NL6814613A - - Google Patents

Info

Publication number
NL6814613A
NL6814613A NL6814613A NL6814613A NL6814613A NL 6814613 A NL6814613 A NL 6814613A NL 6814613 A NL6814613 A NL 6814613A NL 6814613 A NL6814613 A NL 6814613A NL 6814613 A NL6814613 A NL 6814613A
Authority
NL
Netherlands
Application number
NL6814613A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6814613A publication Critical patent/NL6814613A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65Shapes or dispositions of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07231Techniques
    • H10W72/07232Compression bonding, e.g. thermocompression bonding
    • H10W72/07233Ultrasonic bonding, e.g. thermosonic bonding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07231Techniques
    • H10W72/07236Soldering or alloying
NL6814613A 1967-10-13 1968-10-11 NL6814613A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4670367 1967-10-13

Publications (1)

Publication Number Publication Date
NL6814613A true NL6814613A (https=) 1969-04-15

Family

ID=10442270

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6814613A NL6814613A (https=) 1967-10-13 1968-10-11

Country Status (3)

Country Link
DE (1) DE1802873A1 (https=)
FR (1) FR1589045A (https=)
NL (1) NL6814613A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2079182A1 (https=) * 1970-02-02 1971-11-12 Western Electric Co

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD282319A5 (de) * 1989-03-07 1990-09-05 Elektronische Bauelemente Veb Edelmetallfreie chipleiterbruecke und verfahren zu ihrer herstellung
DE29621383U1 (de) * 1996-12-10 1997-02-06 Sorpetaler Fensterbau GmbH, 59846 Sundern Fenster
JP2017038085A (ja) * 2016-11-08 2017-02-16 株式会社村田製作所 回路モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2079182A1 (https=) * 1970-02-02 1971-11-12 Western Electric Co

Also Published As

Publication number Publication date
DE1802873A1 (de) 1969-07-10
FR1589045A (https=) 1970-03-16

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