GB1326994A - Arrangements for electrically connecting integrated ciruits - Google Patents

Arrangements for electrically connecting integrated ciruits

Info

Publication number
GB1326994A
GB1326994A GB2086071A GB2086071A GB1326994A GB 1326994 A GB1326994 A GB 1326994A GB 2086071 A GB2086071 A GB 2086071A GB 2086071 A GB2086071 A GB 2086071A GB 1326994 A GB1326994 A GB 1326994A
Authority
GB
United Kingdom
Prior art keywords
chips
leads
bus
substrate
buses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2086071A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1326994A publication Critical patent/GB1326994A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
    • G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB2086071A 1970-02-02 1971-04-19 Arrangements for electrically connecting integrated ciruits Expired GB1326994A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US791570A 1970-02-02 1970-02-02

Publications (1)

Publication Number Publication Date
GB1326994A true GB1326994A (en) 1973-08-15

Family

ID=21728786

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2086071A Expired GB1326994A (en) 1970-02-02 1971-04-19 Arrangements for electrically connecting integrated ciruits

Country Status (5)

Country Link
US (1) US3611317A (https=)
DE (1) DE2103771A1 (https=)
FR (1) FR2079182B1 (https=)
GB (1) GB1326994A (https=)
NL (1) NL7101306A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2170657A (en) * 1985-02-05 1986-08-06 Stc Plc Semiconductor memory device

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774168A (en) * 1970-08-03 1973-11-20 Ncr Co Memory with self-clocking beam access
JPS57207356A (en) * 1981-06-15 1982-12-20 Fujitsu Ltd Semiconductor device
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
DE3542208A1 (de) * 1985-11-29 1987-06-04 Diehl Gmbh & Co Leiterbahnen-anordnung
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
US4868634A (en) * 1987-03-13 1989-09-19 Citizen Watch Co., Ltd. IC-packaged device
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
US4918335A (en) * 1987-11-06 1990-04-17 Ford Aerospace Corporation Interconnection system for integrated circuit chips
US5287304A (en) * 1990-12-31 1994-02-15 Texas Instruments Incorporated Memory cell circuit and array
JP3138539B2 (ja) * 1992-06-30 2001-02-26 三菱電機株式会社 半導体装置及びｃｏｂ基板
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US6418490B1 (en) * 1998-12-30 2002-07-09 International Business Machines Corporation Electronic circuit interconnection system using a virtual mirror cross over package
US6735651B1 (en) * 1999-07-30 2004-05-11 International Business Machines Corporation Multi-chip module having chips coupled in a ring
JP2003068806A (ja) * 2001-08-29 2003-03-07 Hitachi Ltd 半導体装置及びその製造方法
US6747331B2 (en) * 2002-07-17 2004-06-08 International Business Machines Corporation Method and packaging structure for optimizing warpage of flip chip organic packages
US6961792B1 (en) * 2003-05-23 2005-11-01 Storage Technology Corporation System for configuring expandable buses in a multi-device storage container and related method
JP2008091722A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体集積回路
US9645603B1 (en) 2013-09-12 2017-05-09 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US11042211B2 (en) 2009-08-07 2021-06-22 Advanced Processor Architectures, Llc Serially connected computing nodes in a distributed computing system
US9429983B1 (en) 2013-09-12 2016-08-30 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US8022526B2 (en) 2009-08-07 2011-09-20 Advanced Processor Architectures, Llc Distributed computing
US10832753B2 (en) * 2017-07-31 2020-11-10 General Electric Company Components including structures having decoupled load paths

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL298196A (https=) * 1962-09-22
US3187309A (en) * 1963-08-16 1965-06-01 Ibm Computer memory
US3389383A (en) * 1967-05-31 1968-06-18 Gen Electric Integrated circuit bistable memory cell
NL6814613A (https=) * 1967-10-13 1969-04-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2170657A (en) * 1985-02-05 1986-08-06 Stc Plc Semiconductor memory device

Also Published As

Publication number Publication date
NL7101306A (https=) 1971-08-04
FR2079182B1 (https=) 1974-02-15
US3611317A (en) 1971-10-05
FR2079182A1 (https=) 1971-11-12
DE2103771A1 (de) 1971-08-12

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees