FR2060618A5 - - Google Patents
Info
- Publication number
- FR2060618A5 FR2060618A5 FR7029825A FR7029825A FR2060618A5 FR 2060618 A5 FR2060618 A5 FR 2060618A5 FR 7029825 A FR7029825 A FR 7029825A FR 7029825 A FR7029825 A FR 7029825A FR 2060618 A5 FR2060618 A5 FR 2060618A5
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86258269A | 1969-08-21 | 1969-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2060618A5 true FR2060618A5 (fr) | 1971-06-18 |
Family
ID=25338800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7029825A Expired FR2060618A5 (fr) | 1969-08-21 | 1970-08-13 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3693252A (fr) |
JP (1) | JPS5019434B1 (fr) |
DE (1) | DE2032082A1 (fr) |
ES (1) | ES382963A1 (fr) |
FR (1) | FR2060618A5 (fr) |
GB (1) | GB1289376A (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US3931454A (en) * | 1972-10-17 | 1976-01-06 | Westinghouse Electric Corporation | Printed circuit board and method of preparing it |
GB1461768A (en) * | 1973-03-13 | 1977-01-19 | Lucas Industries Ltd | Mounting electrical components on thick film printed circuit elements |
US3947953A (en) * | 1974-08-23 | 1976-04-06 | Nitto Electric Industrial Co., Ltd. | Method of making plastic sealed cavity molded type semi-conductor devices |
US3973321A (en) * | 1974-09-10 | 1976-08-10 | The Anaconda Company | Method of preparing circuit boards comprising inductors |
US3976906A (en) * | 1975-06-09 | 1976-08-24 | Litton Systems, Inc. | Programmable character display module |
JPS5278243A (en) * | 1975-12-25 | 1977-07-01 | Sumitomo Durez Co | Method of coating electric parts or electronic parts |
DE2751517C2 (de) * | 1977-11-18 | 1983-10-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Oberflächenpassiviertes Halbleiterbauelement mit einer Halbleiterscheibe und Verfahren zur Herstellung desselben |
US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
US4289722A (en) * | 1980-07-28 | 1981-09-15 | General Motors Corporation | Method of potting magnetic speed pickups |
DE3150337C1 (de) * | 1981-01-26 | 1982-11-04 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines mit einer Schutzschicht überzogenen Substrats |
US4499333A (en) * | 1983-03-28 | 1985-02-12 | Printed Circuits International, Inc. | Electronic component cap and seal |
US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
EP0157938A3 (fr) * | 1984-03-23 | 1987-05-13 | Siemens Aktiengesellschaft | Boítier pour composants électriques |
US4721453A (en) * | 1986-03-05 | 1988-01-26 | Gte Communication Systems Corporation | Apparatus for encapsulating semiconductors |
US4814943A (en) * | 1986-06-04 | 1989-03-21 | Oki Electric Industry Co., Ltd. | Printed circuit devices using thermoplastic resin cover plate |
US5030796A (en) * | 1989-08-11 | 1991-07-09 | Rockwell International Corporation | Reverse-engineering resistant encapsulant for microelectric device |
US5300459A (en) * | 1989-12-28 | 1994-04-05 | Sanken Electric Co., Ltd. | Method for reducing thermal stress in an encapsulated integrated circuit package |
JPH05144875A (ja) * | 1991-11-18 | 1993-06-11 | Sharp Corp | 配線基板の実装方法 |
US5350594A (en) * | 1993-01-25 | 1994-09-27 | Tech Spray, Inc. | Conformally coated faraday cage |
US6675755B2 (en) * | 2000-04-06 | 2004-01-13 | Visteon Global Technologies, Inc. | Integrated powertrain control system for large engines |
US20080259580A1 (en) * | 2007-04-20 | 2008-10-23 | Stillabower Morris D | Method for mounting leaded component to substrate |
US8115304B1 (en) | 2008-02-06 | 2012-02-14 | Xilinx, Inc. | Method of implementing a discrete element in an integrated circuit |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2943359A (en) * | 1957-04-10 | 1960-07-05 | Joseph Waldman & Sons | Method of encapsulating electronic components or other elements |
US3138771A (en) * | 1961-12-12 | 1964-06-23 | Nytronics Inc | Meltable plastic spacer for securing coil to tubular support and housing, and methodof assembly |
DE1514273B2 (de) * | 1964-08-21 | 1974-08-22 | Nippon Electric Co., Ltd., Tokio | Halbleiteranordmng |
US3374536A (en) * | 1964-10-29 | 1968-03-26 | Sprague Electric Co | Incapsulation of electrical units |
US3501832A (en) * | 1966-02-26 | 1970-03-24 | Sony Corp | Method of making electrical wiring and wiring connections for electrical components |
US3429981A (en) * | 1967-04-12 | 1969-02-25 | Dexter Corp | Supporting and insulating means for junctured elements of small electrical components |
US3469148A (en) * | 1967-11-08 | 1969-09-23 | Gen Motors Corp | Protectively covered hybrid microcircuits |
-
1969
- 1969-08-21 US US3693252D patent/US3693252A/en not_active Expired - Lifetime
-
1970
- 1970-05-25 JP JP4475970A patent/JPS5019434B1/ja active Pending
- 1970-06-29 DE DE19702032082 patent/DE2032082A1/de active Pending
- 1970-07-22 GB GB1289376D patent/GB1289376A/en not_active Expired
- 1970-08-13 FR FR7029825A patent/FR2060618A5/fr not_active Expired
- 1970-08-21 ES ES382963A patent/ES382963A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2032082A1 (de) | 1971-02-25 |
ES382963A1 (es) | 1972-12-16 |
US3693252A (en) | 1972-09-26 |
JPS5019434B1 (fr) | 1975-07-07 |
GB1289376A (fr) | 1972-09-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |