GB1339910A - Alloy deposition by liquid phase sputtering - Google Patents

Alloy deposition by liquid phase sputtering

Info

Publication number
GB1339910A
GB1339910A GB1095771*[A GB1095771A GB1339910A GB 1339910 A GB1339910 A GB 1339910A GB 1095771 A GB1095771 A GB 1095771A GB 1339910 A GB1339910 A GB 1339910A
Authority
GB
United Kingdom
Prior art keywords
liquid phase
port
substrate
alloy deposition
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1095771*[A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Technologies Corp
Original Assignee
United Aircraft Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Aircraft Corp filed Critical United Aircraft Corp
Publication of GB1339910A publication Critical patent/GB1339910A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3428Cathode assembly for sputtering apparatus, e.g. Target using liquid targets
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354Introduction of auxiliary energy into the plasma
    • C23C14/355Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1339910 Sputtering metals UNITED AIRCRAFT CORP 23 April 1971 [13 May 1970] 10957/71 Heading C7F A metal, e.g. Sn, or an alloy is sputtered and evaporated from a liquid cathode maintained in a copper hearth 4, having a shield 8, on to a substrate 14. A glow discharge is provided by a filament 9. An adjustable magnetic field is provided by solenoid 12. The vacuum chamber is exhausted through a port 2 against a controlled argon leak through a port 3. The electron emission preheats the substrate. The alloys may be Fe-Cr-Al-Yt or Fe-V.
GB1095771*[A 1970-05-13 1971-04-23 Alloy deposition by liquid phase sputtering Expired GB1339910A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3679870A 1970-05-13 1970-05-13

Publications (1)

Publication Number Publication Date
GB1339910A true GB1339910A (en) 1973-12-05

Family

ID=21890717

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1095771*[A Expired GB1339910A (en) 1970-05-13 1971-04-23 Alloy deposition by liquid phase sputtering

Country Status (8)

Country Link
BE (1) BE766959A (en)
CA (1) CA941781A (en)
CH (1) CH562327A5 (en)
DE (1) DE2122336A1 (en)
FR (1) FR2088554B1 (en)
GB (1) GB1339910A (en)
IL (1) IL36711A (en)
SE (1) SE368841B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4105014A1 (en) * 1991-02-19 1992-08-20 Leybold Ag Vapour deposition - has closed tunnels of magnetic field lines over molten material in crucible with electron beam guns for ionisation
WO2004044261A3 (en) * 2002-11-14 2004-08-26 Zond Inc High deposition rate sputtering
US7147759B2 (en) 2002-09-30 2006-12-12 Zond, Inc. High-power pulsed magnetron sputtering
US8125155B2 (en) 2004-02-22 2012-02-28 Zond, Inc. Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3615361C2 (en) * 1986-05-06 1994-09-01 Santos Pereira Ribeiro Car Dos Device for the surface treatment of workpieces

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB505135A (en) * 1937-03-25 1939-05-05 Bernhard Berghaus Improvements in and relating to the coating of articles by cathode disintegration
US2305758A (en) * 1937-05-25 1942-12-22 Berghaus Bernhard Coating of articles by cathode disintegration

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4105014A1 (en) * 1991-02-19 1992-08-20 Leybold Ag Vapour deposition - has closed tunnels of magnetic field lines over molten material in crucible with electron beam guns for ionisation
US7147759B2 (en) 2002-09-30 2006-12-12 Zond, Inc. High-power pulsed magnetron sputtering
WO2004044261A3 (en) * 2002-11-14 2004-08-26 Zond Inc High deposition rate sputtering
US6896773B2 (en) 2002-11-14 2005-05-24 Zond, Inc. High deposition rate sputtering
US7811421B2 (en) 2002-11-14 2010-10-12 Zond, Inc. High deposition rate sputtering
US8125155B2 (en) 2004-02-22 2012-02-28 Zond, Inc. Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities

Also Published As

Publication number Publication date
DE2122336A1 (en) 1971-12-02
BE766959A (en) 1971-10-01
CH562327A5 (en) 1975-05-30
FR2088554A1 (en) 1972-01-07
CA941781A (en) 1974-02-12
IL36711A0 (en) 1971-11-29
SE368841B (en) 1974-07-22
FR2088554B1 (en) 1975-07-04
IL36711A (en) 1974-05-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee