GB1289376A - - Google Patents

Info

Publication number
GB1289376A
GB1289376A GB1289376DA GB1289376A GB 1289376 A GB1289376 A GB 1289376A GB 1289376D A GB1289376D A GB 1289376DA GB 1289376 A GB1289376 A GB 1289376A
Authority
GB
United Kingdom
Prior art keywords
thermosetting
thermosetting material
overcoating
transistor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1289376A publication Critical patent/GB1289376A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB1289376D 1969-08-21 1970-07-22 Expired GB1289376A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86258269A 1969-08-21 1969-08-21

Publications (1)

Publication Number Publication Date
GB1289376A true GB1289376A (enExample) 1972-09-20

Family

ID=25338800

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1289376D Expired GB1289376A (enExample) 1969-08-21 1970-07-22

Country Status (6)

Country Link
US (1) US3693252A (enExample)
JP (1) JPS5019434B1 (enExample)
DE (1) DE2032082A1 (enExample)
ES (1) ES382963A1 (enExample)
FR (1) FR2060618A5 (enExample)
GB (1) GB1289376A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3931454A (en) * 1972-10-17 1976-01-06 Westinghouse Electric Corporation Printed circuit board and method of preparing it
GB1461768A (en) * 1973-03-13 1977-01-19 Lucas Industries Ltd Mounting electrical components on thick film printed circuit elements
US3947953A (en) * 1974-08-23 1976-04-06 Nitto Electric Industrial Co., Ltd. Method of making plastic sealed cavity molded type semi-conductor devices
US3973321A (en) * 1974-09-10 1976-08-10 The Anaconda Company Method of preparing circuit boards comprising inductors
US3976906A (en) * 1975-06-09 1976-08-24 Litton Systems, Inc. Programmable character display module
JPS5278243A (en) * 1975-12-25 1977-07-01 Sumitomo Durez Co Method of coating electric parts or electronic parts
DE2751517C2 (de) * 1977-11-18 1983-10-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Oberflächenpassiviertes Halbleiterbauelement mit einer Halbleiterscheibe und Verfahren zur Herstellung desselben
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4426774A (en) 1980-04-07 1984-01-24 Cts Corporation Process for producing a circuit module
US4289722A (en) * 1980-07-28 1981-09-15 General Motors Corporation Method of potting magnetic speed pickups
DE3150337C1 (de) * 1981-01-26 1982-11-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung eines mit einer Schutzschicht überzogenen Substrats
US4499333A (en) * 1983-03-28 1985-02-12 Printed Circuits International, Inc. Electronic component cap and seal
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
US4721453A (en) * 1986-03-05 1988-01-26 Gte Communication Systems Corporation Apparatus for encapsulating semiconductors
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US5030796A (en) * 1989-08-11 1991-07-09 Rockwell International Corporation Reverse-engineering resistant encapsulant for microelectric device
US5300459A (en) * 1989-12-28 1994-04-05 Sanken Electric Co., Ltd. Method for reducing thermal stress in an encapsulated integrated circuit package
JPH05144875A (ja) * 1991-11-18 1993-06-11 Sharp Corp 配線基板の実装方法
US5350594A (en) * 1993-01-25 1994-09-27 Tech Spray, Inc. Conformally coated faraday cage
US6675755B2 (en) * 2000-04-06 2004-01-13 Visteon Global Technologies, Inc. Integrated powertrain control system for large engines
US20080259580A1 (en) * 2007-04-20 2008-10-23 Stillabower Morris D Method for mounting leaded component to substrate
US8115304B1 (en) 2008-02-06 2012-02-14 Xilinx, Inc. Method of implementing a discrete element in an integrated circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2943359A (en) * 1957-04-10 1960-07-05 Joseph Waldman & Sons Method of encapsulating electronic components or other elements
US3138771A (en) * 1961-12-12 1964-06-23 Nytronics Inc Meltable plastic spacer for securing coil to tubular support and housing, and methodof assembly
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3374536A (en) * 1964-10-29 1968-03-26 Sprague Electric Co Incapsulation of electrical units
US3501832A (en) * 1966-02-26 1970-03-24 Sony Corp Method of making electrical wiring and wiring connections for electrical components
US3429981A (en) * 1967-04-12 1969-02-25 Dexter Corp Supporting and insulating means for junctured elements of small electrical components
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits

Also Published As

Publication number Publication date
DE2032082A1 (de) 1971-02-25
FR2060618A5 (enExample) 1971-06-18
US3693252A (en) 1972-09-26
JPS5019434B1 (enExample) 1975-07-07
ES382963A1 (es) 1972-12-16

Similar Documents

Publication Publication Date Title
GB1289376A (enExample)
EP0019947B1 (en) Process for the manufacture of objects from thermosetting resin
ES466432A1 (es) Un metodo de recubrimiento de un sustrato.
BR7906300A (pt) Composicao de resina termoplastica aperfeicoada e processo para melhorar a adesao entre uma resina termoplastica e um substrato de oxido inorganico
ES373467A2 (es) Procedimiento para mejorar la adhesividad de materiales de resina de polimero.
GB1341899A (en) Method of applying a coating to a steel part
GB2013132A (en) Process for the Partial Coating of Plastics Mouldings Produced by Injection Moulding
JPS5632736A (en) Sealing method of hybrid integrated circuit device
GB910297A (en) Coil coating method
GB952212A (en) Method of covering golf balls
GB862784A (en) Improvements in or relating to ornamental stones
JPS5724542A (en) Preparation of resin sealed type semiconductor device
JPS57152157A (en) Semiconductor device
GB805546A (en) Improvements in or relating to synthetic resinous material surfaced with metal
JPS62147427A (ja) 液晶表示素子の製造方法
GB832778A (en) Improvements in or relating to electrically heated de-icing or anti-freezing apparatus
GB998233A (en) Improvements in or relating to method for making superconductive niobium-tin wire and wire made thereby
JPS54163394A (en) Method of manufacturing epoxy resin injection article
JPS61113242A (ja) 電子部品の封止方法
JPS55140249A (en) Semiconductor device
JPS54139003A (en) Shaping method of stator coil end
FR2171433A1 (en) Encapsulated electrical components - by coating component with thermoplastic adhesive before encapsulation
GB1082331A (en) Improvements in or relating to methods of enveloping electrical components
FR2147551A5 (en) Transparent measuring tape coating - of thermoplastic material
GB1316154A (en) Magnetic head assemblies

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PCNP Patent ceased through non-payment of renewal fee