GB1290800A - - Google Patents

Info

Publication number
GB1290800A
GB1290800A GB1290800DA GB1290800A GB 1290800 A GB1290800 A GB 1290800A GB 1290800D A GB1290800D A GB 1290800DA GB 1290800 A GB1290800 A GB 1290800A
Authority
GB
United Kingdom
Prior art keywords
ground plate
plates
ground
contact pad
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1290800A publication Critical patent/GB1290800A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Abstract

1290800 Printed circuits SOC INDUSTRIELLE HONEYWELL BULL 6 Jan 1971 [16 Jan 1970] 706/71 Heading H1R In order to prevent signal reflection at contact pads 9 of a printed circuit, having a metalized ground plate parallel to and separated from the circuits, the ground plate acting as the second part of a transmission line holes 12 are provided in the ground plate such that the margins of ground plate conductor corresponding to a particular contact pad have a total equivalent width to that of the printed circuit strip 7 thus ensuring that the impedance per unit length of the pad will be that of the circuit line. Fig. 2 (section II-II of Fig. 1) shows apertured ground plates 3, 4 formed either side an insulating substrate 1. Further insulating boards 6, 5 carrying printed circuits 7 and contact pads 9, 10, are bonded to the ground plates after rectangules 12, 13 have been removed by photoetching such that the contact pad is positioned directly above the "etched" area in the ground plate. The rectangle may be the length of the contact pad and the printed circuits may be formed after bonding sheets 5, 6 to the "plates". The conductors may be superposed layers of copper, nickel and gold and the metallic layer may be vacuum evaporated on to insulating substrate 1.
GB1290800D 1970-01-16 1971-01-06 Expired GB1290800A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7001494A FR2076471A5 (en) 1970-01-16 1970-01-16

Publications (1)

Publication Number Publication Date
GB1290800A true GB1290800A (en) 1972-09-27

Family

ID=9049118

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1290800D Expired GB1290800A (en) 1970-01-16 1971-01-06

Country Status (3)

Country Link
DE (1) DE2101179A1 (en)
FR (1) FR2076471A5 (en)
GB (1) GB1290800A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703288A (en) * 1985-04-03 1987-10-27 American Telephone And Telegraph Company, At&T Bell Laboratories Interconnection lines for wafer-scale-integrated assemblies
WO2003015484A1 (en) * 2001-08-03 2003-02-20 Sandisk Corporation Card manufacturing technique and resulting card
EP2519086A1 (en) * 2011-04-26 2012-10-31 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1287186C (en) * 1986-10-24 1991-07-30 Daiichi Denshi Kogyo Kabushiki Kaisha Ic card and connector therefor
DE3925157A1 (en) * 1989-07-28 1991-02-07 Siemens Ag CONNECTORS FOR PCB

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703288A (en) * 1985-04-03 1987-10-27 American Telephone And Telegraph Company, At&T Bell Laboratories Interconnection lines for wafer-scale-integrated assemblies
WO2003015484A1 (en) * 2001-08-03 2003-02-20 Sandisk Corporation Card manufacturing technique and resulting card
US6597061B1 (en) 2001-08-03 2003-07-22 Sandisk Corporation Card manufacturing technique and resulting card
US7022547B2 (en) 2001-08-03 2006-04-04 Sandisk Corporation Card manufacturing technique and resulting card
US7169640B2 (en) 2001-08-03 2007-01-30 Sandisk Corporation Card manufacturing technique and resulting card
EP2519086A1 (en) * 2011-04-26 2012-10-31 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
WO2012146562A1 (en) * 2011-04-26 2012-11-01 Tyco Electronics Belgium Ec Bvba High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
CN103548214A (en) * 2011-04-26 2014-01-29 泰科电子比利时公司 High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
EP2701471A1 (en) * 2011-04-26 2014-02-26 Tyco Electronics Belgium EC BVBA High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
US9124037B2 (en) 2011-04-26 2015-09-01 Te Connectivity Nederland Bv High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
CN103548214B (en) * 2011-04-26 2016-08-17 泰科电子比利时公司 High speed input/output connects the interconnection system that interface element, cable-assembly and crosstalk reduce

Also Published As

Publication number Publication date
FR2076471A5 (en) 1971-10-15
DE2101179A1 (en) 1971-07-22

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees