GB1290800A - Improvements in or relating to printed circuit members - Google Patents

Improvements in or relating to printed circuit members

Info

Publication number
GB1290800A
GB1290800A GB1290800DA GB1290800A GB 1290800 A GB1290800 A GB 1290800A GB 1290800D A GB1290800D A GB 1290800DA GB 1290800 A GB1290800 A GB 1290800A
Authority
GB
United Kingdom
Prior art keywords
ground plate
plates
printed circuit
ground
contact pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SAS
Original Assignee
Societe Industrielle Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Industrielle Honeywell Bull filed Critical Societe Industrielle Honeywell Bull
Publication of GB1290800A publication Critical patent/GB1290800A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
GB1290800D 1970-01-16 1971-01-06 Improvements in or relating to printed circuit members Expired GB1290800A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7001494A FR2076471A5 (enrdf_load_stackoverflow) 1970-01-16 1970-01-16

Publications (1)

Publication Number Publication Date
GB1290800A true GB1290800A (en) 1972-09-27

Family

ID=9049118

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1290800D Expired GB1290800A (en) 1970-01-16 1971-01-06 Improvements in or relating to printed circuit members

Country Status (4)

Country Link
DE (1) DE2101179A1 (enrdf_load_stackoverflow)
FR (1) FR2076471A5 (enrdf_load_stackoverflow)
GB (1) GB1290800A (enrdf_load_stackoverflow)
NL (1) NL7018305A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703288A (en) * 1985-04-03 1987-10-27 American Telephone And Telegraph Company, At&T Bell Laboratories Interconnection lines for wafer-scale-integrated assemblies
WO2003015484A1 (en) * 2001-08-03 2003-02-20 Sandisk Corporation Card manufacturing technique and resulting card
EP2519086A1 (en) * 2011-04-26 2012-10-31 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0265348A3 (en) * 1986-10-24 1989-01-25 Daiichi Denshi Kogyo Kabushiki Kaisha Connector for an IC card
DE3925157A1 (de) * 1989-07-28 1991-02-07 Siemens Ag Steckverbinder fuer leiterplatten

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703288A (en) * 1985-04-03 1987-10-27 American Telephone And Telegraph Company, At&T Bell Laboratories Interconnection lines for wafer-scale-integrated assemblies
WO2003015484A1 (en) * 2001-08-03 2003-02-20 Sandisk Corporation Card manufacturing technique and resulting card
US6597061B1 (en) 2001-08-03 2003-07-22 Sandisk Corporation Card manufacturing technique and resulting card
US7022547B2 (en) 2001-08-03 2006-04-04 Sandisk Corporation Card manufacturing technique and resulting card
US7169640B2 (en) 2001-08-03 2007-01-30 Sandisk Corporation Card manufacturing technique and resulting card
EP2519086A1 (en) * 2011-04-26 2012-10-31 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
WO2012146562A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Belgium Ec Bvba High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
CN103548214A (zh) * 2011-04-26 2014-01-29 泰科电子比利时公司 高速输入/输出连接接口元件、线缆组件和串扰减小的互连系统
EP2701471A1 (en) * 2011-04-26 2014-02-26 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
US9124037B2 (en) 2011-04-26 2015-09-01 Te Connectivity Nederland Bv High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
CN103548214B (zh) * 2011-04-26 2016-08-17 泰科电子比利时公司 高速输入/输出连接接口元件、线缆组件和串扰减小的互连系统

Also Published As

Publication number Publication date
DE2101179A1 (de) 1971-07-22
FR2076471A5 (enrdf_load_stackoverflow) 1971-10-15
NL7018305A (nl) 1971-07-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees