) | ZA724242B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT506778B1 (de) * | 2008-04-29 | 2012-04-15 | Siemens Ag | Kühlanordnung mit zwei nebeneinander angeordneten halbleiterbauelementen |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3825804A (en) * | 1972-03-03 | 1974-07-23 | Bbc Brown Boveri & Cie | Clamped disc type semiconductor assembly with built-in contact pressure gage |
| US4093958A (en) * | 1976-12-09 | 1978-06-06 | Motorola, Inc. | Semiconductor device assembly with improved fatigue resistance |
| US4160992A (en) * | 1977-09-14 | 1979-07-10 | Raytheon Company | Plural semiconductor devices mounted between plural heat sinks |
| US4215360A (en) * | 1978-11-09 | 1980-07-29 | General Motors Corporation | Power semiconductor device assembly having a lead frame with interlock members |
| JP2556877B2 (ja) * | 1988-03-10 | 1996-11-27 | 株式会社村田製作所 | 正特性サーミスタ装置 |
| JPH0225057A (ja) * | 1988-07-13 | 1990-01-26 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| US5798916A (en) * | 1997-03-20 | 1998-08-25 | Electric Power Research Institute, Inc. | High power inverter pole employing series connected devices configured for reduced stray loop inductance |
| WO2008121038A1 (en) * | 2007-03-30 | 2008-10-09 | Abb Technology Ltd | A power semiconductor arrangement and a semiconductor valve provided therewith |
| US11488927B2 (en) | 2021-02-18 | 2022-11-01 | Abb Schweiz Ag | Press-pack semiconductor fixtures |
| CN114770403B (zh) * | 2022-05-25 | 2024-09-03 | 惠州市云创电子有限公司 | 一种整流器加工设备 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2751528A (en) * | 1954-12-01 | 1956-06-19 | Gen Electric | Rectifier cell mounting |
| NL283717A (https=) * | 1961-11-28 | |||
| CH396220A (de) * | 1962-03-30 | 1965-07-31 | Bbc Brown Boveri & Cie | Halbleiteranordnung |
| DE1299076B (de) * | 1966-06-10 | 1969-07-10 | Siemens Ag | Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen |
| FR2004508A1 (https=) * | 1968-03-22 | 1969-11-28 | Mitsubishi Electric Corp |
-
1971
- 1971-07-19 US US3686541D patent/US3686541A/en not_active Expired - Lifetime
-
1972
- 1972-06-20 ZA ZA724242A patent/ZA724242B/xx unknown
- 1972-06-27 CA CA145,766A patent/CA959545A/en not_active Expired
- 1972-07-05 DE DE2232953A patent/DE2232953A1/de active Pending
- 1972-07-13 GB GB3280072A patent/GB1362147A/en not_active Expired
- 1972-07-19 FR FR7225955A patent/FR2146364B1/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT506778B1 (de) * | 2008-04-29 | 2012-04-15 | Siemens Ag | Kühlanordnung mit zwei nebeneinander angeordneten halbleiterbauelementen |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1362147A (en) | 1974-07-30 |
| FR2146364A1 (https=) | 1973-03-02 |
| US3686541A (en) | 1972-08-22 |
| CA959545A (en) | 1974-12-17 |
| ZA724242B (en) | 1973-03-28 |
| FR2146364B1 (https=) | 1977-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHJ | Non-payment of the annual fee |