GB1290800A - - Google Patents
Info
- Publication number
- GB1290800A GB1290800A GB1290800DA GB1290800A GB 1290800 A GB1290800 A GB 1290800A GB 1290800D A GB1290800D A GB 1290800DA GB 1290800 A GB1290800 A GB 1290800A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ground plate
- plates
- ground
- contact pad
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 244000309464 bull Species 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7001494A FR2076471A5 (enrdf_load_stackoverflow) | 1970-01-16 | 1970-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1290800A true GB1290800A (enrdf_load_stackoverflow) | 1972-09-27 |
Family
ID=9049118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1290800D Expired GB1290800A (enrdf_load_stackoverflow) | 1970-01-16 | 1971-01-06 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2101179A1 (enrdf_load_stackoverflow) |
FR (1) | FR2076471A5 (enrdf_load_stackoverflow) |
GB (1) | GB1290800A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4703288A (en) * | 1985-04-03 | 1987-10-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection lines for wafer-scale-integrated assemblies |
WO2003015484A1 (en) * | 2001-08-03 | 2003-02-20 | Sandisk Corporation | Card manufacturing technique and resulting card |
EP2519086A1 (en) * | 2011-04-26 | 2012-10-31 | Tyco Electronics Belgium EC BVBA | High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1287186C (en) * | 1986-10-24 | 1991-07-30 | Daiichi Denshi Kogyo Kabushiki Kaisha | Ic card and connector therefor |
DE3925157A1 (de) * | 1989-07-28 | 1991-02-07 | Siemens Ag | Steckverbinder fuer leiterplatten |
-
1970
- 1970-01-16 FR FR7001494A patent/FR2076471A5/fr not_active Expired
-
1971
- 1971-01-06 GB GB1290800D patent/GB1290800A/en not_active Expired
- 1971-01-12 DE DE19712101179 patent/DE2101179A1/de active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4703288A (en) * | 1985-04-03 | 1987-10-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection lines for wafer-scale-integrated assemblies |
WO2003015484A1 (en) * | 2001-08-03 | 2003-02-20 | Sandisk Corporation | Card manufacturing technique and resulting card |
US6597061B1 (en) | 2001-08-03 | 2003-07-22 | Sandisk Corporation | Card manufacturing technique and resulting card |
US7022547B2 (en) | 2001-08-03 | 2006-04-04 | Sandisk Corporation | Card manufacturing technique and resulting card |
US7169640B2 (en) | 2001-08-03 | 2007-01-30 | Sandisk Corporation | Card manufacturing technique and resulting card |
EP2519086A1 (en) * | 2011-04-26 | 2012-10-31 | Tyco Electronics Belgium EC BVBA | High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk |
WO2012146562A1 (en) * | 2011-04-26 | 2012-11-01 | Tyco Electronics Belgium Ec Bvba | High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk |
CN103548214A (zh) * | 2011-04-26 | 2014-01-29 | 泰科电子比利时公司 | 高速输入/输出连接接口元件、线缆组件和串扰减小的互连系统 |
EP2701471A1 (en) * | 2011-04-26 | 2014-02-26 | Tyco Electronics Belgium EC BVBA | High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk |
US9124037B2 (en) | 2011-04-26 | 2015-09-01 | Te Connectivity Nederland Bv | High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk |
CN103548214B (zh) * | 2011-04-26 | 2016-08-17 | 泰科电子比利时公司 | 高速输入/输出连接接口元件、线缆组件和串扰减小的互连系统 |
Also Published As
Publication number | Publication date |
---|---|
DE2101179A1 (de) | 1971-07-22 |
FR2076471A5 (enrdf_load_stackoverflow) | 1971-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |