GB1295964A - - Google Patents

Info

Publication number
GB1295964A
GB1295964A GB1295964DA GB1295964A GB 1295964 A GB1295964 A GB 1295964A GB 1295964D A GB1295964D A GB 1295964DA GB 1295964 A GB1295964 A GB 1295964A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
support
etchant
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1295964A publication Critical patent/GB1295964A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening

Landscapes

  • Dicing (AREA)
  • Weting (AREA)
  • Casings For Electric Apparatus (AREA)
GB1295964D 1969-04-01 1970-03-12 Expired GB1295964A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81218269A 1969-04-01 1969-04-01

Publications (1)

Publication Number Publication Date
GB1295964A true GB1295964A (enExample) 1972-11-08

Family

ID=25208782

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1295964D Expired GB1295964A (enExample) 1969-04-01 1970-03-12

Country Status (8)

Country Link
US (1) US3762973A (enExample)
JP (1) JPS4822014B1 (enExample)
DE (1) DE2014246C3 (enExample)
FR (1) FR2038128B1 (enExample)
GB (1) GB1295964A (enExample)
IE (1) IE34051B1 (enExample)
NL (1) NL7003693A (enExample)
SE (1) SE364141B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7313572A (nl) * 1973-10-03 1975-04-07 Philips Nv Werkwijze voor het etsen van silicium- of ger- mplakken en halfgeleiderinrichtingen ver- igd met toepassing van deze werkwijze.
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
JPS6041478B2 (ja) * 1979-09-10 1985-09-17 富士通株式会社 半導体レ−ザ素子の製造方法
DE3524301A1 (de) * 1985-07-06 1987-01-15 Semikron Gleichrichterbau Verfahren zum herstellen von halbleiterelementen
KR102015336B1 (ko) * 2017-06-12 2019-08-28 삼성전자주식회사 반도체 패키지 기판의 휨 감소 방법 및 휨 감소 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers

Also Published As

Publication number Publication date
US3762973A (en) 1973-10-02
FR2038128A1 (enExample) 1971-01-08
DE2014246A1 (de) 1970-10-08
SE364141B (enExample) 1974-02-11
JPS4822014B1 (enExample) 1973-07-03
IE34051L (en) 1970-10-01
IE34051B1 (en) 1975-01-22
DE2014246B2 (de) 1979-07-12
NL7003693A (enExample) 1970-10-05
FR2038128B1 (enExample) 1974-03-01
DE2014246C3 (de) 1980-03-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee