GB1314745A - Electroless plating bath for depositing a nickel alloy layer - Google Patents
Electroless plating bath for depositing a nickel alloy layerInfo
- Publication number
- GB1314745A GB1314745A GB3865971A GB3865971A GB1314745A GB 1314745 A GB1314745 A GB 1314745A GB 3865971 A GB3865971 A GB 3865971A GB 3865971 A GB3865971 A GB 3865971A GB 1314745 A GB1314745 A GB 1314745A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless plating
- depositing
- alloy layer
- plating bath
- moles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007772 electroless plating Methods 0.000 title abstract 2
- 229910000990 Ni alloy Inorganic materials 0.000 title 1
- 238000000151 deposition Methods 0.000 title 1
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 abstract 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract 1
- 239000004471 Glycine Substances 0.000 abstract 1
- 229910003296 Ni-Mo Inorganic materials 0.000 abstract 1
- 229910018100 Ni-Sn Inorganic materials 0.000 abstract 1
- 229910018532 Ni—Sn Inorganic materials 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 150000001450 anions Chemical class 0.000 abstract 1
- -1 citrate ions Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 150000002751 molybdenum Chemical class 0.000 abstract 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229940095064 tartrate Drugs 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9344470A | 1970-11-27 | 1970-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1314745A true GB1314745A (en) | 1973-04-26 |
Family
ID=22238993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3865971A Expired GB1314745A (en) | 1970-11-27 | 1971-08-18 | Electroless plating bath for depositing a nickel alloy layer |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3674516A (enExample) |
| CA (1) | CA967705A (enExample) |
| DE (1) | DE2148744A1 (enExample) |
| FR (1) | FR2115164B1 (enExample) |
| GB (1) | GB1314745A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4632857A (en) * | 1974-05-24 | 1986-12-30 | Richardson Chemical Company | Electrolessly plated product having a polymetallic catalytic film underlayer |
| US4019910A (en) * | 1974-05-24 | 1977-04-26 | The Richardson Chemical Company | Electroless nickel polyalloy plating baths |
| US5190796A (en) * | 1991-06-27 | 1993-03-02 | General Electric Company | Method of applying metal coatings on diamond and articles made therefrom |
| KR101170560B1 (ko) | 2003-05-09 | 2012-08-01 | 바스프 에스이 | 반도체 산업에서 사용하기 위한 3성분 물질의 무전해석출용 조성물 |
| CN103282545B (zh) * | 2010-09-03 | 2015-08-26 | Omg电子化学品有限责任公司 | 无电镍合金镀液及其沉积过程 |
| CN102011107B (zh) * | 2010-12-24 | 2012-07-11 | 杭州东方表面技术有限公司 | 可获取高可焊性镀层的化学镀镍磷合金溶液 |
-
1970
- 1970-11-27 US US93444A patent/US3674516A/en not_active Expired - Lifetime
-
1971
- 1971-08-18 GB GB3865971A patent/GB1314745A/en not_active Expired
- 1971-09-30 DE DE19712148744 patent/DE2148744A1/de active Pending
- 1971-10-12 FR FR7137574A patent/FR2115164B1/fr not_active Expired
- 1971-11-12 CA CA127,427A patent/CA967705A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2115164B1 (enExample) | 1976-02-13 |
| FR2115164A1 (enExample) | 1972-07-07 |
| US3674516A (en) | 1972-07-04 |
| CA967705A (en) | 1975-05-20 |
| DE2148744A1 (de) | 1972-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |