GB1082331A - Improvements in or relating to methods of enveloping electrical components - Google Patents

Improvements in or relating to methods of enveloping electrical components

Info

Publication number
GB1082331A
GB1082331A GB678166A GB678166A GB1082331A GB 1082331 A GB1082331 A GB 1082331A GB 678166 A GB678166 A GB 678166A GB 678166 A GB678166 A GB 678166A GB 1082331 A GB1082331 A GB 1082331A
Authority
GB
United Kingdom
Prior art keywords
powder
heating
substance
liquid
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB678166A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1082331A publication Critical patent/GB1082331A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/28—Counterweights, i.e. additional weights counterbalancing inertia forces induced by the reciprocating movement of masses in the system, e.g. of pistons attached to an engine crankshaft; Attaching or mounting same
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H51/00—Levers of gearing mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermistors And Varistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

1,082,331. Electric solid - state devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. Feb. 16, 1966 [Feb. 19, 1965], No. 6781/66. Heading H1K. To envelope an electrical component in a protective coating a suitable substance in powder or liquid form is applied to the surface of the component and the latter is then heated by passing current through it. The liquid may be a solution which dries out on heating; the powder may be a fusible or sinterable substance; the powder or the liquid may be a heathardenable resin. In the case of heat-hardenable substances heating to cause the substance to adhere to the component may be followed by heating at a different temperature to effect hardening. This second heating stage may, but need not, also be effected by current passage through the device: it may also be combined with a continuous-operation test. In Figs. 1 and 2 (not shown) semi-conductor diodes are carried along a production line in which they are dipped in an epoxy resin and hardener mixture in powder form, heated by current passage during and after dipping, moved past blowers which remove excess powder, and and then subjected to a currentvoltage characteristic test. This process may be adapted for semi-conductor devices with more than two electrodes.
GB678166A 1965-02-19 1966-02-16 Improvements in or relating to methods of enveloping electrical components Expired GB1082331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP0036106 1965-02-19

Publications (1)

Publication Number Publication Date
GB1082331A true GB1082331A (en) 1967-09-06

Family

ID=7374567

Family Applications (1)

Application Number Title Priority Date Filing Date
GB678166A Expired GB1082331A (en) 1965-02-19 1966-02-16 Improvements in or relating to methods of enveloping electrical components

Country Status (5)

Country Link
BE (1) BE676665A (en)
CH (1) CH444317A (en)
DE (1) DE1571114A1 (en)
GB (1) GB1082331A (en)
NL (1) NL6601892A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9865373B2 (en) * 2015-02-25 2018-01-09 Te Connectivity Corporation Electrical wire with conductive particles

Also Published As

Publication number Publication date
NL6601892A (en) 1966-08-22
BE676665A (en) 1966-08-17
CH444317A (en) 1967-09-30
DE1571114A1 (en) 1970-11-26

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