US3674516A - Electroless codeposition of nickel alloys - Google Patents
Electroless codeposition of nickel alloys Download PDFInfo
- Publication number
- US3674516A US3674516A US93444A US3674516DA US3674516A US 3674516 A US3674516 A US 3674516A US 93444 A US93444 A US 93444A US 3674516D A US3674516D A US 3674516DA US 3674516 A US3674516 A US 3674516A
- Authority
- US
- United States
- Prior art keywords
- mole
- bath
- nickel
- ions
- alloy layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000990 Ni alloy Inorganic materials 0.000 title description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 abstract description 32
- 238000000151 deposition Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 18
- 239000004471 Glycine Substances 0.000 abstract description 16
- 239000007864 aqueous solution Substances 0.000 abstract description 16
- 238000007772 electroless plating Methods 0.000 abstract description 16
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 abstract description 12
- -1 MOLYBDATE IONS Chemical class 0.000 abstract description 9
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 abstract description 7
- 229910001453 nickel ion Inorganic materials 0.000 abstract description 7
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 abstract description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 abstract description 4
- 229910001128 Sn alloy Inorganic materials 0.000 abstract description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 abstract description 2
- DHMQDGOQFOQNFH-CNRUNOGKSA-N 2-amino-2-tritioacetic acid Chemical compound [3H]C(N)C(O)=O DHMQDGOQFOQNFH-CNRUNOGKSA-N 0.000 abstract 1
- 229910001182 Mo alloy Inorganic materials 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 abstract 1
- 229960002167 sodium tartrate Drugs 0.000 abstract 1
- 239000001433 sodium tartrate Substances 0.000 abstract 1
- 235000011004 sodium tartrates Nutrition 0.000 abstract 1
- 229940071182 stannate Drugs 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 40
- 229910045601 alloy Inorganic materials 0.000 description 38
- 239000000956 alloy Substances 0.000 description 38
- 229910018100 Ni-Sn Inorganic materials 0.000 description 27
- 229910018532 Ni—Sn Inorganic materials 0.000 description 27
- 239000000758 substrate Substances 0.000 description 19
- 150000001768 cations Chemical class 0.000 description 13
- 239000011550 stock solution Substances 0.000 description 12
- 229910003296 Ni-Mo Inorganic materials 0.000 description 11
- 229940095064 tartrate Drugs 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 10
- 229910052718 tin Inorganic materials 0.000 description 10
- 150000001450 anions Chemical class 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 229910001432 tin ion Inorganic materials 0.000 description 6
- 241000080590 Niso Species 0.000 description 5
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007865 diluting Methods 0.000 description 4
- 150000002815 nickel Chemical class 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 239000001476 sodium potassium tartrate Substances 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910003294 NiMo Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- YPSNMKHPDJVGEX-UHFFFAOYSA-L potassium;sodium;3-carboxy-3-hydroxypentanedioate Chemical compound [Na+].[K+].OC(=O)CC(O)(C([O-])=O)CC([O-])=O YPSNMKHPDJVGEX-UHFFFAOYSA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011684 sodium molybdate Substances 0.000 description 1
- 235000015393 sodium molybdate Nutrition 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001874 trioxidanyl group Chemical group [*]OOO[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Definitions
- nickel coating It is desired in electromagnetic coatings for shielding purposes that the nickel coating have the following properties: relatively high solid solderability, corrosion resistance, chemical resistance, mechanical resistance and relatively low electrical contact resistance.
- the present day nickel coatings are somewhat deficient in the above properties. It is known theoretrically that the addition of a significant percentage of tin to a coating of nickel should improve the above properties. Further, addition of molybdenum to nickel is also known to improve its corrosion resistance property.
- prior art attempts to deposit nickel-tin alloy electrolessly have been unsuccessful because the tin ions poison conventional electroless nickel deposition baths.
- tin-nickelphosphorous alloy has been prepared as disclosed in U.S. Pats. Nos. 3,077,421 and 3,077,285 wherein nickel-phosphorous alloy coating is electrolessly deposited upon an iron substate, metallic tin is thereafter plated upon the alloy, and the composite is heated to cause the tin to diifuse into the outer skin of the coating.
- the prior art cited does not teach a method for the simultaneous deposition of Ni and Sn to form an alloy thereof by electroless deposition.
- an Ni-Sn alloy layer or an Ni-Mo alloy layer is electrolessly deposited from a particularly constituted electroless deposition bath on a suitable substrate such as conventionally activated copper, nickel, iron or other metal substrates, e.g., activated by Pd.
- the bath is prepared by mixing and diluting stock solutions having therein either sources for nickel ions, tin ions, hypophosphite ions, glycine and tartrate ions; or sources of nickel ions, molybdate ions, glycine, and hypophosphite.
- Sufiicient hydroxide ions are added to either of the above baths to obtain pH of about 135.
- Films or layers of either Ni-Sn alloy or Ni-Mo alloy are deposited by immersing a suitable substrate in a bath of this invention for a time sufi'lcient to form a film of desired thickness.
- the bath is maintained at a temperature of from about 20 C. to about 40 C.
- an Ni-Sn alloy layer is deposited on a substrate from a particular electroless plating bath in accordance with a method therefor.
- the bath comprises an aqueous solution having therein about 0.1 mole Ni cations,
- the method with this bath comprises the steps of immersing a substrate in the bath,
- an Ni-Mo alloy layer is deposited on a substrate from another particular plating bath in accordance with a. method therefor.
- the bath comprises an aqueous solution having therein about 0.1 mole of Ni cations,
- M00 anions in relationship to said Ni cations such that the value of the ratio Mo/Ni is in the range of about 1 to about 5,
- the method with this bath comprises the steps of immersing a substrate in the bath,
- a stock solution A is prepared by preparing a nickel salt solution containing approximately 0.5 mole of the nickel salt as a source of nickel ions, and containing about 2.5 moles of glycine. For example, 131.5 grams of NiSO -6H O and 187.75 grams of NHgCHgCOOH (glycine) are dissolved in 1 liter of water.
- a second stock solution B is prepared with a tin salt as a source of tin ions. This solution also contains sodium potassium tartrate or other complexing salts such as sodium potassium citrate.
- the solution contains about 0.5 mole of tin salt and about 2 moles of the tartrate obtained by using 150.3 grams/liter of SnCl -4H O and 460 grams/liter of NaK-tartrate.
- Sufficient concentrated solution of KOH is added to bring pH of the stock solution B to about 13.5.
- a third stock solution C is prepared by dissolving from 20.6 grams to 102.5 grams of Na MoO in 1 liter of water for a concentration of from 0.1 mole to 0.5 mole.
- the Ni-Sn plating bath is prepared by admixing solution A and solution B and diluting the resultant solution and adding sodium hypophosphite (NaH PO such that the bath contains nickel ions in the range of about 0.1 mole, tin ions from about 0.1 mole to about 0.4 mole, about 0.2 mole of sodium hypophosphite, about 0.5 mole of glycine and from about 0.4 to about 1.6 moles of sodium potassium tartrate.
- the pH is adjusted so that it is about 13.5.
- the Ni-Mo plating bath is prepared by admixing stock solution A and stock solution C and diluting the resultant solution such that it contains about 0.1 mole of Ni, molybdate ions in the range of about 0.1 to about 0.5 moles, and about 0.5 mole of glycine. About 0.2 mole of hypophosphite is added to the resultant solution and KOH is added for pH of about 13.5.
- a substrate is immersed in an electroless plating bath of this invention for a time sufiicient to deposit a film of desired thickness.
- the plating bath should be maintained at a temperature of about 20 C. to about 40 C. Optimally, the plating bath temperature is held between about 30 C. to about 40 C.
- nickel ion source has been disclosed as nickel sulphate
- other nickel salts e.g., nickel chloride
- SnCl is disclosed as the source for tin ions
- other water soluble tin salts may similarly be used as a source for the tin ions.
- Potassium molybdate may be used instead of sodium molybdate.
- Stock solution B is prepared by dissolving 150.3 g./l. SnCl -4H O (0.5 mole) and 460 g./l. NaK-tartrate (0.2 mole) in one liter of H 0.
- Sn(OH) Concentrated solution of KOH is then added to establish a pH of 13.5. At first Sn(OH) is formed. However, upon further addition of KOH, Sn(OH) anions, i.e., Sn(OH) are formed. In this form tin can be codeposited with nickel without poisoning the electroless plating bath.
- Stock solution C is prepared by dissolving from 20.6 grams to 102.5 grams of Na MoO in one liter of water with from 0.1 to 0.5 mole concentration.
- Exemplary electroless plating baths for Ni-Sn film of this invention are obtained by adding and diluting stock solutions A and B and the method hereof is practiced as follows:
- the electroless plating bath of this invention for Ni-Mo alloy film is obtained by mixing stock solutions A and C and adding NaH Powith the pH adjusted to about 13.5 with KOH.
- examples of plating baths for NiMo alloy film and the method therefor according to the principles of this invention are as follows:
- An aqueous solution is prepared having therein 0.1 mole of NiSO -6H O, 0.5 mole of NH CH COOH, 0.1 mole of N32M0O4, and 0.2 mole of NaH PO- with the pH adjusted to 13.5 with KOH.
- Ni-Mo alloy film having 1.7% M0 at A./min. when the bath was maintained at temperature of 33 C.
- An exemplary thickness of the film was about 3200 A.
- An aqueous solution is prepared having therein 0.1 mole of NiSO -6H O, 0.5 mole of NH CH COOH, 0.3 mole of Na MoO and 0.2 mole of NaH PO with the pH adjusted to 13.5 with KOH.
- Ni-Mo alloy film having 6.8% M0 at 75 A./min. when the bath was maintained at temperature of 35 C.
- An exemplary thickness of the film was about 2250 A.
- the pH of the plating bath for Ni-Sn or Ni-Mo should have pH about 13.5.
- the temperature should be less than 40 C. and greater than 30 C. However, satisfactory results have been obtained in the temperature range of about 20 C. to about 40 C.
- hydroxide used for establishing the pH of the plating baths hereof has been stated to be KOH, in accordance with the principles of the invention, other strong bases such as NaOI-I may be used alternatively.
- An electroless plating bath for depositing Ni-Sn alloy layer comprising an aqueous solution having therein:
- said bath having a pH of about 13.5.
- An electroless plating bath for depositing an Ni-Sn alloy layer comprising an aqueous solution having therein:
- said bath having a pH of about 13.5.
- An electroless plating bath for depositing an Ni-Sn alloy layer comprising an aqueous solution having therein:
- said bath having a pH of about 13.5.
- An electroless plating bath for depositing an Ni-Sn alloy layer comprising an aqueous solution having therein:
- An electroless plating bath for depositing an Ni-Sn alloy layer comprising an aqueous solution having therein:
- a method for electrolessly depositing an Ni-Sn alloy layer comprising the steps of:
- an electroless plating bath comprising an aqueous solution having therein about 0.1 mole of Ni cations
- Ni-Sn alloy layer contains from about 4.6% Sn to about 11.9% Sn, respectively.
- a method for electrolessly depositing an Ni-Sn alloy layer comprising the steps of immersing a substrate in an electroless plating bath comprising an aqueous solution having therein about 0.1 mole of Ni cations,
- said bath having a pH of about 13.5;
- Ni- Sn alloy layer contains about 4.6% Sn.
- a method for electrolessly depositing an Ni-Sn alloy layer comprising the steps of:
- said bath having a pH of about 13.5;
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US9344470A | 1970-11-27 | 1970-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3674516A true US3674516A (en) | 1972-07-04 |
Family
ID=22238993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US93444A Expired - Lifetime US3674516A (en) | 1970-11-27 | 1970-11-27 | Electroless codeposition of nickel alloys |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3674516A (enExample) |
| CA (1) | CA967705A (enExample) |
| DE (1) | DE2148744A1 (enExample) |
| FR (1) | FR2115164B1 (enExample) |
| GB (1) | GB1314745A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2522939A1 (de) * | 1974-05-24 | 1975-12-04 | Richardson Chemical Co | Nickel enthaltende polymetallische nickellegierungen und hierfuer geeignete plattierungsbaeder |
| US4632857A (en) * | 1974-05-24 | 1986-12-30 | Richardson Chemical Company | Electrolessly plated product having a polymetallic catalytic film underlayer |
| US5190796A (en) * | 1991-06-27 | 1993-03-02 | General Electric Company | Method of applying metal coatings on diamond and articles made therefrom |
| US20060278123A1 (en) * | 2003-05-09 | 2006-12-14 | Basf Aktiengesellschaft | Composition for the currentless deposition of ternary materials for use in the semiconductor industry |
| CN102011107A (zh) * | 2010-12-24 | 2011-04-13 | 杭州东方表面技术有限公司 | 可获取高可焊性镀层的化学镀镍磷合金溶液 |
| US20120058259A1 (en) * | 2010-09-03 | 2012-03-08 | Omg Electronic Chemicals, Llc | Electroless nickel alloy plating bath and process for depositing thereof |
-
1970
- 1970-11-27 US US93444A patent/US3674516A/en not_active Expired - Lifetime
-
1971
- 1971-08-18 GB GB3865971A patent/GB1314745A/en not_active Expired
- 1971-09-30 DE DE19712148744 patent/DE2148744A1/de active Pending
- 1971-10-12 FR FR7137574A patent/FR2115164B1/fr not_active Expired
- 1971-11-12 CA CA127,427A patent/CA967705A/en not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2522939A1 (de) * | 1974-05-24 | 1975-12-04 | Richardson Chemical Co | Nickel enthaltende polymetallische nickellegierungen und hierfuer geeignete plattierungsbaeder |
| US4019910A (en) * | 1974-05-24 | 1977-04-26 | The Richardson Chemical Company | Electroless nickel polyalloy plating baths |
| US4632857A (en) * | 1974-05-24 | 1986-12-30 | Richardson Chemical Company | Electrolessly plated product having a polymetallic catalytic film underlayer |
| US5190796A (en) * | 1991-06-27 | 1993-03-02 | General Electric Company | Method of applying metal coatings on diamond and articles made therefrom |
| US20060278123A1 (en) * | 2003-05-09 | 2006-12-14 | Basf Aktiengesellschaft | Composition for the currentless deposition of ternary materials for use in the semiconductor industry |
| US7850770B2 (en) * | 2003-05-09 | 2010-12-14 | Basf Aktiengesellschaft | Compositions for the currentless deposition of ternary materials for use in the semiconductor industry |
| US9062378B2 (en) | 2003-05-09 | 2015-06-23 | Basf Aktiengesellschaft | Compositions for the currentless deposition of ternary materials for use in the semiconductor industry |
| US20120058259A1 (en) * | 2010-09-03 | 2012-03-08 | Omg Electronic Chemicals, Llc | Electroless nickel alloy plating bath and process for depositing thereof |
| US8585811B2 (en) * | 2010-09-03 | 2013-11-19 | Omg Electronic Chemicals, Llc | Electroless nickel alloy plating bath and process for depositing thereof |
| CN102011107A (zh) * | 2010-12-24 | 2011-04-13 | 杭州东方表面技术有限公司 | 可获取高可焊性镀层的化学镀镍磷合金溶液 |
| CN102011107B (zh) * | 2010-12-24 | 2012-07-11 | 杭州东方表面技术有限公司 | 可获取高可焊性镀层的化学镀镍磷合金溶液 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2115164B1 (enExample) | 1976-02-13 |
| FR2115164A1 (enExample) | 1972-07-07 |
| GB1314745A (en) | 1973-04-26 |
| CA967705A (en) | 1975-05-20 |
| DE2148744A1 (de) | 1972-06-08 |
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